Granted Patent B2

US 7,394,028 · App. 11/360,200 · Granted Jul 1, 2008

Abstract

Claims (31)

1. A method of forming an assembly, the method comprising the steps of:

forming a circuit substrate at least in part by:

forming an electrical trace layer;

forming a mounting pad, the mounting pad having a first surface, one or more sidewalls and a second surface, the first surface being attached to the electrical trace layer;

forming a dielectric layer after forming the mounting pad, the dielectric layer substantially covering the one or more sidewalls of the mounting pad and having an uppermost surface substantially coplanar with the second surface of the mounting pad;

forming an electrical trace underlying the mounting pad by patterning the electrical trace layer after forming the mounting pad; and

forming a mounting pad cap, the mounting pad cap disposed on the second surface of the mounting pad and protruding above the uppermost surface of the dielectric layer; and

attaching an integrated circuit chip to the circuit substrate.

2. The method of claim 1 , wherein the integrated circuit chip is a flip chip comprising a plurality of solder bumps.

3. The method of claim 2 , wherein one of the solder bumps is electrically connected to the mounting pad cap on the circuit substrate.

4. The method of claim 2 , further comprising the step of forming an underfill material, the underfill material filling at least a portion of a region between the circuit substrate and the flip chip.

5. A method of forming a circuit substrate for attachment to an integrated circuit chip, the method comprising the steps of:

forming an electrical trace layer;

forming a mounting pad, the mounting pad having a first surface, one or more sidewalls and a second surface, the first surface being attached to the electrical trace layer;

forming a dielectric layer after forming the mounting pad, the dielectric layer substantially covering the one or more sidewalls of the mounting pad and having an uppermost surface substantially coplanar with the second surface of the mounting pad;

forming an electrical trace underlying the mounting pad by patterning the electrical trace layer after forming the mounting pad; and

forming a mounting pad cap, the mounting pad cap disposed on the second surface of the mounting pad and protruding above the uppermost surface of the dielectric layer.

6. The method of claim 5 , wherein the circuit substrate is flexible.

7. The method of claim 5 , wherein the circuit substrate is configured for attachment to a flip chip.

8. The method of claim 5 , wherein the mounting pad has one sidewall.

9. The method of claim 5 , wherein the mounting pad has four sidewalls.

10. The method of claim 5 , wherein the mounting pad cap comprises nickel or gold, or a combination thereof.

11. The method of claim 5 , further comprising the step of forming a second dielectric layer, wherein at least a portion of the electrical trace is disposed between the dielectric layer substantially covering the one or more sidewalls of the mounting pad and the second dielectric layer.

12. The method of claim 5 , wherein the dielectric layer comprises a polymeric material.

13. The method of claim 5 , wherein the electrical trace comprises copper.

14. The method of claim 5 , wherein the mounting pad comprises copper.

15. The method of claim 5 , further comprising the step of forming a heat sink.

16. The method of claim 15 , wherein the heat sink is attached to the electrical trace.

17. The method of claim 5 , wherein the step of forming the mounting pad comprises one or more pattern plating processes.

18. The method of claim 5 , wherein the step of forming the dielectric layer comprises vacuum assisted lamination.

19. The method of claim 5 , further comprising the steps of attaching a rigid support layer to the electrical trace layer and subsequently detaching the rigid support layer from the electrical trace layer.

Assignments (9)