Stacked-type semiconductor package
View Patent ↗Corresponding parts to a first path portion in a first signal transmission path to a first semiconductor chip are an interconnection member and a second path portion a second signal transmission path to a second semiconductor chip and are not formed on the first tape. An electric length of the second signal transmission path is allowed to be adjusted independently of the first tape, so that the electric length of the second signal transmission path can be easily made equal to or substantially equal to that of the first signal transmission path.
1. A stacked-type semiconductor package comprising:
an external connection terminal;
a first semiconductor chip;
a first tape on which the first semiconductor chip is mounted and which is formed with a common path portion and a first path portion, wherein the common path portion extends from the external connection terminal to a diverging point, and the first path portion extends from the diverging point to the first semiconductor chip;
an interconnection member connected to the diverging point;
a second semiconductor chip;
a second tape on which the second semiconductor chip is mounted and which is formed with a second path portion extending from the interconnection member to the second semiconductor chip, wherein
the first tape comprises a first base which has top and bottom surfaces;
the external connection terminals are arranged on the bottom surface of the first base;
the first tape comprises a chip mount section and an outer section positioned outside the chip mount section;
the chip mount section and the outer section are positioned on the top surface of the first base;
the first semiconductor chip mounted on the chip mount section; and
the diverging point is arranged on the outer section.
2. The stacked-type semiconductor package according to claim 1 , wherein the first path portion has an electric length substantially equal to another electric length of the second path portion.
3. The stacked-type semiconductor package according to claim 1 , wherein the external connection terminal comprises a solder ball.
4. The stacked-type semiconductor package according to claim 1 , wherein the interconnection member comprises a solder ball.
5. The stacked-type semiconductor package according to claim 1 , wherein:
on the bottom surface except for a predetermined area, a reference plane for a referential voltage is formed;
the common path portion comprises a connection portion connected to the external terminal, a conductive via connected to the connection portion and a wire portion extending from the conductive via to the diverging point, wherein the connection portion is formed on the bottom surface and is positioned within the predetermined area so as to be electrically isolated from the reference plane, the conductive via is formed in the first base and extends from the bottom surface to the top surface, the wire portion is formed on the top surface;
the first path portion is formed on the top surface of the first base; and
the common path portion and the first path portion together with the reference plane constitute a microstrip transmission line structure.
6. The stacked-type semiconductor package according to claim 5 , wherein:
the second tape comprises a second base which has top and bottom surfaces;
on the bottom surface of the second base except for an additional predetermined area of the second base, an additional reference plane for a referential voltage is formed;
the second path portion comprises an additional connection portion connected to the interconnection member, an additional conductive via connected to the additional connection portion and an additional wire portion extending from the additional conductive via to second semiconductor chip, wherein the additional connection portion is formed on the bottom surface of the second base and is positioned within the additional predetermined area so as to be electrically isolated from the additional reference plane, the additional conductive via is formed in the second base and extends from the bottom surface to the top surface of the second base, the additional wire portion is formed on the top surface of the second base; and
the second path portion together with the additional reference plane constitute a microstrip transmission line structure.
7. The stacked-type semiconductor package according to claim 1 , comprising a plurality of data signal lines connected to the first and the second semiconductor chips, wherein each of the data signal lines comprises the first path portion, the second path portion and the common path portion.
8. The stacked-type semiconductor package according to claim 1 , wherein the first and the second semiconductor chips comprises DRAM chips, respectively.
9. The stacked-type semiconductor package according to claim 1 , wherein the first and the second semiconductor chips comprise bonding pads connected to the first and the second path portions, respectively, and each of the bonding pads is positioned on a center area of the first or the second semiconductor chip.
10. The stacked-type semiconductor package according to claim 1 , further comprising at least one elastomer sheet interposed between the first semiconductor chip and the first tape and/or between the second semiconductor chip and the second tape.
11. The stacked-type semiconductor package according to claim 1 , further comprising an additional interconnection member, a third semiconductor chip and a third tape, wherein:
the third semiconductor chip is mounted on the third tape; and
the third tape is formed with a third path portion extending from the additional interconnection member to the third semiconductor chip.
12. The stacked-type semiconductor package according to claim 11 , wherein the third path portion has an electric length substantially equal to another electric length of the second path portion.
13. A stacked-type semiconductor package comprising:
an external connection terminal;
a first semiconductor chip;
a first tape on which the first semiconductor chip is mounted which is formed with a common path portion and a first path portion, wherein the common path portion extends from the external connection terminal to a diverging point, and the first path portion extends from the diverging point to the first semiconductor chip;
an interconnection member connected to the diverging point;
a second semiconductor chip;
a second tape on which the second semiconductor chip is mounted and which is formed with a second path portion extending from the interconnection member to the second semiconductor chip, wherein
the first tape comprises a first base which has top and bottom surfaces;
on the bottom surface except for a predetermined area, a reference plane for a referential voltage is formed;
the common path portion comprises a connection portion connected to the external terminal, a conductive via connected to the connection portion and a wire portion extending from the conductive via to the diverging point, wherein the connection portion is formed on the bottom surface and is positioned within the predetermined area so as to be electrically isolated from the reference plane, the conductive via is formed in the first base and extends from the bottom surface to the top surface, the wire portion is formed on the top surface;
the first path portion is formed on the top surface of the first base; and
the common path portion and the first path portion together with the reference plane constitute a microstrip transmission line structure.