Method for forming a semiconductor structure and structure thereof
View Patent ↗Forming a semiconductor structure includes providing a substrate having a strained semiconductor layer overlying an insulating layer, providing a first device region for forming a first plurality of devices having a first conductivity type, providing a second device region for forming a second plurality of devices having a second conductivity type, and thickening the strained semiconductor layer in the second device region so that the strained semiconductor layer in the second device region has less strain that the strained semiconductor layer in the first device region. Alternatively, forming a semiconductor structure includes providing a first region having a first conductivity type, forming an insulating layer overlying at least an active area of the first region, anisotropically etching the insulating layer, and after anisotropically etching the insulating layer, deposing a gate electrode material overlying at least a portion of the insulating layer.
1. A semiconductor structure, comprising:
a first region having a first conductivity type and having a sidewall;
a second region having a second conductivity type, wherein the second conductivity type is different than the first conductivity type;
an active area sidewall spacer adjacent the sidewall of the first region, wherein the active area sidewall spacer comprises an insulating layer;
a gate dielectric overlying at least a portion of the first region and at least a portion of the active area sidewall spacer;
a gate electrode overlying the gate dielectric; and
a second insulating layer, wherein each of the first region, the second region, and the active area sidewall spacer is on and in physical contact with the second insulating layer.
2. A method for forming a semiconductor structure, the method comprising:
providing a first region having a first conductivity type, wherein the first region has a sidewall;
forming an insulating layer overlying at least an active area of the first region and adjacent the sidewall of the first region;
anisotropically etching the insulating layer, wherein the anisotropically etching the insulating layer results in a portion of the insulating layer remaining adjacent the sidewall of the first region; and
after anisotropically etching the insulating layer, depositing a gate dielectric over the portion of the insulating layer and depositing a gate electrode material overlying the gate dielectric.
3. A method as in claim 2 , comprising:
providing a second region having a second conductivity type, wherein the second conductivity type is different than the first conductivity type;
forming the insulating layer overlying the second region; and
removing the insulating layer in the second region.
4. A method as in claim 2 , wherein the portion of the insulating layer provides isolation between the active area and a non-gate portion of the semiconductor structure.
5. A method as in claim 2 , wherein the portion of the insulating layer is characterized as an active area sidewall spacer.
6. A method as in claim 2 , wherein the portion of the insulating layer comprises a plurality of layers.
7. A method as in claim 2 , further comprising:
forming a gate electrode over the first region, wherein the gate electrode comprises a portion of the gate electrode material;
forming a gate sidewall spacer adjacent a sidewall of the gate electrode, wherein the gate sidewall spacer provides isolation between the active area and the gate electrode.
8. A method as in claim 2 , wherein the insulating layer comprises a dielectric material having a dielectric constant equal to or less than silicon oxide.
9. A method as in claim 2 , wherein the insulating layer comprises silicon dioxide.
10. The method of claim 2 , further comprising:
providing a second insulating layer, wherein the provided first region is over the second insulating layer, and wherein the portion of the insulating layer remaining adjacent the sidewall of the first region is over and in physical contact with the second insulating layer.
11. A method as in claim 4 , wherein the non-gate portion of the semiconductor structure comprises a non-gate portion of a transistor.
12. A method for forming a semiconductor device, the method comprising:
providing a first region having a first conductivity type, wherein the first region has a sidewall;
providing a second region having a second conductivity type, wherein the second conductivity type is different than the first conductivity type;
forming an insulating layer overlying at least an active area of the first region and adjacent the sidewall of the first region;
anisotropically etching the insulating layer, wherein the anisotropically etching the insulating layer results in an active area sidewall spacer, wherein the active area sidewall spacer comprises a portion of the insulating layer which remains adjacent the sidewall of the first region; and
completing formation of the semiconductor device, wherein the semiconductor device comprises the active area sidewall spacer, and wherein the completing formation of the semiconductor device comprises forming a gate dielectric over the first region and over the active area sidewall spacer and forming a gate electrode over the gate dielectric.
13. A method as in claim 12 , wherein said step of forming the insulating layer overlying at least the active area of the first region comprises forming the insulating layer overlying the second region; and wherein said method further comprises removing the insulating layer in the second region.
14. A method as in claim 12 , wherein the insulating layer provides isolation between the active area and a non-gate portion of the semiconductor device.
15. A method as in claim 12 , further comprising:
forming a gate sidewall spacer adjacent a sidewall of the gate electrode, wherein the gate sidewall spacer provides isolation between the active area and the gate electrode.
16. A method as in claim 12 , wherein the first conductivity type is n-type, the second conductivity type is p-type, and the active area sidewall spacer is formed in the first region.
17. A method as in claim 12 , wherein the insulating layer comprises a dielectric material having a dielectric constant equal to or less than silicon oxide.
18. A method as in claim 12 , wherein the insulating layer comprises silicon nitride.
19. The method of claim 12 , further comprising:
providing a second insulating layer, wherein the provided first region and the active area sidewall spacer are each over and in physical contact with the second insulating layer.