Aberration measuring apparatus for charged particle beam optical system, charged particle beam lithography machine having the aberration measuring apparatus, and device fabrication method using the apparatus
View Patent ↗A charged particle beam lithography machine for exposing a target exposure surface by using a plurality of charged particle beams. The machine includes a charged particle source to emit a charged particle beam, an aperture substrate which has a plurality of apertures to divide the charged particle beam from the charged particle source into a plurality of charged particle beams, a plurality of electron optical systems which have the apertures as pupils, a charged particle beam optical system which projects, to the target exposure surface, charged particle source images formed by the plurality of electron optical systems, a unit adapted to set the apertures of the aperture substrate to an aperture for exposure and an aperture for aberration measurement to make the plurality of charged particle beams strike the charged particle beam optical system at different incident angles, and a detecting unit adapted to detect a position where the plurality of charged particle beams, which have passed through the aperture for aberration measurement, form images on an image surface of the charged particle beam optical system.
1. A charged particle beam lithography machine for exposing a target exposure surface by using a plurality of charged particle beams, said machine comprising:
a charged particle source to emit a charged particle beam;
an aperture substrate which has a plurality of apertures to divide the charged particle beam from said charged particle source into a plurality of charged particle beams;
a plurality of electron optical systems which have the apertures as pupils;
a charged particle beam optical system which projects, to the target exposure surface, charged particle source images formed by said plurality of electron optical systems;
a unit adapted to set the apertures of said aperture substrate to an aperture for exposure and an aperture for aberration measurement to make the plurality of charged particle beams strike said charged particle beam optical system at different incident angles; and
a detecting unit adapted to detect a position where the plurality of charged particle beams, which have passed through the aperture for aberration measurement, form images on an image surface of said charged particle beam optical system.
2. The machine according to claim 1 , wherein an aberration is obtained on the basis of a detection result from said detecting unit and a distortion of said charged particle beam optical system.
3. The machine according to claim 1 , wherein the plurality of charged particle beams, which have passed through the aperture for aberration measurements pass through different object planes, and the aberration is obtained by regarding the object planes as the same image height.
4. The machine according to claim 2 , wherein the aperture for aberration measurement makes the plurality of charged particle beams strike an object plane of said charged particle beam optical system at an equal incident angle, said detecting unit detects the image positions, and the distortion is obtained on the basis of the detection result.
5. The machine according to claim 2 , further comprising a calculating unit adapted to divide the aberration into components by using a Zernike coefficient.
6. A device fabrication method of fabricating a device, said method comprising steps of:
exposing an exposure target by using a charged particle beam lithography machine of claim 1 ; and
developing the exposed exposure target.