IP Library Granted Patent US 7,465,956
Granted Patent B1
US 7,465,956 · App. 11/251,999 · Granted Dec 16, 2008

Stacked organic memory devices and methods of operating and fabricating

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Quick Facts
Patent No.
US 7,465,956
App. No.
11/251,999
Granted
Dec 16, 2008
Kind
B1
Abstract

The present invention provides a multi-layer organic memory device that can operate as a non-volatile memory device having a plurality of stacked and/or parallel memory structures constructed therein. A multi-cell and multi-layer organic memory component can be formed with two or more electrodes having a selectively conductive media between the electrodes forming individual cells, while utilizing a partitioning component to enable stacking of additional memory cells on top of or in association with previously formed cells. Memory stacks can be formed by adding additional layers—respective layers separated by additional partitioning components, wherein multiple stacks can be formed in parallel to provide a high-density memory device.

Claims (20)

1. An organic memory device comprising:

at least a first organic memory cell and a second organic memory cell arranged in a vertical manner with respect to each other, the at least first organic memory cell and a second organic memory cell comprising:

a first electrode;

an organic material formed on the first electrode;

a second electrode formed on the organic material; and

at least one partition component to isolate the first and second organic memory cells, the at least one partition component facilitates access to at least one of the first organic memory cell and the second organic memory cell by being biased in a forward direction.

2. The device of claim 1 , the memory cell further comprising a conductivity facilitating passive material to aid interaction with the organic material.

3. The device of claim 2 , the passive material comprises one or more of copper sulfide, copper oxide, manganese oxide, titanium dioxide, indium oxide, silver sulfide, silver-copper-sulfide complex, gold sulfide, cerium sulfate, ammonium persulfate, iron oxide, lithium complexes, and palladium hydride.

4. The device of claim 1 , the partition component comprises at least one of a diode, a thin-filmed diode (TFD), a zener diode, a light emitting diode (LED), a transistor, a thin-filmed transistor (TFT), a silicon controlled rectifier (SCR), a uni junction transistor (UJT), and a field effect transistor (FET).

5. The device of claim 1 , the memory cell further includes an antireflective coating (ARC).

6. The device of claim 1 , comprising a plurality of the memory cells stacked vertically.

7. The device of claim 6 , comprising a plurality of vertical stacks of memory cells.

8. A system for organic memory cell fabrication comprising:

means for forming at least a first organic memory cell and a second organic memory cell arranged in a vertical manner with respect to each other comprising;

means for forming organic material over a first electrode;

means for layering a second electrode over the organic material; and

means for forming at least one partition component that isolates the first and second organic memory cells, the at least one partition component facilitates access to at least one of the first organic memory cell and the second organic memory cell by being biased in a forward direction.

9. The system of claim 8 , further comprising a means for forming the first electrode.

10. The system of claim 8 , further comprising a means for forming a passive layer on top of the first electrode to facilitate access to the organic material.

11. The system of claim 8 , further comprising a means for forming a plurality of memory cells on a single device.

Assignments (10)
CORRECTIVE ASSIGNMENT TO CORRECT THE 8647899 PREVIOUSLY RECORDED ON REEL 035240 FRAME 0429. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTERST. Recorded Nov 3, 2020
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 058002/0470 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 14, 2016
From: CYPRESS SEMICONDUCTOR CORPORATION
To: MONTEREY RESEARCH, LLC
Reel/Frame 040911/0238 →
PARTIAL RELEASE OF SECURITY INTEREST IN PATENTS Recorded Aug 11, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
Reel/Frame 039708/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 1, 2015
From: SPANSION, LLC
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 036044/0745 →
SECURITY INTEREST Recorded Mar 21, 2015
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 035240/0429 →
RELEASE OF SECURITY INTEREST Recorded Mar 13, 2015
From: BARCLAYS BANK PLC
To: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY LLC
Reel/Frame 035201/0159 →
SECURITY AGREEMENT Recorded Jun 4, 2010
From: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY INC.; SPANSION TECHNOLOGY LLC
To: BARCLAYS BANK PLC
Reel/Frame 024522/0338 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 22, 2007
From: SPANSION INC.
To: SPANSION LLC
Reel/Frame 019052/0748 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 19, 2007
From: ADVANCED MICRO DEVICES, INC.
To: SPANSION INC.
Reel/Frame 019029/0976 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 17, 2005
From: TRIPSAS, NICHOLAS H.; OKOROANYANWU, UZODINMA; PANGRLE, SUZETTE K.; VANBUSKIRK, MICHAEL A.
To: ADVANCED MICRO DEVICES, INC.
Reel/Frame 017117/0978 →