Granted Patent B2

US 7,285,452 · App. 11/351,518 · Granted Oct 23, 2007

Abstract

Claims (43)

1. A method of forming a semiconductor device comprising:

providing an insulating layer;

forming a first layer on the insulating layer, the first layer having a first property;

separating the first layer into first and second separate areas which have no surfaces in contact with each other and electrically isolating the first and second separate areas;

after separating the first layer, amorphizing only the first of the first and second separate areas;

applying a donor wafer overlying and in contact with the first and second areas;

annealing the semiconductor device to modify the first of the first and second separate areas to have a different property from the second of the first and second separate areas;

removing the donor wafer; and

forming at least one semiconductor structure in each of the first and the second of the first and second separate areas.

2. The method of claim 1 further comprising:

providing the donor wafer as a wafer having at least one of differing strain, differing composition, differing surface orientation or differing crystal rotation from the second portion of the first layer.

3. The method of claim 1 wherein the second separate area of the first layer has a first surface orientation, and the donor wafer and the first separate area of the first layer has a second surface orientation differing from the first surface orientation.

4. The method of claim 1 further comprising:

providing a substrate underlying the insulating layer, wherein the second separate area of the first layer has a surface orientation of either (110) or (100), and the donor layer has a surface orientation of (100) or (110) depending upon the surface orientation of second separate area of the first layer.

5. The method of claim 1 wherein the first separate area of the first layer has a crystal rotation of (110) or (100) and the second separate area of the first layer has a crystal rotation having whichever value of (110) or (100) the first separate area of the first layer does not have.

6. The method of claim 1 wherein removing the donor wafer further comprises:

cleaving a first portion of the donor wafer along a lateral boundary comprising atoms of a predetermined composition; and

removing a remaining second portion of the donor wafer from the semiconductor device.

7. The method of claim 1 wherein the removing is performed before said annealing of the semiconductor device to modify the first of the first and second separate areas.

8. The method of claim 1 further comprising electrically isolating the first and second separate areas with an oxide material and forming the donor wafer by bonding the donor wafer to the first and second separate areas and the oxide material, the donor wafer comprising a lateral region having atomic irregularities which permit ready cleaving of the donor wafer along the lateral region.

9. A method of forming a semiconductor device comprising:

providing an insulating layer;

forming a first layer on the insulating layer, the first layer having a first crystal orientation;

separating the first layer into physically separate first and second separate areas and electrically isolating the first and second separate areas with a dielectric region;

after separating the first layer, amorphizing only the first of the first and second separate areas;

bonding a substrate layer of material to be in contact with the first and second areas and the dielectric region, the substrate layer of material having a second crystal orientation that differs from the first crystal orientation;

annealing the semiconductor device to modify the first of the first and second separate areas to have the second crystal orientation of the substrate layer of material;

removing the substrate layer of material; and

forming at least one semiconductor structure in each of the first and the second of the first and second separate areas.

10. The method of claim 9 wherein removing the substrate layer of material further comprises:

removing a portion of the substrate layer of material prior to said annealing and removing a remainder of the substrate of material after said annealing.

11. The method of claim 9 wherein removing the substrate layer of material further comprises:

removing a first portion of the substrate layer of material by cleaving the substrate layer of material along a lateral edge defined by a presence of differing atomic structure; and

removing a second portion of the substrate layer of material by chemical mechanical polishing the second portion.

12. A method of forming a semiconductor device comprising:

providing a bulk substrate having a first property;

forming an isolation region within the bulk substrate;

forming at least one region of amorphous semiconductor material within the isolation region;

applying a donor wafer overlying and in contact with an exposed surface of the bulk substrate, the isolation region and the at least one region of amorphous semiconductor material within the isolation region, the donor wafer having a second property which differs from the first property;

annealing the semiconductor device to transfer the second property of the donor wafer to the at least one region of amorphous semiconductor material within the isolation region;

removing the donor wafer; and

forming at least one semiconductor structure in the at least one region of amorphous semiconductor material within the isolation region.

13. The method of claim 12 wherein the first property and second property both comprise at least one of strain, composition, surface orientation or crystal rotation.

Assignments (23)