Method for electrical interconnection between printed wiring board layers using through holes with solid core conductive material
View Patent ↗The present invention provides method of manufacture for a printed wiring board. The printed wiring board constructed according to the teachings of the present invention includes a printed wiring board dielectric layer having conductive foils located on at least two sides thereof. The printed wiring board further includes a solid core conductive material interconnecting the conductive foils.
1. A method for manufacturing a printed wiring board, comprising:
providing a printed wiring board dielectric layer having conductive foils located on at least two sides thereof;
inserting a solid core conductive material within said printed wiring board dielectric layer, including:
inserting a sharp hollow object containing said solid core conductive material therein within said printed wiring board dielectric; and
removing said sharp hollow object from said printed wiring board dielectric leaving said solid core conductive material therein thereby interconnecting said conductive foils.
2. The method as recited in claim 1 wherein inserting a solid core conductive material within said printed wiring board dielectric layer includes inserting a solid core wire within said printed wiring board dielectric layer.
3. The method as recited in claim 2 wherein inserting a solid core wire within said printed wiring board dielectric layer includes inserting a solid core copper wire within said printed wiring board dielectric layer.
4. The method as recited in claim 1 wherein said solid core conductive material has a diameter ranging from about 0.050 mm to about 0.200 mm.
5. The method as recited in claim 4 wherein said solid core conductive material has a diameter ranging from about 0.100 mm to about 0.150 mm.
6. The method as recited in claim 1 wherein inserting a solid core conductive material within said printed wiring board dielectric layer using a sharp hollow object includes inserting a solid core conductive material within said printed wiring board dielectric layer using a needle.
7. The method as recited in claim 1 further including increasing a temperature of said printed wiring board dielectric substrate prior to inserting said solid core conductive material within said printed wiring board dielectric layer.
8. The method as recited in claim 7 wherein said temperature ranges from about 50° C. to a temperature less than a glass transition temperature of said printed wiring board dielectric layer.
9. The method as recited in claim 1 wherein said printed wiring board dielectric layer is a first dielectric layer and first and second conductive foils are located on opposing sides thereof, and further including forming a second dielectric layer and third conductive foil contacting said first conductive foil and a third dielectric layer and a fourth conductive foil contacting said second conductive foil, wherein said solid core conductive material interconnects said first, second, third and fourth conductive foils.