IP Library Granted Patent US 7,589,345
Granted Patent B2
US 7,589,345 · App. 11/330,393 · Granted Sep 15, 2009

Nitride-based compound semiconductor substrate and method for fabricating the same

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Quick Facts
Patent No.
US 7,589,345
App. No.
11/330,393
Granted
Sep 15, 2009
Kind
B2
Abstract

A nitride-based compound semiconductor substrate mainly used for an epitaxial growth of a nitride semiconductor and a method for fabricating the same are disclosed. The nitride-based compound semiconductor substrate has a composition of Al x Ga 1-x N (0<x<1), a principal plane of C face, an area of 2 cm 2 or more, and a thickness of 200 μm or more. The substrate having this structure is fabricated by a HVPE (hydride vapor phase epitaxy) method by using an organic Al compound such as TMA (trimethyl aluminum) or TEA (trimethyl aluminum) as an Al source, A stable crystal growth can be obtained without damaging a reacting furnace, and a large-sized AlGaN crystal substrate with an excellent crystallinity can be obtained.

Claims (4)

1. A nitride-based compound semiconductor self-standing substrate, consisting of:

an Al x Ga 1-x N (0<x<1) crystal layer having a principal plane of C face that is a mirror surface, an area of 2 cm 2 or more, and a thickness of 200 μm or more,

wherein a half bandwidth of an X-ray rocking curve on a (0002) reflection is 300 seconds or less, and

wherein a variation in an Al composition is within a range of plus or minus 20% of a center value in a plane.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 16, 2016
From: SCIOCS COMPANY LIMITED
To: SUMITOMO CHEMICAL COMPANY, LIMITED
Reel/Frame 037827/0453 →
COMPANY SPLIT Recorded Jul 24, 2015
From: HITACHI METALS, LTD.
To: SCIOCS COMPANY LIMITED
Reel/Frame 036181/0104 →
MERGER AND CHANGE OF NAME Recorded Dec 15, 2014
From: HITACHI CABLE, LTD.; HITACHI METALS, LTD.
To: HITACHI METALS, LTD.
Reel/Frame 034630/0897 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 9, 2006
From: OSHIMA, YUICHI
To: HITACHI CABLE, LTD.
Reel/Frame 017660/0996 →