Patent Assignment
Reel/Frame 019520/0314
Assignment of Assignor's Interest
Recorded: 2007-07-06
Received: 2007-07-06
Pages: 7
Assignor
MADURAWE, RAMINDA U
Executed: 2007-07-05
Assignee
VICICIV TECHNOLOGY, INC.
882 LOUISE DRIVE, SUNNYVALE, CA, 94087, UNITED STATES
Covered Properties
(53)
Semiconductor Devices Fabricated with Different Processing Options
Application:
11/801,738 →
Three Dimensional Integrated Circuits
Application:
11/801,739 →
Look-Up Table Structure with Embedded Carry Logic
Application:
11/728,839 →
Mpga Products Based on a Prototype Fpga
Application:
11/712,380 →
Look-Up Table Structure with Embedded Carry Logic
Application:
11/707,187 →
Integrated Circuits with Ram and Rom Fabrication Options
Application:
11/707,231 →
Bit Stream Compatible Fpga to Mpga Design Conversions
Application:
11/645,313 →
Programmable Interconnect Structures
Application:
11/593,182 →
Look-Up Table Based Logic Macro-Cells
Application:
11/546,681 →
Programmable Interconnect Structures
Application:
11/545,044 →
Programmable Structured Arrays
Application:
11/403,118 →
Alterable Application Specific Integrated Circuit (Asic)
Application:
11/400,122 →
Timing Exact Design Conversions from Fpga to Asic
Application:
11/384,116 →
Configurable Storage Device
Application:
11/365,032 →
Configuration Circuits for Programmable Logic Devices
Application:
11/365,031 →
Three dimensional integrated circuits
Application:
11/363,304 →
Configuration Circuit for Programmable Logic Devices
Application:
11/357,145 →
Field Programmable Structured Arrays
Application:
11/355,930 →
Look-Up Table Structure with Embedded Carry Logic
Application:
11/355,931 →
Look-Up Table Based Logic Macro-Cells
Application:
11/350,628 →
Methods for Fabricating Fuse Programmable Three Dimensional Integrated Circuits
Application:
11/102,855 →
Semiconductor switching devices
Application:
11/042,362 →
Programmable Interconnect Structures
Application:
11/040,731 →
Configuration Circuits for Three Dimensional Programmable Logic Devices
Application:
10/988,396 →
Insulated-Gate Field-Effect Thin Film Transistors
Application:
10/979,024 →
Three Dimensional Integrated Circuits
Application:
10/937,828 →
Semiconductor Switching Devices
Application:
10/912,697 →
Alterable Application Specific Integrated Circuit (Asic)
Application:
10/872,594 →
Semiconductor Devices Fabricated with Different Processing Options
Application:
10/864,092 →
Semiconductor Latches and Sram Devices
Application:
10/851,752 →
Methods for Fabricating Three Dimensional Integrated Circuits
Application:
10/846,698 →
Three Dimensional Integrated Circuits
Application:
10/846,699 →
Semiconductor Latches and Sram Devices
Application:
10/838,745 →
Programmable Devices with Convertibility to Customizable Devices
Application:
10/825,194 →
Semiconductor Latches and Sram Devices
Application:
10/764,048 →
Insulated-Gate Field-Effect Thin Film Transistors
Application:
10/762,627 →
Integrated Circuits with Ram and Rom Fabrication Options
Application:
10/751,324 →
Look-Up Table Based Logic Macro-Cells
Application:
10/743,894 →
Programmable Structured Arrays
Application:
10/727,170 →
Programmable Interconnect Structures
Application:
10/691,013 →
Configurable Storage Device
Application:
10/683,084 →
Semiconductor Switching Devices
Application:
10/413,809 →
Insulated-gate field-effect thin film transistors
Application:
10/413,808 →
Semiconductor Latches and Sram Devices
Application:
10/413,810 →
SRAM cell and cell arrays
Application:
60/449,011 →
Programmable multi-purpose flip-flop
Application:
60/419,208 →
Three dimensional integrated circuits
Application:
10/267,483 →
Field Programmable Gate Array with Convertibility to Application Specific Integrated Circuit
Application:
10/267,511 →
Methods for fabricating three dimensional integrated circuits
Application:
10/267,484 →
Thin film SRAM cell
Application:
60/402,573 →
Re-programmable ASIC
Application:
60/400,007 →
Wire replaceable thin film fuse and anti-fuse technology
Application:
60/397,070 →
Wire replaceable TFT SRAM cell and cell array technology
Application:
60/393,763 →