Semiconductor interconnect having adjacent reservoir for bonding and method for formation
View Patent ↗A semiconductor device and method has interconnects with adjoining reservoir openings. A dielectric layer is formed as part of an uppermost of the one or more interconnect layers. Openings formed in the dielectric layer result in modified portions of the dielectric layer along portions of sidewalls of the openings. The openings are filled with a conductive material, such as metal. An exposed portion of the dielectric layer is removed to form protruding pads of the conductive material extending above the dielectric layer. Reservoir openings are formed adjacent the protruding pads by removing the modified portions of the dielectric layer. When the semiconductor device is bonded with another device, either a wafer or a die, laterally flowing metal collects in the reservoir openings and ensures that a reliable electrical connection is made between the semiconductor device and the other device.
1. A method of forming a semiconductor device comprising:
providing a substrate having an overlying device layer;
forming a plurality of devices within the substrate and within the overlying device layer;
forming one or more interconnect layers overlying the device layer;
forming a dielectric layer surrounding an uppermost of the one or more interconnect layers;
forming openings in the dielectric layer;
filling the openings with a conductive material;
removing an exposed portion of the dielectric layer to form protruding pads of the conductive material extending above the dielectric layer; and
forming reservoir openings within the dielectric and adjacent the protruding pads.
2. The method of claim 1 further comprising:
forming an insulating capping layer overlying the dielectric layer that is dissimilar in material from the dielectric layer, the insulating capping layer protecting underlying portions of the dielectric layer.
3. The method of claim 1 wherein the forming of openings in the dielectric layer results in modified portions of the dielectric layer along portions of sidewalls of the openings.
4. The method of claim 1 further comprising:
coupling protruding metallic pads of a second semiconductor device to the protruding pads of the semiconductor device;
deforming the protruding pads of the semiconductor device by temperature and pressure; and
capturing any laterally flowing portion of metallic pads of the second semiconductor and the protruding pads of the semiconductor device within the reservoir openings.
5. The method of claim 1 , wherein the reservoir openings have a larger width at a surface of the dielectric layer than below the surface of the dielectric layer.
6. The method of claim 3 wherein forming the reservoir openings further comprises:
removing the modified portions of the dielectric layer to form the reservoir openings.
7. The method of claim 3 wherein forming the openings further comprise:
providing a patterned masking layer on top of an insulating capping layer overlying the dielectric layer;
etching the dielectric layer and the insulating capping layer;
removing the patterned masking layer in an oxidizing chemistry in a plasma environment; and
controlling removal of the patterned masking layer to size the modified portions of the dielectric layer, thereby controlling size of the reservoir openings.
8. The method of claim 7 wherein controlling removal of the patterned masking layer further comprises controlling at least one of controlling a time required to remove the patterned masking layer, power used to remove the patterned masking layer, pressure used to remove the patterned masking layer, temperature used to remove the patterned masking layer and controlling a removing chemistry.
9. The method of claim 6 wherein forming the openings further comprise:
providing a patterned masking layer on top of an insulating capping layer overlying the dielectric layer;
etching the dielectric layer and the insulating capping layer;
removing the patterned masking layer in an oxidizing chemistry in a plasma environment; and
controlling removal of the patterned masking layer to size the modified portions of the dielectric layer, thereby controlling size of the reservoir openings.
10. The method of claim 4 further comprising:
forming additional reservoir openings adjacent the protruding metallic pads of the second semiconductor device for additional capturing of any laterally flowing portion of metallic pads of the second semiconductor and the protruding pads of the semiconductor device.