IP Library Granted Patent US 7,216,695
Granted Patent B1
US 7,216,695 · App. 11/255,457 · Granted May 15, 2007

Method of operating a thermal management system

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Quick Facts
Patent No.
US 7,216,695
App. No.
11/255,457
Granted
May 15, 2007
Kind
B1
Abstract

A spray cooling system for extreme environments for providing a desired enclosed environment for electronic devices regardless of external environmental conditions. The spray cooling system for extreme environments includes an enclosure that isolates the electronic components from the external environment, a spray unit within the enclosure for thermally managing one or more electronic devices, a pump unit fluidly connected to the spray unit, a heat exchanger unit fluidly connected to the pump, and a control valve fluidly connected between the heat exchanger unit and the pump. An independent chamber preferably houses a heater unit, a first power supply and a control unit, whereby the heater unit initially heats the coolant within the independent chamber to a minimum operating temperature prior to operation of the electronic components.

Claims (24)

1. A method of operating a thermal management system having a pump unit and a thermal management unit for thermally managing at least one electronic device, said method comprising the steps of:

activating a heater unit if a coolant temperature of a liquid coolant is less than a first temperature; and

activating said pump unit at a first flow rate if said coolant temperature is greater than a second temperature, wherein said second temperature is at least a minimum operating temperature of said pump unit.

2. The method of operating a thermal management system of claim 1 , including the step of increasing said pump unit to a second flow rate if said coolant temperature is greater than a third temperature.

3. A method of operating a thermal management system having at least one electronic control device, a pump unit and a thermal management unit for thermally managing at least one electronic device, said method comprising the steps of:

activating a heater unit if a coolant temperature is less than a first temperature; and

activating said pump unit at a first flow rate if said coolant temperature is greater than a second temperature, wherein said second temperature is at least a minimum operating temperature of said at least one electronic control device.

4. A method of operating a thermal management system having a thermal management unit for thermally managing at least one electronic device, a pump unit fluidly connected to said thermal management unit via a first path and a second path, and a heat exchanger unit fluidly positioned within said second path, said method comprising the steps of:

activating a heater unit if a coolant temperature of a liquid coolant is less than a first temperature; and

activating said pump unit at a first flow rate if said coolant temperature is greater than a second temperature, wherein said second temperature is at least a minimum operating temperature of said pump unit.

5. The method of operating a thermal management system of claim 4 , including the step of reducing the flow rate of coolant through said second path if said coolant temperature is less than a third temperature.

6. The method of operating a thermal management system of claim 4 , including the step of increasing the flow rate of coolant through said second path if said coolant temperature is greater than a third temperature.

7. The method of operating a thermal management system of claim 4 , including the step of increasing said pump unit to a second flow rate if said coolant temperature is greater than a third temperature.

8. A method of operating a thermal management system having at least one electronic control device, a thermal management unit for thermally managing at least one electronic device, a pump unit fluidly connected to said thermal management unit via a first path and a second path, and a heat exchanger unit fluidly positioned within said second path, said method comprising the steps of:

activating a heater unit if a coolant temperature of a liquid coolant is less than a first temperature; and

activating said pump unit at a first flow rate if said coolant temperature is greater than a temperature, wherein said second temperature is at least a minimum operating temperature of said at least one electronic device.

9. The method of operating a thermal management system of claim 8 , including the step of reducing the flow rate of coolant through said second path if said coolant temperature is less than a third temperature.

10. The method of operating a thermal management system of claim 8 , including the step of increasing the flow rate of coolant through said second path if said coolant temperature is greater than a third temperature.

11. The method of operating a thermal management system of claim 8 , including the step of increasing said pump unit to a second flow rate if said coolant temperature is greater than a third temperature.

12. A method of operating a thermal management system having at least one electronic control device, a thermal management unit for thermally managing at least one electronic device, and a pump unit fluidly connected to said thermal management unit via a first path and a second path, said method comprising the steps of:

activating said pump unit at a first flow rate if a coolant temperature of a liquid coolant is greater than a first temperature, wherein said first temperature is at least a minimum operating temperature of said pump unit or said at least one electronic control device;

reducing the flow rate of coolant through said second path if said coolant temperature is less than a second temperature; and

increasing the flow rate of coolant through said second path if said coolant temperature is greater than a third temperature.

13. The method of operating a thermal management system of claim 12 , including the step of increasing said pump unit to a second flow rate if said coolant temperature is greater than a fourth temperature.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 27, 2010
From: ISOTHERMAL SYSTEMS RESEARCH, INC.
To: PARKER INTANGIBLES LLC
Reel/Frame 024294/0473 →
RELEASE Recorded Mar 5, 2010
From: SILICON VALLEY BANK
To: ISOTHERMAL SYSTEMS RESEARCH INC.
Reel/Frame 024035/0511 →
SECURITY AGREEMENT Recorded Aug 24, 2007
From: ISOTHERMAL SYSTEMS RESEARCH, INC.
To: SILICON VALLEY BANK
Reel/Frame 019733/0853 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 7, 2005
From: MILLER, DOUGLAS W.; GUSTAFSON, WILLIAM C.; BEASLEY, WILLIAM J.; TURNER, CHESTER L.; TILTON, CHARLES L.
To: ISOTHERMAL SYSTEMS RESEARCH, INC.
Reel/Frame 016864/0661 →