Semiconductor mask inspection using die-to-die and die-to-database comparisons
View Patent ↗A mask forming method includes preparing design data of mask including pattern regions having identical repetition patterns respectively, generating mask pattern data of mask based on the design data, generating inspection control information for controlling inspection of defect on mask based on the mask pattern data, the information including positional information of the pattern regions and inspection sensitivity information of the repetition pattern, providing the inspection control information to mask pattern data, forming mask pattern of mask based on the mask pattern data, and inspecting the mask pattern based on the mask pattern data comprising inspecting portion in the mask pattern different from the pattern regions by Die-to-Database comparison method, the inspecting the portion including selecting portion corresponding to repetition pattern from the mask pattern based on the positional information, and inspecting the selected portion by Die-to-Die comparison method at an inspection sensitivity corresponding to inspection sensitivity information.
1. A mask forming method comprising:
preparing design data of a mask including a plurality of tri-tone regions and a plurality of pattern regions, the plurality of pattern regions including identical repetition patterns;
generating mask pattern data of the mask based on the design data;
generating inspection control information for controlling inspection of a defect on the mask based on the mask pattern data, the inspection control information including information including coordinates of the identical repetition patterns, coordinates of the plurality of tri-tone regions, and inspection sensitivity information of the identical repetition patterns and of the plurality of tri-tone regions;
generating an item of drawing-inspection data having the mask pattern data and the inspection control information by combining the inspection control information with the mask pattern data, wherein the item of drawing-inspection data is for use in forming and in inspecting a mask pattern of the mask;
forming the mask pattern of the mask based on the item of drawing-inspection data which is generated before forming the mask pattern; and
inspecting the mask pattern based on the item of drawing-inspection data, wherein the inspecting the mask pattern comprises:
inspecting a first portion in the mask pattern which is different from the plurality of pattern regions by a Die-to-Database comparison method,
selecting a second portion corresponding to one of the identical repetition patterns in the plurality of pattern regions based on the positional information in the item of drawing-inspection data, and
inspecting the second portion by a Die-to-Die comparison method at an inspection sensitivity corresponding to the inspection sensitivity information in the item of drawing-inspection data.
2. The method according to claim 1 , wherein the inspecting the first portion and the inspecting the second portion are performed by same mask defect inspection apparatus.
3. The method according to claim 2 , wherein an inspection sensitivity at the time of inspecting the mask pattern by the Die-to-Die comparison method is higher than an inspection sensitivity at the time of inspecting the mask pattern by the Die-to-Database comparison method.
4. The method according to claim 3 , wherein the mask comprises:
a transparent substrate which transmits light;
a light shielding pattern which is provided on the transparent substrate and shields the light; and
a semitransparent pattern which is provided on a region including a portion of the light shielding pattern and transmits part of the light,
wherein the inspection control information comprises positional information of a region including a laminated structure portion and the inspection sensitivity information, the laminated structure portion comprising the transparent substrate, the light shielding pattern and the semitransparent pattern, the inspection sensitivity information for use in inspecting the laminated structure portion by Die-to-Database comparison method.
5. The method according to claim 2 , wherein the mask comprises:
a transparent substrate which transmits light;
a light shielding pattern which is provided on the transparent substrate and shields the light; and
a semitransparent pattern which is provided on a region including a portion of the light shielding pattern and transmits part of the light,
wherein the inspection control information comprises positional information of a region including a laminated structure portion and the inspection sensitivity information, the laminated structure portion comprising the transparent substrate, the light shielding pattern and the semitransparent pattern, the inspection sensitivity information for use in inspecting the laminated structure portion by the Die-to-Database comparison method.
6. The method according to claim 1 , wherein an inspection sensitivity at the time of inspecting the mask pattern by the Die-to-Die comparison method is higher than an inspection sensitivity at the time of inspecting the mask pattern by the Die-to-Database comparison method.
7. The method according to claim 6 , wherein the mask comprises:
a transparent substrate which transmits light;
a light shielding pattern which is provided on the transparent substrate and shields the light; and
a semitransparent pattern which is provided on a region including a portion of the light shielding pattern and transmits part of the light,
wherein the inspection control information comprises positional information of a region including a laminated structure portion and the inspection sensitivity information, the laminated structure portion comprising the transparent substrate, the light shielding pattern and the semitransparent pattern, the inspection sensitivity information for use in inspecting the laminated structure portion by the Die-to-Database comparison method.
8. The method according to claim 1 , wherein the mask comprises:
a transparent substrate which transmits light;
a light shielding pattern which is provided on the transparent substrate and shields the light; and
a semitransparent pattern which is provided on a region including a portion of the light shielding pattern and which transmits part of the light,
wherein the inspection control information includes positional information of a region which includes a laminated structure portion of the transparent substrate, the light shielding pattern and the semitransparent pattern based on the mask pattern data, and inspection sensitivity information for inspecting the laminated structure portion by the Die-to-Database comparison method.
9. The method according to claim 1 , wherein the mask pattern data is generated based on the design data in order to correct a pattern distortion that occurs when forming the mask pattern.
10. The method according to claim 1 , wherein the mask pattern data is generated based on the design data using an optical proximity effect correction process.
11. A semiconductor device manufacturing method comprising:
applying a resist on a substrate including a semiconductor substrate;
forming a resist pattern including disposing a mask formed by a mask forming method, irradiating an optical beam or electric charge beam on the resist via the mask and developing the resist; and
forming a pattern by etching the substrate using the resist pattern,
wherein the mask forming method comprises:
preparing design data of the mask including a plurality of tri-tone regions and a plurality of pattern regions, the plurality of pattern regions including identical repetition patterns;
generating mask pattern data of the mask based on the design data;
generating inspection control information for controlling inspection of a defect on the mask based on the mask pattern data, the inspection control information including information regions including coordinates of the identical repetition patterns, coordinates of the plurality of tri-tone regions, and inspection sensitivity information of the identical repetition patterns and of the plurality of tri-tone regions;
generating an item of drawing-inspection data having the mask pattern data and the inspection control information by combining the inspection control information with the mask pattern data, wherein the item of drawing-inspection data is for use in forming and in inspecting a mask pattern of the mask;
forming the mask pattern of the mask based on the item of drawing-inspection data which is generated before forming the mask pattern; and
inspecting the mask pattern based on the item of drawing-inspection data,
wherein the inspecting the mask pattern comprises:
inspecting a first portion in the mask pattern which is different from the plurality of pattern regions by a Die-to-Database comparison method,
selecting a second portion corresponding to one of the identical repetition patterns in the plurality of pattern regions based on the positional information in the item of drawing-inspection data, and
inspecting the second portion by a Die-to-Die comparison method at an inspection sensitivity corresponding to the inspection sensitivity information in the item of drawing-inspection data.
12. The method according to claim 11 , wherein the inspecting the first portion and the inspecting the second portion are performed by same mask defect inspection apparatus.
13. The method according to claim 12 , wherein an inspection sensitivity at the time of inspecting the mask pattern by the Die-to-Die comparison method is higher than an inspection sensitivity at the time of inspecting the mask pattern by the Die-to-Database comparison method.
14. The method according to claim 13 , wherein the inspection control information comprises positional information of a region including a laminated structure portion and the inspection sensitivity information, the laminated structure portion comprising a transparent substrate, a light shielding pattern, and a semitransparent pattern, the inspection sensitivity information for use in inspecting the laminated structure portion by the Die-to-Database comparison method.
15. The method according to claim 12 , wherein the inspection control information comprises positional information of a region including a laminated structure portion, and the inspection sensitivity information, the laminated structure portion comprising a transparent substrate, a light shielding pattern, and a semitransparent pattern, the inspection sensitivity information for use in inspecting the laminated structure portion by the Die-to-Database comparison method.
16. The method according to claim 11 , wherein an inspection sensitivity at the time of inspecting the mask pattern by the Die-to-Die comparison method is higher than an inspection sensitivity at the time of inspecting the mask pattern by the Die-to-Database comparison method.
17. The method according to claim 16 , wherein the inspection control information comprises positional information of a region including a laminated structure portion and the inspection sensitivity information, the laminated structure portion comprising a transparent substrate, a light shielding pattern, and a semitransparent pattern, and the inspection sensitivity information for use in inspecting the laminated structure portion by the Die-to-Database comparison method.
18. The method according to claim 11 , wherein the mask comprises:
a transparent substrate which transmits light;
a light shielding pattern which is provided on the transparent substrate and shields the light; and
a semitransparent pattern which is provided on a region including a portion of the light shielding pattern and which transmits part of the light,
wherein the inspection control information comprises positional information of a region including a laminated structure portion and the inspection sensitivity information, the laminated structure portion comprising the transparent substrate, the light shielding pattern and the semitransparent pattern, the inspection sensitivity information for use in inspecting the laminated structure portion by Die-to-Database comparison method.
19. The method according to claim 11 , wherein the mask pattern data is generated based on the design data in order to correct a pattern distortion that occurs when forming the mask pattern.
20. The method according to claim 11 , wherein the mask pattern data is generated based on the design data using an optical proximity effect correction process.