Vacuum wafer-level packaging for SOI-MEMS devices
View Patent ↗A device and method for fabricating the device is disclosed. The device includes a substrate having an active layer disposed on a sacrificial layer. A trench is formed in the active layer to electrically isolate first and second regions in the active layer, and a non-conductive material is deposited on the substrate such that the non-conductive material fills the trench to form a substantially planar surface for support of further components of the device. In some cases, the non-conductive material fills only a portion of the trench sufficient to form the substantially planar surface. The non-conductive material may include silicon nitride.
1. A method of fabricating a device, the method comprising the steps of:
forming a trench in an active layer of a silicon-on-insulator substrate having a sacrificial layer on which the active layer is disposed, the trench being configured to electrically isolate first and second regions of the active layer;
depositing a non-conductive material on the substrate such that the non-conductive material fills the trench to form a substantially planar support surface above the trench and the first and second regions of the active layer;
forming a MEMS device structure from the active layer in the first region;
forming a conductive interconnect line that crosses over the trench via the substantially planar support surface for an electrical connection with the MEMS device structure; and
bonding a cap wafer to the silicon-on-insulator substrate in a bonding area through which the conductive interconnect line passes, the bonding step forming an encapsulation region in which the MEMS device structure and the trench are entirely disposed.
2. The method of claim 1 , wherein the depositing step fills a portion of the trench sufficient to form the substantially planar surface.
3. The method of claim 1 , wherein the non-conductive material comprises silicon nitride.
4. The method of claim 1 , wherein the non-conductive material comprises low-stress silicon nitride.
5. The method of claim 1 , further comprising the step of forming an insulator disposed on the interconnect line to accommodate a bonding encapsulation material.
6. The method of claim 1 , further comprising the step of forming a wire bond pad disposed on the second region of the active layer and connected to the respective device structure via the conductive interconnect line such that the wire bond pad is disposed outside of the encapsulation region.
7. A method of fabricating a device, the method comprising the steps of:
forming a trench in an active layer of a silicon-on-insulator substrate having a sacrificial layer on which the active layer is disposed, the trench being configured to electrically isolate first and second regions of the active layer;
depositing a non-conductive material on the substrate such that the non-conductive material sufficiently fills the trench;
forming a MEMS device structure from the active layer in the first region;
forming a conductive interconnect line that crosses over the trench for an electrical connection with the MEMS device structure; and
bonding a cap wafer to the silicon-on-insulator substrate in a bonding area through which the conductive interconnect line passes, the bonding step forming an encapsulation region in which the MEMS device structure and the trench are entirely disposed;
wherein the non-conductive material sufficiently fills the trench to structurally support the conductive interconnect line across the trench.
8. The method of claim 7 , wherein the depositing step fills a portion of the trench sufficient to form a substantially planar surface.
9. The method of claim 7 , wherein the non-conductive material comprises silicon nitride.
10. The method of claim 7 , wherein the non-conductive material comprises low-stress silicon nitride.
11. The method of claim 7 , further comprising the step of forming a wire bond pad disposed on the second region of the active layer and connected to the respective device structure via the conductive interconnect line such that the wire bond pad is disposed outside of the encapsulation region.