Volatile corrosion inhibitor packages
View Patent ↗A package for enclosing volatile corrosion inhibiting materials includes a first enclosure barrier being fabricated from one or more gas-impermeable materials and defining a first enclosed space. The package further includes a substrate having one or more volatile corrosion inhibitor materials disposed thereon, with the substrate being disposed within the first enclosed space. In some embodiments, a second enclosure barrier being fabricated from a gas-permeable, solid particle-impermeable material is disposed in the first enclosed space, and defines a second enclosed space inside of the first enclosed space. In such embodiments, the substrate is preferably disposed within the second enclosed space.
1. A method for inhibiting corrosion of corrosion-susceptible material, said method comprising:
(a) providing a corrosion inhibitor package having:
(i) a first enclosure barrier comprising one or more gas-impermeable materials and defining a first enclosed space;
(ii) a second enclosure barrier comprising a gas-permeable, solid particle-impermeable material, said second enclosure barrier being disposed in said first enclosed space and defining a second enclosed space inside of said first enclosed space, said second enclosure barrier having mono-direction emissivity and permitting vapors to pass through said second enclosure barrier from within the second enclosed space; and
(iii) a substrate having one or more volatile corrosion inhibitor materials disposed thereon, said substrate being disposed within said second enclosed space;
(b) breaching said first enclosure barrier to thereby render said second enclosed space in gas communication with ambient environment external to said corrosion inhibitor package; and
(c) placing said corrosion inhibitor package in proximity to corrosion-susceptible material.
2. A method as in claim 1 wherein the breaching includes removing at least a portion of said first enclosure barrier from said corrosion inhibitor package.
3. A method as in claim 1 wherein said corrosion-susceptible material is metal surfaces of a semiconductor device.
4. A method as in claim 1 wherein said corrosion-susceptible material is metal surfaces of a semiconductor wafer.
5. A method as in claim 1 wherein said corrosion inhibitor package is placed between about 0.1 and 30 cm from said corrosion-susceptible material.
6. A method as in claim 1 , including substantially immediately placing said corrosion inhibitor package in proximity to said corrosion-susceptible material upon breach of said first enclosure barrier.
7. A method as in claim 1 , wherein said substrate includes an open cell foam divided into a plurality of distinct foam pieces having a mean diameter of between about 0.25 mm and 0.5 mm.
8. A method as in claim 1 , wherein said one or more volatile corrosion inhibitor materials are disposed on said substrate with a loading of 35 wt % to 60 wt %.
9. A method as in claim 1 , wherein said one or more gas-impermeable materials include a metalized polyethylene terephthalate film including a vapor deposited film of metal.
10. A method as in claim 1 , wherein said one or more gas-impermeable materials of said first enclosure barrier include a self-supporting gas-impermeable material defining an annular flange.
11. A method as in claim 10 , wherein said one or more gas-impermeable materials of said first enclosure barrier further include a barrier layer secured to the annular flange.
12. A method for inhibiting corrosion of corrosion-susceptible material, said method comprising:
(a) providing a corrosion inhibitor package having:
(i) a first enclosure comprising one or more gas-impermeable materials and defining a first enclosed space;
(ii) a second enclosure defining a second enclosed space within the first enclosed space, the second enclosure having mono-direction emissivity and permitting vapor to pass through the second enclosure from the inside of the second enclosed space; and
(iii) a substrate having one or more volatile corrosion inhibitor materials disposed thereon, said substrate being disposed within said first enclosed space;
(b) breaching said enclosure barrier to thereby render said substrate in gas communication with ambient environment external to said enclosure barrier; and
(c) placing said substrate in proximity to said corrosion-susceptible material.
13. A method as in claim 12 wherein the breaching includes removing at least a portion of said enclosure barrier from said corrosion inhibitor package.
14. A method as in claim 12 wherein said corrosion-susceptible material is metal surfaces of a semiconductor device.
15. A method as in claim 12 wherein said corrosion-susceptible material is metal surfaces of a semiconductor wafer.
16. A method as in claim 12 wherein said substrate is placed between about 0.5 and 30 cm from said corrosion-susceptible material.
17. A method as in claim 12 , including substantially immediately placing said substrate in proximity to said corrosion-susceptible material upon breach of said enclosure barrier.
18. A method as in claim 12 , wherein said substrate includes an open cell foam divided into a plurality of distinct foam pieces having a mean diameter of between about 0.25 mm and 0.5 mm.
19. A method as in claim 12 , wherein said one or more volatile corrosion inhibitor materials are disposed on said substrate with a loading of 35 wt % to 60 wt %.
20. A method as in claim 12 , wherein said one or more gas-impermeable materials include a metalized polyethylene terephthalate film including a vapor deposited film of metal.
21. A method as in claim 12 , wherein said one or more gas-impermeable materials of said first enclosure include a self-supporting gas-impermeable material defining an annular flange.
22. A method as in claim 21 , wherein said one or more of said gas-impermeable materials first enclosure further include a barrier layer secured to the annular flange.
23. A method for inhibiting corrosion of corrosion-susceptible material, said method comprising:
(a) providing a corrosion inhibitor package having:
(i) a first enclosure barrier defining a first enclosed space and comprising a gas-impermeable material including a metalized polyethylene terephthalate film including vapor deposited metal;
(ii) a second enclosure barrier disposed within the first enclosed space and defining a second enclosed space, the second enclosure barrier being mono-direction emissive and permitting vapors to pass through said second enclosure barrier from within the second enclosed space; and
(iii) a substrate having one or more volatile corrosion inhibitor materials disposed thereon, said substrate being disposed within said second enclosed space;
(b) breaching said first enclosure barrier to thereby render said second enclosed space in gas communication with ambient environment external to said corrosion inhibitor package; and
(c) placing said corrosion inhibitor package in proximity to corrosion-susceptible material.
24. A method as in claim 23 , wherein the first enclosure barrier further comprises a self-supporting barrier material defining an annular flange, the metalized polyethylene terephthalate film secured to the annular flange.
25. A method as in claim 23 , wherein said substrate includes an open cell foam divided into a plurality of distinct foam pieces having a mean diameter of between about 0.25 mm and 0.5 mm.
26. A method as in claim 23 , wherein said one or more volatile corrosion inhibitor materials are disposed on said substrate with a loading of 35 wt % to 60 wt %.