Methods and apparatus for a high-frequency output match circuit
View Patent ↗An output match circuit is coupled between the terminal of a high-frequency device and a ground terminal. The output match circuit includes an LC shunt and an LC notch serially coupled to the LC shunt, wherein the LC notch includes a resonant capacitive element in series with a resonant inductive element. The LC notch may simply include a resonant inductive element coupled directly to the ground terminal. The series inductive element may have a terminal coupled between the resonant capacitive element and the resonant inductive element.
1. An output match circuit coupled between a terminal of a high-frequency device and a ground terminal, the output match circuit comprising:
an LC shunt, the LC shunt including a shunt inductive element and a shunt capacitive element; and
an LC notch serially coupled to the LC shunt.
2. The output match circuit of claim 1 , wherein the LC notch comprises a resonant inductive element coupled to the ground terminal.
3. The output match circuit of claim 1 , further including a series inductive element having a terminal coupled between the resonant capacitive element and the resonant inductive element.
4. The output match circuit of claim 1 , wherein the LC notch comprises a resonant capacitive element in series with a resonant inductive element.
5. The output match circuit of claim 4 , wherein the resonant capacitive element is a series of multi-cell capacitors incorporated into the high-frequency device.
6. The output match circuit of claim 4 , wherein the resonant inductive element is an array of bond wires coupled to the high-frequency device.
7. An RF power device comprising:
a MOSFET component having a drain node;
an output match circuit coupled between the drain node and a ground node, the output match circuit including an LC shunt in series with an LC notch;
a series inductance associated with a drain lead and coupled to the drain node.
8. The device of claim 7 , wherein the LC notch comprises a notch inductive element connected to the ground node.
9. The device of claim 7 , wherein the LC shunt comprises a shunt inductive element in series with a shunt capacitive element.
10. The device of claim 9 , wherein the shunt inductive element comprises an array of wire bonds connected to the MOSFET component.
11. The device of claim 9 , wherein the MOSFET component operates at approximately 2 GHz, the shunt inductive element has a value of between approximately 0.1 and 0.3 nH and the shunt capacitive element has a value of between approximately 100 pF and 300 pF.
12. The device of claim 7 , wherein the LC notch comprises a notch inductive element in series with a notch capacitive element.
13. The device of claim 12 , wherein the notch inductive element includes an array of wire bonds connected to the MOSFET component.
14. The device of claim 12 , wherein the MOSFET component operates at approximately 2 GHz, and wherein the notch inductive element has a value of between approximately 5.5 pH and 37 pH.
15. The device of claim 12 , wherein the series inductance is coupled to a node between the notch inductive element and the notch capacitive element.
16. The device of claim 12 , wherein the MOSFET component operates at approximately 2 GHz, and wherein the notch capacitive element has a value of between approximately 10 pF and 150 pF.
17. The device of claim 16 , wherein the MOSFET component operates at approximately 2 GHz, and wherein the notch capacitive element has a value of between approximately 65 pF and 75 pF.
18. A method for providing impedance transformation for a high-frequency power device having an enclosure, the method including:
selecting predetermined component values for a shunt capacitive element, a shunt inductive element, a notch capacitive element, and a notch inductive element based on a desired bandwidth for the device; and
forming, within the enclosure, the shunt capacitive element, the shunt inductive element, the notch capacitive element, and the notch inductive element in series between a terminal of the device and a ground terminal.
19. The method of claim 18 , wherein forming the shunt inductive element includes forming an array of wire bonds coupled to the device.
20. The method of claim 18 , wherein forming the shunt capacitive element includes forming a series of multi-cell capacitors on the device.