Patent Assignment
Reel/Frame 026839/0396
Assignment of Assignor's Interest
Recorded: 2011-08-31
Received: 2011-08-31
Pages: 17
Assignor
TIER LOGIC, INC.
Executed: 2011-07-24
Assignee
YAKIMISHU CO. LTD., LLC
160 GREENTREE DRIVE, SUITE 101, DOVER, DE, 19904, UNITED STATES
Covered Properties
(76)
Die Press Process for Manufacturing a Z-directed Component for a Printed Circuit Board
Application:
13/222,748 →
Three Dimensional Integrated Circuits
Application:
12/834,077 →
Programmable Logic Devices Comprising Time Multiplexed Programmable Interconnect
Application:
12/770,519 →
Low Power Programmable Logic Devices
Application:
12/567,088 →
Incrementer Based on Carry Chain Compression
Application:
12/480,213 →
Three Dimensional Integrated Circuits
Application:
12/254,629 →
Programmable Logic Devices Comprising Time Multiplexed Programmable Interconnect
Application:
12/245,753 →
Automated Metal Pattern Generation for Integrated Circuits
Application:
12/210,212 →
Thin Film Transistors and Fabrication Methods
Application:
12/207,064 →
Semiconductor Switching Devices and Fabrication Methods
Application:
12/207,110 →
Multi-Port Thin-Film Memory Devices
Application:
12/172,989 →
Programmable Logic Based Latches and Shift Registers
Application:
12/119,490 →
Programmable Logic Based Latches and Shift Registers
Application:
12/119,492 →
Three Dimensional Integrated Circuits
Application:
12/105,259 →
Timing Exact Design Conversions from FPGA to ASIC
Application:
12/104,377 →
Alterable Application Specific Integrated Circuit (Asic)
Application:
12/045,635 →
Programmable Interconnect Structures
Application:
12/032,667 →
Programmable Structured Arrays
Application:
12/018,243 →
Programmable Latch Based Multiplier
Application:
12/015,461 →
Using Programmable Latch to Implement Logic
Application:
11/964,084 →
Three Dimensional Integrated Circuits
Application:
11/985,822 →
Three Dimensional Programmable Devices
Application:
11/986,022 →
Pads and Pin-Outs in Three Dimensional Integrated Circuits
Application:
11/986,023 →
Multi-Port Memory Devices
Application:
11/986,025 →
Pad Invariant Fpga and Asic Devices
Application:
11/986,024 →
Insulated-gate field-effect thin film transistors
Application:
11/985,829 →
Look-Up Table Structure with Embedded Carry Logic
Application:
11/985,830 →
Semiconductor Devices Fabricated with Different Processing Options
Application:
11/801,738 →
Three Dimensional Integrated Circuits
Application:
11/801,739 →
Look-Up Table Structure with Embedded Carry Logic
Application:
11/728,839 →
Mpga Products Based on a Prototype Fpga
Application:
11/712,380 →
Look-Up Table Structure with Embedded Carry Logic
Application:
11/707,187 →
Integrated Circuits with Ram and Rom Fabrication Options
Application:
11/707,231 →
Bit Stream Compatible Fpga to Mpga Design Conversions
Application:
11/645,313 →
Programmable Interconnect Structures
Application:
11/593,182 →
Look-Up Table Based Logic Macro-Cells
Application:
11/546,681 →
Programmable Interconnect Structures
Application:
11/545,044 →
Configurable embedded multi-port memory
Application:
11/494,001 →
Programmable Structured Arrays
Application:
11/403,118 →
Alterable Application Specific Integrated Circuit (Asic)
Application:
11/400,122 →
Timing Exact Design Conversions from Fpga to Asic
Application:
11/384,116 →
Programmable Logic Devices Comprising Time Multiplexed Programmable Interconnect
Application:
11/369,541 →
Configurable Storage Device
Application:
11/365,032 →
Configuration Circuits for Programmable Logic Devices
Application:
11/365,031 →
Three dimensional integrated circuits
Application:
11/363,304 →
Configuration Circuit for Programmable Logic Devices
Application:
11/357,145 →
Field Programmable Structured Arrays
Application:
11/355,930 →
Look-Up Table Structure with Embedded Carry Logic
Application:
11/355,931 →
Look-Up Table Based Logic Macro-Cells
Application:
11/350,628 →
Methods for Fabricating Fuse Programmable Three Dimensional Integrated Circuits
Application:
11/102,855 →
Semiconductor switching devices
Application:
11/042,362 →
Programmable Interconnect Structures
Application:
11/040,731 →
Configuration Circuits for Three Dimensional Programmable Logic Devices
Application:
10/988,396 →
Insulated-Gate Field-Effect Thin Film Transistors
Application:
10/979,024 →
Three Dimensional Integrated Circuits
Application:
10/937,828 →
Semiconductor Switching Devices
Application:
10/912,697 →
Alterable Application Specific Integrated Circuit (Asic)
Application:
10/872,594 →
Semiconductor Devices Fabricated with Different Processing Options
Application:
10/864,092 →
Semiconductor Latches and Sram Devices
Application:
10/851,752 →
Methods for Fabricating Three Dimensional Integrated Circuits
Application:
10/846,698 →
Three Dimensional Integrated Circuits
Application:
10/846,699 →
Semiconductor Latches and Sram Devices
Application:
10/838,745 →
Programmable Devices with Convertibility to Customizable Devices
Application:
10/825,194 →
Semiconductor Latches and Sram Devices
Application:
10/764,048 →
Insulated-Gate Field-Effect Thin Film Transistors
Application:
10/762,627 →
Integrated Circuits with Ram and Rom Fabrication Options
Application:
10/751,324 →
Look-Up Table Based Logic Macro-Cells
Application:
10/743,894 →
Programmable Structured Arrays
Application:
10/727,170 →
Programmable Interconnect Structures
Application:
10/691,013 →
Configurable Storage Device
Application:
10/683,084 →
Semiconductor Switching Devices
Application:
10/413,809 →
Insulated-gate field-effect thin film transistors
Application:
10/413,808 →
Semiconductor Latches and Sram Devices
Application:
10/413,810 →
Three dimensional integrated circuits
Application:
10/267,483 →
Field Programmable Gate Array with Convertibility to Application Specific Integrated Circuit
Application:
10/267,511 →
Methods for fabricating three dimensional integrated circuits
Application:
10/267,484 →