Method of packaging a semiconductor die and package thereof
View Patent ↗A method of packaging a semiconductor die includes the steps of providing a flange ( 110 ), coupling one or more active die ( 341 ) to the flange with a lead-free die attach material ( 350 ), staking a leadframe ( 120 ) to the flange after coupling the one or more active die to the flange, electrically interconnecting the one or more active die and the leadframe with an interconnect structure ( 470 ), and applying a plastic material ( 130 ) over the flange, the one or more active die, the leadframe, and the interconnect structure.
1. A method of packaging a semiconductor die comprising:
providing a flange;
coupling one or more active die to the flange with a metallurgical material;
after coupling the one or more active die to the flange, mechanically staking a leadframe to the flange;
using wire bonds to electrically interconnect the one or more active die and the leadframe; and
overmolding a plastic material over at least a portion of the flange, the one or more active die, a portion of the leadframe, and the wire bonds,
wherein:
providing the flange further comprises:
providing the flange comprised of a first material and a second material;
the first material is more ductile and thermally conductive than the second material;
the second material is more rigid than the first material; and
the first material is closer to the one or more active die than the second material.
2. The method of claim 1 wherein:
providing die flange further comprises:
providing multiple flanges coupled together in a leadframe-type structure.
3. The method of claim 1 further comprising:
after coupling the one or more active die to the flange, electrically isolating the leadframe from the flange.
4. The method of claim 3 wherein:
providing the flange further comprises:
providing multiple flanges coupled together in a leadframe-type structure.
5. The method of claim 4 wherein
the flange comprises:
a top surface;
a bottom surface opposite the top surface; and
two or more side surfaces coupling the top surface to the bottom surface; and
overmolding the plastic material comprises:
overmolding the plastic material over at least a portion of the top surface of the flange, at least a portion of at least of one of the two or more side surfaces of the flange, the one or more active die, the leadframe, and the wire bonds.
6. The method of claim 5 wherein:
providing the flange further comprises:
providing the flange with at least one feature; and
mechanically staking a leadframe to the flange further comprises:
mechanically staking the leadframe to the at least one feature of the flange.
7. The method of claim 6 wherein:
providing the flange with the at least one feature comprises:
providing the flange with a protrusion; and
the at least one feature comprises the protrusion.
8. The method of claim 1 wherein
the flange comprises:
a top surface:
a bottom surface opposite the top surface; and
two or more side surfaces coupling the top surface to the bottom surface; and
overmolding the plastic material comprises:
overmolding the plastic material over at least a portion of the top surface of the flange, at least a portion of at least of one of the two or more side surfaces of the flange, the one or more active die, the leadframe, and the wire bonds.
9. The method of claim 1 wherein:
providing the flange further comprises:
providing the flange with at least one feature; and
mechanically staking a leadframe to the flange further comprises:
mechanically staking the leadframe to the at least one feature of the flange.
10. The method of claim 9 wherein:
providing the flange with the at least one feature comprises:
providing the flange with a protrusion; and
the at least one feature comprises the protrusion.
11. The method of claim 1 further comprising:
after coupling the one or more active die to the flange, electrically isolating the leadframe from the flange,
wherein:
providing the flange further comprises:
providing the flange with at least one feature; and
mechanically staking a leadframe to the flange further comprises:
mechanically staking the leadframe to the at least one feature of the flange.
12. A method of packaging a semiconductor die comprising:
providing a flange;
coupling one or more active die to the flange with a metallurgical material;
after coupling the one or more active die to the flange, meet mechanically staking a leadframe to the flange;
using wire bonds to electrically interconnect the one or more active die and the leadframe; and
overmolding a plastic material over at least a portion of the flange, the one or more active die, a portion of the leadframe, and the wire bonds,
wherein:
providing the flange further comprises:
providing flange comprised of a first material and a second material;
the first material is more ductile and thermally conductive than the second material;
the second material is more rigid than the first material;
the first material is closer to the one or more active die than the second material;
mechanically staking the leadframe to the flange further comprises:
mechanically staking the first and second materials of the flange together such that the leadframe and the flange are non-coplanar with each other.
13. The method of claim 12 wherein:
providing the flange further comprises:
providing multiple flanges coupled together in a leadframe-type structure.
14. The method of claim 12 further comprising:
after coupling the one or more active die to the flange, electrically isolating the leadframe from the flange.
15. The method of claim 12 wherein
the flange comprises:
a top surface;
a bottom surface opposite the top surface; and
two or more side surfaces coupling the top surface to the bottom surface; and
overmolding the plastic material comprises:
overmolding the plastic material over at least a portion of the top surface of the flange, at least a portion of at least of one of the two or more side surfaces of the flange, the one or more active die, the leadframe, and the wire bonds.
16. The method of claim 12 wherein:
providing the flange further comprises:
providing the flange with at least one feature; and
mechanically staking a leadframe to the flange further comprises:
mechanically staking the leadframe to the at least one feature of the flange.
17. The method of claim 16 wherein:
providing the flange with the at least one feature comprises:
providing the flange with a protrusion; and
the at least one feature comprises the protrusion.
18. The method of claim 17 wherein:
providing the flange further comprises:
providing multiple flanges coupled together in a leadframe-type structure.
19. The method of claim 18 further comprising:
after coupling the one or more active die to the flange, electrically isolating the leadframe from the flange.
20. The method of claim 19 wherein
the flange comprises:
a top surface;
a bottom surface opposite the top surface; and
two or more side surfaces coupling the top surface to the bottom surface; and
overmolding the plastic material comprises:
overmolding the plastic material over at least a portion of the top surface of the flange, at least a portion of at least of one of the two or more side surfaces of the flange, the one or more active die, the leadframe, and the wire bonds.