Thermally conductive integrated circuit mounting structures
View Patent ↗Various devices for mounting circuit devices and methods of making the same are provided. In aspect, a device is provided that includes a member for holding an integrated circuit. The member contains a first plurality of carbon nanotubes to enhance the thermal conductivity thereof. At least one conductor member projects from the member. In another aspect, a method of fabricating an interface for an electronic component is provided that includes forming a member containing a first plurality of carbon nanotubes and forming at least one conductor on the member.
1. A circuit board, comprising:
a substrate including a source material interspersed and in physical contact with a first plurality of unbundled carbon nanotubes; and
at least one conductor coupled to the substrate.
2. The circuit board of claim 1 , wherein the first plurality of carbon nanotubes comprises a first layer, each of the first plurality of carbon nanotubes comprising a tube axis, the tube axes being substantially aligned.
3. The circuit board of claim 1 , comprising an integrated circuit coupled to the substrate.
4. The circuit board of claim 3 , wherein the integrated circuit comprises a package.
5. The circuit board of claim 4 , wherein at least a portion of the package comprises a second plurality of carbon nanotubes.
6. The circuit board of claim 5 , wherein the second plurality of carbon nanotubes comprises a second layer, each of the second plurality of carbon nanotubes comprising a tube axis, the tube axes being substantially aligned.
7. The circuit board of claim 3 , comprising a heat sink coupled to the package.
8. The circuit board of claim 1 , comprising a socket member coupled to the substrate.
9. The circuit board of claim 8 , wherein the socket member comprises a body having a third plurality of carbon nanotubes.
10. The circuit board of claim 9 , wherein the third plurality of carbon nanotubes comprises a third layer, each of the third plurality of carbon nanotubes comprising a tube axis, the tube axes being substantially aligned.
11. The circuit board of claim 9 , wherein the body comprises at least one socket.
12. The circuit board of claim 1 , comprising a fan to direct air over the substrate.
13. A circuit board, comprising:
a substrate including a source material interspersed and in physical contact with a first plurality of unbundled carbon nanotubes;
at least one conductor coupled to the substrate;
a socket member coupled to the substrate, the socket member including a body having a second plurality of carbon nanotubes; and
another circuit board coupled to the socket member.
14. The circuit board of claim 13 , wherein the first plurality of carbon nanotubes comprises a first layer, each of the first plurality of carbon nanotubes comprising a tube axis, the tube axes being substantially aligned.
15. The circuit board of claim 13 , comprising an integrated circuit coupled to the substrate.
16. The circuit board of claim 15 , wherein the integrated circuit comprises a package.
17. The circuit board of claim 16 , wherein at least a portion of the package comprises a third plurality of carbon nanotubes.