Method for fabricating CMOS image sensor
View Patent ↗A CMOS image sensor and a method for fabricating the same are disclosed, in which transfer characteristics are improved. The method includes forming a photodiode region and a second conductive type ion region on a surface of a first conductive type substrate by implanting a second conductive type impurity ion into an entire surface of the substrate where a transistor is to be formed, forming a second conductive type lightly doped ion region in the substrate corresponding to the photodiode region by lightly implanting a second conductive type impurity ion only in an area where the photodiode region is opened, and diffusing the second conductive type lightly doped ion region into the second conductive type ion region by a thermal process.
1. A method for fabricating a CMOS image sensor comprising:
forming a photodiode region corresponding to a first source and drain region of a transistor and a second conductive type ion region on a surface of a first conductive type substrate by implanting a second conductive type impurity ion into an entire surface of the substrate where the transistor is to be formed;
forming spacers at both sides of a gate electrode of the transistor after forming the second conductive type ion region;
forming a second conductive type lightly doped ion region in the substrate deeper than the second conductive type ion region corresponding to the photodiode region by lightly implanting a second conductive type impurity ion only in an area where the photodiode region is opened by a photoresist film;
forming a first conductive type ion region thinner than the second conductive type ion region on the surface of the substrate corresponding to the photodiode region by implanting a first conductive type impurity ion only in the area where the photodiode region is opened by the photoresist film; and
forming a diffusion region diffused into the surface of the substrate in the photodiode region by diffusing the second conductive type lightly doped ion region into the second conductive type ion region by a thermal process.
2. The method of claim 1 , further comprising forming a photoresist film patterned to open only a second source and drain region of the transistor and forming a second conductive type heavily doped ion region in the second source and drain region by heavily implanting a first conductive type impurity using the spacer formed at one side of the gate electrode as a mask.
3. The method of claim 2 , wherein the second conductive type heavily doped ion region is deeper than the second conductive type ion region.
4. The method of claim 1 , further comprising forming a first conductive type ion region thinner than the second conductive type ion region on the surface of the substrate corresponding to the photodiode region by implanting a first conductive type impurity ion only in an area where the photodiode region is opened, after the second conductive type lightly doped ion region is diffused by the thermal process.
5. The method of claim 1 , wherein the first conductive type ion region is formed by implanting the first conductive type impurity ion at a doping concentration of 1×E 16 atoms/cm 3 or less.
6. The method of claim 4 , wherein the first conductive type ion region is formed by implanting the first conductive type impurity ion at a doping concentration of 1×E 16 atoms/cm 3 or less.
7. The method of claim 1 , wherein the second conductive type ion region is formed by implanting the second conductive type impurity ion at a doping concentration of 1×E 16 atoms/cm 3 −1×E 17 atoms/cm 3 .
8. The method of claim 7 , wherein the second conductive type ion region is formed by using phosphorus or arsenic as the second conductive type impurity ion.
9. The method of claim 8 , wherein the second conductive type lightly doped ion region is formed by implanting the second conductive type impurity ion at a doping concentration of 1×E 16 atoms/cm 3 or less.
10. The method of claim 1 , wherein the transistor is a transfer transistor.