Memory module with improved mechanical strength of chips
View Patent ↗A memory module of the present invention has a memory core chip for storing information, an interface chip for controlling data input/output, an interposer chip for transmitting/receiving data to/from the outside, and an external connection terminal provided in closest proximity to the interposer chip. A heat dissipating plate is provided in closest proximity to the interface chip. The interposer chip has a substrate made of a semiconductor material that is similar to the memory core chip, a land for holding the external connection terminal, a wire connected to the external connection terminal, and an insulating film for insulating the wire. The land, wire, and insulating film are integrally formed on one surface of the interposer chip.
1. A method of manufacturing a memory module having a memory core chip for storing information, an interface chip for controlling data input/output to/from said memory core chip, and an interposer chip for transmitting/receiving the data between said interface chip and an outside, said method comprising the steps of:
adhering a support directly to a surface of said interface chip opposite to a surface on which a bump is formed;
subsequently placing said memory core chip on the surface of said interface chip on which the bump is formed, and thermo-compression bonding the bumps of said interface chip and said memory core chip to each other; and
placing said interposer chip on said memory core chip, and thermo-compression bonding the bumps of said memory core chip and said interposer chip to each other, wherein said support holds said interface chip, said memory core chip and said interposer chip at said thermo-compression bonding steps.
2. The method of manufacturing a memory module according to claim 1 , further comprising the step of encapsulating side surfaces of said interface chip, said memory core chip, and said interposer chip with a resin after thermo-compression bonding the bumps of said memory core chip and said interposer chip to each other.
3. The method of manufacturing a memory module according to claim 1 , further comprising the steps of:
adhering a plurality of said interface chips to said support in said step of adhering a support directly to a surface of said interface chip opposite to a surface on which a bump is formed;
encapsulating side surfaces of laminated chips including said interface chips, said memory core chip, and said interposer chip, after the step of thermo-compression bonding the bumps of said memory core chip and said interposer chip; and
cutting said support corresponding to said laminated chips encapsulated with the resin.
4. The method of manufacturing a memory module according to claim 2 , further comprising the step of mounting an external connection terminal in closest proximity to said interposer chip for electrically connecting to the outside after the step of encapsulating with a resin.
5. The method of manufacturing a memory module according to claim 3 , further comprising the step of mounting an external connection terminal in closest proximity to said interposer chip for electrically connecting to the outside after the step of encapsulating with a resin.
6. The method of manufacturing a memory module according to claim 1 , wherein said support is made of a metal plate.
7. The method of manufacturing a memory module according to claim 6 , wherein said support is a lead frame.
8. A method of manufacturing a memory module comprising;
preparing for a plurality of memory core chips;
preparing for an interface chip to control data transfer to/from each of the memory core chips, wherein the interface chip has a first surface and a second surface which is opposite to the first surface;
preparing for an interposer chip to transfer the data between the interface chip and an outside of the memory module;
adhering a lead frame plate directly to the first surface of the interface chip;
disposing the plurality of the memory core chips over the second surface of the interface chip after adhering the lead frame plate to the interface chip, and connecting the plurality of memory core chips and the interface chip by using thermo-compression bonding; and
subsequently disposing the interposer chip over the plurality of the memory core chips such that the interposer chip is directly connected to one of the plurality of memory core chips, and thermo-compression bonding between the interposer chip and the memory core chip which is directly connected to the interposer chip.
9. The method of manufacturing a memory module according to claim 8 , wherein each of the memory core chips comprises a plurality of bumps for thermo-compression bonding on a surface of each of the memory core chips.
10. The method of manufacturing a memory module according to claim 8 , further comprising the step of encapsulating side surfaces of the interface chip, the plurality of memory core chips, and the interposer chip with a resin after thermo-compression bonding between the memory core chip and the interposer chip.
11. The method of manufacturing a memory module according to claim 8 , further comprising;
forming a plurality of external connection terminals over a surface of the interposer chip at an opposite side to which the memory core chip is connected.
12. The method of manufacturing a memory module according to claim 11 , wherein the external connection terminals are solder balls.
13. The method of manufacturing a memory module according to claim 8 , wherein the lead frame plate is made of a metal.
14. The method of manufacturing a memory module according to claim 13 , wherein a size of the lead frame plate is larger than a size of the interposer chip when viewed from a surface of the interposer chip at an opposite side to which the memory core chip is connected.