IP Library Granted Patent US 7,491,594
Granted Patent B2
US 7,491,594 · App. 11/258,987 · Granted Feb 17, 2009

Methods of generating planar double gate transistor shapes

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Quick Facts
Patent No.
US 7,491,594
App. No.
11/258,987
Granted
Feb 17, 2009
Kind
B2
Abstract

A method of automatically generating planar double gate transistor shapes can include taking an integrated circuit layout design that includes single gate transistors, locating the gate shapes and active shapes for the transistors, generating top gate shapes, planar double gate active shapes, bottom gate shapes, active cavity shapes, source/drain cavity shapes, and top gate contact shapes, bottom gate contact shapes, thru-gate contact shapes, and source/drain contact shapes for the planar double gate transistors. The method can generate gate contact shapes that have top and bottom gates to be electrically connected within the same planar double gate transistor or separate gate contact shapes where the top and bottom gates are not electrically connected to each other. In one embodiment, a data processing system can include a program that has code in the form of instructions to carry out the method.

Claims (62)

1. A method of generating a planar double gate transistor shape comprising:

locating a single gate transistor shape; and

automatically generating the planar double gate transistor shape that includes a first gate shape, a planar double gate active shape, and a second gate shape, wherein the first gate shape is designed to overlie the planar double gate transistor shape, and the second gate shape is designed to underlie an entire width of a planar double gate active shape.

2. The method of claim 1 , wherein locating the single gate transistor shape comprises locating a set of layout layers associated with the single gate transistor shape.

3. The method of claim 2 , wherein locating a set of layout layers comprises locating a layer from the set of layers, wherein the set of layers includes any combination of a gate layout layer, an active layout layer, an implantation layout layer, a contact layout layer, a via layout layer, a metal layout layer; an interconnection layout layer, a well layout layer, and a passivation layout layer.

4. The method of claim 1 , wherein locating the single gate transistor shape further comprises:

locating a gate shape associated with a single gate transistor shape; and

locating an active shape associated with the single gate transistor shape.

5. The method of claim 4 , wherein locating the gate shape of the single gate transistor shape comprises:

determining the gate shape horn a gate layout layer of a single gate integrated circuit layout, an active layout layer of the single gate integrated circuit layout, or any combination thereof; and

wherein locating the active shape of the single gate transistor shape comprises:

determining an active shape from a gate layout layer of the single gale integrated circuit layout, an active layout layer of the single gate integrated circuit layout, or any combination thereof.

6. The method of claim 1 , wherein automatically generating the planar double gate transistor shape comprises generating the first gate shape at least in part from the gate shape of the single gate transistor shape.

7. The method of claim 6 , wherein automatically generating the first gate shape further comprises adjusting the first gate shape based at least in part on a design specification, a design constraint, the planar double gate active shape, or any combination thereof.

8. The method of claim 1 , wherein automatically generating the planar double gate transistor shape comprises generating the planar double gate active shape at least in part from the active shape of the single gate transistor shape.

9. The method of claim 8 , wherein automatically generating the planar double gate active shape further comprises adjusting the planar double gate active shape based at least in part on a design specification, a design constraint, or any combination thereof.

10. The method of claim 1 , wherein automatically generating the planar double gate transistor shape further comprises generating the second gate shape at least in part from the first gate shape.

11. The method of claim 10 , wherein automatically generating the second gate shape further comprises adjusting the second gate shape based at least in part on a design specification, a design constraint, the planar double gate active shape, or any combination thereof.

12. The method of claim 11 , wherein automatically generating the planar double gate transistor shape further comprises:

generating a resistor shape, a capacitor electrode, an analog circuit component shape, or any combination thereof at a same layout layer as the first gate shape, the second gate shape, or the planar double gate active shape; and

adjusting the resistor shape, the capacitor electrode, the analog circuit component shape, or any combination thereof based at least in pail on a design specification, a design constraint, or any combination thereof.

13. The method of claim 1 , wherein automatically generating the planar double gate transistor shape fluffier comprises:

generating an active cavity shape; and

adjusting the active cavity shape based at least in part on a design specification, a design constraint, the planar double gate active shape, the source/drain cavity shape, or any combination thereof.

14. The method of claim 1 , wherein automatically generating the planar double gate transistor shape further comprises:

generating source/drain cavity shapes; and

adjusting the planar double gate source/drain cavity shapes based at least in part on a design specification, a design constraint, the planar double gate active shape, the active cavity shape, or any combination thereof.

15. The method of claim 1 , wherein automatically generating the planar double gate transistor shape further comprises:

generating a first gate contact shape to the first gate shape, a second gate contact shape to the second gate shape, or both at least in part from a gate contact, a well contact or a substrate contact of the single gate transistor shape; and

adjusting the first gate contact shape, the second gate contact shape, or both based at least in part on a design specification, a design constraint, the planar double gate active shape or any combination thereof.

16. The method of claim 1 , wherein automatically generating the planar double gate transistor shape further comprises:

generating a second gate contact shape to the second gate shape at least in part from the well contact, a substrate contact, or both of the single gate transistor shape; and

adjusting the second gate contact based at least in part on a design specification, a design constraint, the planar double gate active shape or any combination thereof,

wherein the first gate shape is not electrically connected to the second gate shape.

17. The method of claim 1 , further comprising fabricating the electronic device at least in part using the first planar double gate transistor shape.

18. The method of claim 1 , wherein:

locating the single gate transistor shape comprises:

determining the gate shape from a gate layout layer of a single gate integrated circuit layout, an active layout layer of the single gate integrated circuit layout, or any combination thereof; and

determining an active shape from a gate layout layer of the single gate integrated circuit layout, an active layout layer of the single gate integrated circuit layout, or any combination thereof; and

automatically generating the planar double gate transistor shape comprises:

generating an active cavity shape;

adjusting the active cavity shape based at least in part on a design specification, a design constraint, the planar double gate active shape, the source/drain cavity shape, or any combination thereof;

generating source/drain cavity shapes; and

adjusting the planar double gate source/drain cavity shapes based at least in part on a design specification, a design constraint, the planar double gate active shape, the active cavity shape, or any combination thereof.

19. The method of claim 1 , wherein automatically generating the planar double gate transistor shape comprises:

generating the first gate shape at least in part from the gate shape of the single gate transistor shape;

adjusting the first gate shape based at least in part on a design specification, a design constraint, the planar double gate active shape, or any combination thereof;

generating the planar double gate active shape at least in part from the active shape of the single gate transistor shape;

adjusting the planar double gate active shape based at least in part on a design specification, a design constraint, or any combination thereof;

generating the second gate shape at least in part from the first gate shape; and

adjusting the second gate shape based at least in part on a design specification, a design constraint, the planar double gate active shape, or any combination thereof.

20. The method of claim 19 , wherein automatically generating the planar double gate transistor shape further comprises:

generating a resistor shape, a capacitor electrode, an analog circuit component shape, or any combination thereof at a same layout layer as the first gate shape, the second gate shape, or the planar double gate active shape; and

adjusting the resistor shape, the capacitor electrode, the analog circuit component shape, or any combination thereof based at least in part on a design specification, a design constraint, or any combination thereof.

21. A method of automatically generating a planar double gate transistor shape comprising:

locating a gate shape associated with a single gate transistor;

locating an active shape associated with the single gate transistor;

generating the first gate shape at least in part from the gate shape of the single gate transistor;

generating a planar double gate active shape at least in part from the active shape of the single gate transistor;

generating the second gate shape at least in part from the first gate shape and the planar double gate active shape;

generating an active cavity shape at least in part from the planar double gate active shape; and

adjusting the first gate shape, the planar double gate active shape; the second gate shape, the active cavity shape, or any combination thereof based at least in part on a design specification, a design constraint, or any combination thereof.

Assignments (27)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
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CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
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CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE LISTED CHANGE OF NAME SHOULD BE MERGER AND CHANGE PREVIOUSLY RECORDED AT REEL: 040652 FRAME: 0180. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME. Recorded Jan 12, 2017
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
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CHANGE OF NAME Recorded Nov 8, 2016
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 040652/0180 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
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CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
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ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
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ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 12, 2016
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PATENT RELEASE Recorded Dec 21, 2015
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PATENT RELEASE Recorded Dec 21, 2015
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PATENT RELEASE Recorded Dec 21, 2015
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To: FREESCALE SEMICONDUCTOR, INC.
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SECURITY AGREEMENT Recorded Nov 6, 2013
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