IP Library Granted Patent US 7,323,905
Granted Patent B2
US 7,323,905 · App. 11/403,118 · Granted Jan 29, 2008

Programmable structured arrays

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Quick Facts
Patent No.
US 7,323,905
App. No.
11/403,118
Granted
Jan 29, 2008
Kind
B2
Abstract

A programmable semiconductor device, wherein: a user programmable switch comprising a configurable element is positioned above a transistor gate material layer deposited on a silicon substrate layer.

Claims (38)

1. A programmable wire structure for an integrated circuit, comprising:

a programmable switch coupling two nodes, said switch having a first state that connects said two nodes, and said switch having a second state that disconnects said two nodes; and

a configuration circuit coupled to said programmable switch, said circuit comprising a means to program said switch between said first and second state; and

a transistor gate material layer deposited on a silicon substrate layer, said switch and said configuration circuit fabricated substantially above said transistor gate material layer.

2. The structure of claim 1 , further comprising a first metal layer deposited substantially above said transistor gate material layer, wherein a first metal line is coupled to said switch or configuration circuit or both.

3. The structure of claim 2 , further comprising a second metal layer deposited substantially above said first metal layer, wherein a second metal line is coupled to said switch or configuration circuit or both.

4. The structure of claim 1 , wherein said programmable switch comprises a thin film pass-gate transistor.

5. The structure of claim 4 , wherein the thin film pass-gate transistor is controlled by a configuration circuit comprising a configurable memory element.

6. The structure of claim 5 , wherein said configurable memory element comprises one of volatile or non volatile memory elements.

7. The structure of claim 5 , wherein the programmable means further comprises:

a decoded access to an individual memory element in an array of memory elements; and

a program method to alter the memory element polarity, whereby generating an on and off control signal coupling to said pass-gate transistor, wherein:

said first state is generated by an on pass-gate; and

said second state is generated by an off pass-gate.

8. The structure of claim 5 , wherein said configuration circuit comprises a transistor.

9. The structure of claim 1 , wherein said programmable switch comprises a configurable element.

10. The structure of claim 9 , wherein said configurable element comprises one of resistor, anti-fuse, capacitor, laser-fuse, electrical-fuse, diode, junction, SRAM cell, DRAM cell, metal, optional link, floating gate, EPROM cell, EEPROM cell, flash cell, ferro-electric element, photo-electric element, optical element, electro-chemical element, electrolytic element, Carbon nano-tube, electro-mechanical element, electro-magnetic element and magnetic element.

11. The structure of claim 9 , wherein the programmable means further comprises:

a decoded access to an individual switch in an array of switches; and

a program method to alter the switch conductivity between conductive and non conductive levels, wherein:

said first state is generated by the conductive switch; and

said second state is generated by the non conductive switch.

12. A programmable wire structure for an integrated circuit, comprising:

a programmable switch coupling two nodes, said switch comprised of:

a configurable element, the element further comprising:

a first state that connects said two nodes; and

a second state that disconnects said two nodes; and

a programmable means to configure the configurable element between said first and second states; and

a transistor gate material layer deposited on a silicon substrate layer, said switch fabricated substantially above said transistor gate material layer.

13. The structure of claim 12 , further comprising a first metal layer deposited substantially above said transistor gate material layer, wherein a first metal line is coupled to said switch.

14. The structure of claim 13 , further comprising a second metal layer deposited substantially above said first metal layer, wherein a second metal line is coupled to said switch.

15. The structure of claim 12 , wherein said configurable element comprises one of resistor, anti-fuse, capacitor, laser-fuse, electrical-fuse, diode, junction, SRAM cell, DRAM cell, metal, optional link, floating gate, EPROM cell, EEPROM cell, flash cell, ferro-electric element, photo-electric element, optical element, electro-chemical element, electrolytic element, Carbon nano-tube, electro-mechanical element, electro-magnetic element and magnetic element.

16. The structure of claim 12 , wherein said programmable switch comprises a pass-gate transistor.

17. The structure of claim 16 , wherein the pass-gate transistor is controlled by a configuration circuit comprising the configurable element.

18. The structure of claim 12 , wherein the programmable means further comprises: accessing an individual configurable element in an array of configurable elements; and programming the configurable element to achieve either the first or the second state.

19. A programmable semiconductor device, wherein:

a user programmable switch comprising a configurable element and a device to configure the element are positioned above a transistor gate material layer deposited on a silicon substrate layer.

20. The device in claim 19 , wherein the configurable element comprises one of resistor, anti-fuse, capacitor, laser-fuse, electrical-fuse, diode, junction, SRAM cell, DRAM cell, metal, optional link, floating gate, EPROM cell, EEPROM cell, flash cell, ferro-electric element, photo-electric element, optical element, electro-chemical element, electrolytic element, Carbon nano-tube, electro-mechanical element, electro-magnetic element and magnetic element.

Assignments (4)
MERGER Recorded Oct 9, 2015
From: YAKIMISHU CO. LTD., L.L.C.
To: CALLAHAN CELLULAR L.L.C.
Reel/Frame 036829/0821 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 31, 2011
From: TIER LOGIC, INC.
To: YAKIMISHU CO. LTD., LLC
Reel/Frame 026839/0396 →
CHANGE OF NAME Recorded Aug 29, 2011
From: VICICIV TECHNOLOGY, INC.
To: TIER LOGIC, INC.
Reel/Frame 026824/0623 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 6, 2007
From: MADURAWE, RAMINDA U
To: VICICIV TECHNOLOGY, INC.
Reel/Frame 019520/0314 →