IP Library Granted Patent US 7,627,164
Granted Patent B2
US 7,627,164 · App. 11/360,657 · Granted Dec 1, 2009

Pattern inspection method and apparatus with high-accuracy pattern image correction capability

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Quick Facts
Patent No.
US 7,627,164
App. No.
11/360,657
Granted
Dec 1, 2009
Kind
B2
Abstract

A high-accuracy image correction device adaptable for use in pattern inspection apparatus is disclosed. The device includes a correction region designation unit which designates a correction region including a pattern and its nearby portion within each of an inspection reference pattern image and a pattern image under test. The device also includes an equation generator which generates by linear predictive modeling a set of simultaneous equations for a reference pattern image within the correction region and an under-test pattern image within the correction region, a parameter generator for solving the equations to obtain more than one model parameter, and a corrected pattern image generator for using the model parameter to apply the linear predictive modeling to the reference pattern image to thereby generate a corrected pattern image. A pattern inspection method using the image correction technique is also disclosed.

Claims (26)

1. A device for correcting a pattern image by use of an inspection reference pattern image of a workpiece being tested and a pattern image under test, said device comprising:

a correction region designation unit operative to designate a correction region including a pattern and its nearby portion within each of the reference pattern image and the pattern image under test;

an equation generation unit operative to generate by linear predictive modeling a set of simultaneous equations for a reference pattern image within the correction region and an under-test pattern image within the correction region;

a parameter generation unit operative to solve the equations to thereby obtain a model parameter; and

a corrected pattern image generation unit operative to use the model parameter to apply the linear predictive modeling to the reference pattern image to thereby generate a corrected pattern image.

2. The device according to claim 1 , wherein said correction pattern image generation unit uses a two-value pixel map for designation of the correction region, and wherein said equation generation unit refers to the two-value pixel map for generation of the equations.

3. The device according to claim 1 , wherein the correction region contains therein a contact hole as a pattern to be designated.

4. The device according to claim 1 , wherein the linear predictive modeling is a two-dimensional (“2D”) predictive modeling with each pixel of the under-test pattern image as a 2D output data and with a linear coupling of a group of pixels around a single pixel of the reference pattern image corresponding to said each pixel as a 2D input data.

5. The device according to claim 1 , wherein the linear predictive modeling is a 2D predictive modeling with each pixel of the under-test pattern image as a 2D output data while letting a linear coupling of a matrix of five rows and five columns of pixels having a centrally placed pixel of the reference pattern image corresponding to said each pixel be a 2D input data.

6. An apparatus for performing pattern inspection by using an inspection reference pattern image of a workpiece being tested and a pattern image under test, said apparatus comprising:

a correction region designation unit operative to designate a correction region including a pattern and its nearby portion within each of the reference pattern image and the pattern image under test;

an equation generation unit operative to generate by linear predictive modeling a set of simultaneous equations for a reference pattern image within the correction region and an under-test pattern image within the correction region;

a parameter generation unit operative to solve the equations to thereby obtain a model parameter;

a corrected pattern image generation unit operative to use the model parameter to apply the linear predictive modeling to the reference pattern image to thereby generate a corrected pattern image; and

a pattern image comparison unit operative to compare the corrected pattern image to the test pattern image in the correction region for detecting defects of the test pattern image.

7. A method for correcting a pattern image by use of an inspection reference pattern image of a workpiece being tested and a pattern image under test carried out by an image correction device, said method comprising:

designating a correction region including a pattern and its nearby portion within each of the reference pattern image and the pattern image under test by the image correction device;

generating by linear predictive modeling a set of simultaneous equations for a reference pattern image within the correction region and an under-test pattern image within the correction region by the image correction device;

solving the equations to thereby obtain a model parameter by the image correction device; and

using the model parameter to apply the linear predictive modeling to the reference pattern image to thereby generate a corrected pattern image by the image correction device.

8. A method for performing pattern inspection by using an inspection reference pattern image of a workpiece being tested and a pattern image under test carried out by a pattern inspection apparatus, comprising:

designating a correction region including a pattern and its nearby portion within each of the reference pattern image and the pattern image under test by the pattern inspection apparatus;

generating by linear predictive modeling a set of simultaneous equations for a reference pattern image within the correction region and an under-test pattern image within the correction region by the pattern inspection apparatus;

solving the equations to thereby obtain a model parameter by the pattern inspection apparatus;

using the model parameter to apply the linear predictive modeling to the reference pattern image to thereby generate a corrected pattern image by the pattern inspection apparatus; and

comparing the corrected pattern image to the test pattern image in the correction region for detecting defects of the test pattern image by the pattern inspection apparatus.

Assignments (4)
MERGER AND CHANGE OF NAME Recorded Aug 19, 2021
From: TOSHIBA MEMORY CORPORATION; K.K. PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 057224/0091 →
CHANGE OF NAME Recorded Aug 19, 2021
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 057224/0641 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 3, 2018
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 045574/0652 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 20, 2010
From: ADVANCED MASK INSPECTION TECHNOLOGY INC.
To: KABUSHIKI KAISHA TOSHIBA; NEC CORPORATION
Reel/Frame 025008/0164 →