IP Library Granted Patent US 7,449,968
Granted Patent B1
US 7,449,968 · App. 11/417,739 · Granted Nov 11, 2008

Frequency and temperature compensation synthesis for a MEMS resonator

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Quick Facts
Patent No.
US 7,449,968
App. No.
11/417,739
Granted
Nov 11, 2008
Kind
B1
Abstract

Disclosed herein is a signal generation technique based on a reference frequency provided by a MEMS resonator. The signal generation technique compensates for temperature- and fabrication process-induced frequency variations collectively. In some embodiments, a device implementing the disclosed signal generation technique includes a fractional-N synthesizer, a temperature sensor, calibration data, and a sigma-delta modulator to adjust the reference frequency of the MEMS resonator to a desired frequency value while compensating for the temperature variation of the MEMS resonator.

Claims (44)

1. A device for generation of an output signal having a desired frequency, the device comprising:

a MEMS resonator to generate a reference signal;

a frequency synthesizer to develop the output signal from the reference signal;

a temperature sensor to generate an analog indication of an operating temperature for the MEMS resonator;

an analog-to-digital converter to develop a digital representation of the operating temperature from the analog indication thereof, the digital representation having a resolution of at least 11 bits; and,

a controller to compile frequency compensation contributions from the digital representation of the operating temperature and a digital indication of the desired frequency to generate a synthesizer control signal provided to the frequency synthesizer.

2. The device of claim 1 , wherein the controller determines the frequency compensation contribution from the digital representation of the operating temperature based on a linear temperature characteristic for the MEMS resonator.

3. The device of claim 1 , wherein the controller is calibrated to generate the synthesizer control signal from a composite compensation factor based on a linear function of the digital representation of the operating temperature.

4. The device of claim 3 , wherein the linear function comprises a pair of linear segments about a reference point.

5. The device of claim 4 , wherein the controller is calibrated with data indicative of respective slopes of the pair of linear segments.

6. The device of claim 3 , wherein the linear function is a piecewise linear approximation.

7. The device of claim 3 , wherein the analog-to-digital converter is configured to develop the digital representation of the operating temperature within an accuracy of 0.1 C.

8. The device of claim 3 , wherein the synthesizer control signal comprises phase-locked loop (PLL) division factors for the frequency synthesizer.

9. The device of claim 3 , wherein the linear function is further based on an initial frequency offset of the MEMS resonator from the desired frequency.

10. The device of claim 9 , wherein the controller comprises a memory in which data indicative of the linear function is stored, the data comprising multiple slope parameters and a reference point.

11. A method of frequency compensation for a desired output frequency in connection with a MEMS resonator, the method comprising the steps of:

receiving a resonator signal from the MEMS resonator;

providing a temperature signal indicative of an operating temperature for the MEMS resonator;

determining a composite frequency compensation parameter in accordance with multiple slope quantities for a piecewise linear approximation based on the temperature signal and the desired output frequency; and,

generating an output signal having the desired output frequency using a frequency synthesizer based on the composite frequency compensation parameter;

wherein the providing step comprises the step of converting the temperature signal from an analog representation of the operating temperature into a digital representation of the operating temperature; and

wherein the converting step is performed such that the digital representation of the operating temperature is within an accuracy of 0.1 C.

12. The method of claim 11 , wherein the piecewise linear approximation is a function of the operating temperature.

13. The method of claim 12 , wherein the generating step comprises the step of developing a synthesizer control signal from the composite frequency compensation parameter.

14. The method of claim 13 , wherein the synthesizer control signal comprises data indicative of phase-locked loop (PLL) division factors.

15. The method of claim 12 , wherein the piecewise linear approximation is further based on an initial frequency offset of the MEMS resonator from the desired output frequency.

16. A device to generate an output signal having a desired frequency in connection with a MEMS resonator, the device comprising:

an analog-to-digital converter to develop a digital representation of an operating temperature for the MEMS resonator;

a controller to generate a control signal based on the digital representation of the operating temperature, the controller comprising a memory and control logic, wherein the memory stores data comprising multiple slope quantities for a piecewise linear approximation of a composite frequency compensation factor, and wherein the control logic is configured to determine the composite frequency compensation factor based on the piecewise linear approximation and the digital representation of the operating temperature; and,

a phase-locked loop (PLL) circuit comprising a divider configured to be responsive to the control signal to synthesize the desired frequency;

wherein the analog-to-digital converter is configured to develop the digital representation of the operating temperature within an accuracy of 0.1 C.

17. The device of claim 16 , wherein the piecewise linear approximation is further based on an initial frequency offset of the MEMS resonator from the desired frequency.

18. A device to generate an output signal having a desired frequency in connection with a MEMS resonator, the device comprising:

an analog-to-digital converter to develop a digital representation of an operating temperature for the MEMS resonator;

a controller to generate a control signal based on the digital representation of the operating temperature the controller comprising a memory and control logic, wherein the memory stores data comprising multiple slope quantities for a piecewise linear approximation of a composite frequency compensation factor, and wherein the control logic is configured to determine the composite frequency compensation factor based on the piecewise linear approximation and the digital representation of the operating temperature; and,

a phase-locked loop (PLL) circuit comprising a divider configured to be responsive to the control signal to synthesize the desired frequency;

wherein the analog-to-digital converter is configured such that the digital representation has a resolution of at least 11 bits.

19. A method of frequency compensation for a desired output frequency in connection with a MEMS resonator, the method comprising the steps of:

receiving a resonator signal from the MEMS resonator;

providing an analog temperature signal indicative of an operating temperature for the MEMS resonator;

converting the analog temperature signal into a digital representation of the operating temperature having a resolution of at least 11 bits;

determining a composite frequency compensation parameter in accordance with the digital representation of the operating temperature and the desired output frequency; and,

generating an output signal having the desired output frequency using a frequency synthesizer based on the composite frequency compensation parameter.

20. The method of claim 19 , wherein the determining step comprises calculating the composite frequency compensation parameter based on a piecewise linear function of the digital representation of the operating temperature.

Assignments (11)
INTELLECTUAL PROPERTY BUY-IN AGREEMENT/ASSIGNMENT Recorded Apr 4, 2023
From: MICREL LLC
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 063241/0771 →
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 4, 2013
From: DISCERA, INC.
To: MICREL, INCORPORATED
Reel/Frame 031346/0685 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 14, 2006
From: CIOFFI, KENNETH R.; LACROIX, DIDIER
To: DISCERA, INC.
Reel/Frame 018101/0520 →