IP Library Granted Patent US 7,650,579
Granted Patent B2
US 7,650,579 · App. 11/441,367 · Granted Jan 19, 2010

Model correspondence method and device

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Quick Facts
Patent No.
US 7,650,579
App. No.
11/441,367
Granted
Jan 19, 2010
Kind
B2
Abstract

A method and device for determining memory element and intermediate point correspondences between design models is disclosed. The method includes developing graph representations of two circuit design models of an electronic device. The circuit design models each include input and output nodes corresponding to input and output nodes of the electronic device. The circuit design models also include memory and intermediate nodes corresponding to memory elements and intermediate points, respectively of the electronic device. An intermediate point represents a point between memory elements of the electronic device, and so can represent logic gates or other modules of the device. Memory elements and intermediate points can be referred to collectively as circuit elements. Nodes in the graph representation represent inputs, outputs, memory elements or intermediate points in the design models. A correspondence between the circuit elements in circuit design models is determined based on the graph representations.

Claims (53)

1. A method comprising:

associating at a processor a first label to a first vertex associated with a first circuit design model, wherein the first vertex is representative of a first circuit element of the first circuit design model;

associating at the processor a first set of labels to a plurality of input and output nodes associated with the first circuit design model, wherein the plurality of input and output nodes is representative of a first set of inputs and outputs of the first circuit design model;

associating at the processor a second set of labels to a plurality of vertices associated with the first circuit design model, wherein the plurality of vertices is associated with a plurality of circuit elements coupled to the first circuit element of the first circuit design model;

determining at the processor a second label for the first vertex based on the first set of labels and the second set of labels; and

determining at the processor a first correspondence between the first circuit design model and a second circuit design model based on the second label for the first vertex;

associating at the processor a third label to a second vertex associated with the second circuit design model, wherein the second vertex is representative of a first circuit element of the second circuit design model;

associating at the processor the first set of labels to a plurality of input and output nodes associated with the second circuit design model, wherein the plurality of input and output nodes is representative of a set of inputs and outputs of the second circuit design model;

associating at the processor a third set of labels to a plurality of vertices associated with the second circuit design model, wherein the plurality of vertices is associated with a plurality of circuit elements coupled to the first circuit element of the second circuit design model;

determining at the processor a fourth label for the second vertex based on the first set of labels and the third set of labels;

wherein the first correspondence between the first circuit design model and the second circuit design model is further based on the fourth label.

2. The method of claim 1 , further comprising:

associating at the processor a third label to an edge between the first vertex and one of the plurality of vertices, associated with the first circuit design model, wherein the edge is representative of a logic path between the first circuit element and a second circuit element of the first circuit design model;

wherein the second label is further based on the third label.

3. The method of claim 2 , wherein the third label is based on a direction of the logic path.

4. The method of claim 1 , further comprising:

associating at the processor a third label to the first vertex based on the first correspondence.

5. The method of claim 4 , wherein the third label is a prime number.

6. The method of claim 4 , further comprising:

determining at the processor a label for a second vertex of the first circuit design model based on the third label and the first set of labels.

7. The method of claim 1 , wherein the first circuit element is a storage element of the first circuit design model.

8. The method of claim 1 , wherein the first circuit element is an intermediate point of the first circuit design model.

9. The method of claim 1 , wherein the first circuit model is selected from the group consisting of a Register Transfer Level (RTL) model, a transistor circuit level model, and a gate level model.

10. The method of claim 1 , further comprising:

determining at the processor an Nth set of labels for the first set of vertices by iteratively calculating N sets of labels for the first set of vertices, wherein the Nth set of labels is calculated based on the first set of labels and the N−1 set of labels.

11. The method of claim 10 , further comprising:

a) determining at the processor an N+1th set of labels for the first set of vertices by iteratively calculating N+1 sets of labels for the first set of vertices, wherein the N+1th set of labels is calculated based on the first set of labels and the Nth set of labels;

b) detecting at the processor a match between the N+1th set of labels to the Nth set of labels;

c) incrementing N; and

d) repeating a) through c) until a predetermined number of matches have been detected.

12. The method of claim 1 , further comprising:

generating at the processor the first set of vertices based on a data file associated with the first circuit design model;

generating at the processor the plurality of input and output nodes based on the data file.

13. A computer readable medium tangibly embodying a program of instructions to be executed by a processor, the program of instructions comprising:

instructions to associate a first label to a first vertex associated with a first circuit design model, wherein the first vertex is representative of a first circuit element of the first circuit design model;

instructions to associate a first set of labels to a plurality of input and output nodes associated with the first circuit design model, wherein the plurality of input and output nodes is representative of a first set of inputs and outputs of the first circuit design model;

instructions to associate a second set of labels to a plurality of vertices associated with the first circuit design model, wherein the plurality of vertices is associated with a plurality of circuit elements coupled to the first circuit element of the first circuit design model;

instructions to determine a second label for the first vertex based on the first set of labels and the second set of labels; and

instructions to determine a first correspondence between the first circuit design model and a second circuit design model based on the second label for the first vertex;

instructions to associate a third label to a second vertex associated with the second circuit design model, wherein the second vertex is representative of a first circuit element of the second circuit design model;

instructions to associate the first set of labels to a plurality of input and output nodes associated with the second circuit design model, wherein the plurality of input and output nodes is representative of a set of inputs and outputs of the second circuit design model;

instructions to associate a third set of labels to a plurality of vertices associated with the second circuit design model, wherein the plurality of vertices is associated with a plurality of circuit elements coupled to the first circuit element of the second circuit design model;

instructions to determine a fourth label for the second vertex based on the first set of labels and the third set of labels; and

wherein the first correspondence between the first circuit design model and the second circuit design model is further based on the second label and the fourth label.

14. The computer readable medium of claim 13 , further comprising:

instructions to associate a third label to an edge between the first vertex and one of the plurality of vertices, associated with the first circuit design model, wherein the edge is representative of a logic path between the first circuit element and a second circuit element of the first circuit design model;

wherein the second label is further based on the third label.

15. The computer readable medium of claim 14 , wherein the third label is based on a direction of the logic path.

16. The computer readable medium of claim 13 , further comprising:

instructions to associate a third label to the first vertex based on the first correspondence.

17. The computer readable medium of claim 16 , wherein the third label is a prime number.

18. The computer readable medium of claim 16 , further comprising:

instructions to determine a label for a second vertex of the first circuit design model based on the third label and the first set of labels.

Assignments (38)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 053547/0421 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
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CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE LISTED CHANGE OF NAME SHOULD BE MERGER AND CHANGE PREVIOUSLY RECORDED AT REEL: 040652 FRAME: 0180. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME. Recorded Jan 12, 2017
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
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CHANGE OF NAME Recorded Nov 8, 2016
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 040652/0180 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 12, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
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SECURITY AGREEMENT Recorded Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
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SECURITY AGREEMENT Recorded Jun 18, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
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SECURITY AGREEMENT Recorded Sep 3, 2010
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
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SECURITY AGREEMENT Recorded Sep 3, 2010
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
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SECURITY AGREEMENT Recorded Sep 1, 2010
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 024915/0777 →
SECURITY AGREEMENT Recorded Sep 1, 2010
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
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SECURITY AGREEMENT Recorded May 13, 2010
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 024397/0001 →
SECURITY AGREEMENT Recorded Feb 2, 2007
From: FREESCALE SEMICONDUCTOR, INC.; FREESCALE ACQUISITION CORPORATION; FREESCALE ACQUISITION HOLDINGS CORP.; FREESCALE HOLDINGS (BERMUDA) III, LTD.
To: CITIBANK, N.A. AS COLLATERAL AGENT
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ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2006
From: ABADIR, MAGDY S.; ANAND, HIMYANSHU; SEN, M. ALPER; BHADRA, JAYANTA
To: FREESCALE SEMICONDUCTOR, INC.
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