IP Library Granted Patent US 7,626,190
Granted Patent B2
US 7,626,190 · App. 11/445,801 · Granted Dec 1, 2009

Memory device, in particular phase change random access memory device with transistor, and method for fabricating a memory device

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Quick Facts
Patent No.
US 7,626,190
App. No.
11/445,801
Granted
Dec 1, 2009
Kind
B2
Abstract

A memory device, in particular to a resistively switching memory device such as a Phase Change Random Access Memory (“PCRAM”), with a transistor is disclosed. Further, the invention relates to a method for fabricating a memory device. According one embodiment of the invention, a memory device is provided, having at least one nanowire or nanotube or nanofibre access transistor. In one embodiment, the nanowire or nanotube or nanofibre access transistor directly contacts a switching active material of the memory device. According to an additional embodiment, a memory device includes at least one nanowire or nanotube or nanofibre transistor with a vertically arranged nanowire or nanotube or nanofibre.

Claims (8)

1. A memory device, comprising: a transistor comprising at least one nanowire or nanotube or nanofibre and a transistor gate region, the nanowire or nanotube or nanofibre being self-aligned with respect to the transistor gate region; wherein the memory device is a resistively switching memory device; and wherein the nanowire or nanotube or nanofibre directly contacts a switching active material of the resistively switching memory device.

2. The memory device of claim 1 , wherein a contacting area between the nanowire or nanotube or nanofibre and the switching active material of the resistively switching memory device has a width and/or length and/or diameter smaller than 1 l F.

3. The memory device of claim 1 , wherein a contacting area between the nanowire or nanotube or nanofibre and the switching active material of the resistively switching memory device has a width and/or length and/or diameter between 0.1 F and 1 F.

4. The memory device of claim 1 , wherein a contacting area between the nanowire or nanotube or nanofibre and the switching active material of the resistively switching memory device has a width and/or length and/or diameter between 0.2 F and 0.5 F.

5. The memory device of claim 1 , wherein the switching active material comprises a chalcogenide or a chalcogenide compound material.

6. The memory device of claim 5 , wherein the switching active material comprises a GST compound material.

7. A memory device, comprising: a transistor comprising at least one vertically arranged nanowire or nanotube or nanofibre and a transistor gate region, the nanowire or nanotube or nanofibre being self-aligned with respect to the transistor gate region, wherein the memory device is a resistively switching memory device; and wherein one end of the vertically arranged nanowire or nanotube or nanofibre directly contacts a switching active material of the resistively switching memory device.

8. The memory device of claim 7 , wherein another end of the vertically arranged nanowire or nanotube or nanofibre directly contacts a current line.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 30, 2015
From: INFINEON TECHNOLOGIES AG
To: POLARIS INNOVATIONS LIMITED
Reel/Frame 037171/0719 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 19, 2015
From: INFINEON TECHNOLOGIES AG
To: POLARIS INNOVATIONS LIMITED
Reel/Frame 037147/0487 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 8, 2015
From: QIMONDA AG
To: INFINEON TECHNOLOGIES AG
Reel/Frame 035623/0001 →