Method and apparatus for improving thermal energy dissipation in a direct-chip-attach coupling configuration of an integrated circuit and a circuit board
View Patent ↗A method and apparatus for improving the thermal conductivity of a circuit board (CB) assembly comprising an integrated circuit (IC) die mounted on a CB. A high thermal conductivity device is attached on a first end to a surface of the die. When the die is mounted on the CB, a void formed in the CB receives a second end of the HTC device, and the second end of the HTC device comes into contact with a portion of the CB. During operation of the die, heat produced by the die is dissipated through the HTC device and into the CB.
1. A circuit board (CB) assembly comprising:
a CB including one or more electrical connections, and a substantially conical shaped void formed therein;
an integrated circuit (IC) die mounted to a side of the CB, the die including one or more electrical circuits and one or more electrical connections, at least one of the electrical connections on the CB being in contact with at least one of the electrical connections on the die; and
a high thermal conductivity (HTC) device comprising a substantially conical shape that is complimentary relative to the substantially conical shaped void, the HTC device having a first end and a second end, the HTC device being at least partially disposed in the void, such that the first end of the HTC device is thermally coupled to the die, and the second end of the HTC device is thermally coupled to a portion of the CB below the void, the HTC device and void provide a self-alignment feature for the die relative to the CB.
2. The CB assembly of claim 1 , wherein the die is mounted to the CB in a direct-chip-attach configuration.
3. The CB assembly of claim 1 , wherein the CB is a single-layer CB.
4. The CB assembly of claim 1 , wherein the CB comprises:
a first layer comprising a first side and a second side, wherein the die is attached adjacent to the first side of the first layer; and
a stiffener layer disposed adjacent to the second side of the first layer; wherein the void extends through at least the first layer down to the stiffener layer, the second end of the HTC device being in contact with the stiffener layer, and wherein the stiffener layer comprises a high thermal conductivity material.
5. The CB of claim 1 , wherein the HTC devices comprises a thermally conductive elastomer.
6. The CB of claim 1 , wherein the HTC device comprises a thermoplastic.
7. The CB of claim 1 , wherein the HTC device comprises a metal.
8. The CB of claim 7 , wherein the metal is solder.
9. A circuit board (CB) assembly comprising:
a CB including one or more electrical connections, and a substantially conical shaped void formed therein;
an integrated circuit (IC) die mounted to a side of the CB, the die including one or more electrical circuits and one or more electrical connections, at least one of the electrical connections on the CB being in contact with at least one of the electrical connections on the die; and
a high thermal conductivity (HTC) device comprising a substantially conical shape that is complimentary relative to the substantially conical shaped void, the HTC device having a first end and a second end, the HTC device being at least partially disposed in the void, such that the first end of the HTC device is attached to the die, and the second end of the HTC device is attached to or is in close proximity with a portion of the CB below the void, the HTC device and void provide a self-alignment feature for the die relative to the CB.
10. A circuit board (CB) assembly comprising:
a CB including one or more electrical connections, and a substantially conical shaped void formed therein;
an integrated circuit (IC) die mounted to a side of the CB, the die including one or more electrical circuits and one or more electrical connections, at least one of the electrical connections on the CB being in contact with at least one of the electrical connections on the die; and
a high thermal conductivity (HTC) material comprising a substantially conical shape that is complimentary relative to the substantially conical shaped void, the HTC material being at least partially disposed in the void, such that the HTC material is thermally coupled to the die, and the HTC material is thermally coupled to a portion of the CB below the void, the HTC material and void provide a self-alignment feature for the die relative to the CB.
11. The circuit board (CB) assembly of claim 10 , wherein the high thermal conductivity (HTC) material includes an HTC device having a first end and a second end.
12. The circuit board (CB) assembly of claim 11 , wherein the first end of the HTC device is thermally coupled to the die and the second end of the HTC device is thermally coupled to a portion of the CB below the void.
13. The circuit board (CB) assembly of claim 10 , wherein the high thermal conductivity (HTC) material comprises a material having a thermal conductivity which is higher than a thermal conductivity of the circuit board.
14. The circuit board (CB) assembly of claim 10 , wherein the high thermal conductivity (HTC) material comprises one of a thermally conductive elastomer, a thermoplastic, and a metal.