IP Library Granted Patent US 7,292,485
Granted Patent B1
US 7,292,485 · App. 11/461,200 · Granted Nov 6, 2007

SRAM having variable power supply and method therefor

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Quick Facts
Patent No.
US 7,292,485
App. No.
11/461,200
Granted
Nov 6, 2007
Kind
B1
Abstract

A memory circuit has a memory array with a first line of memory cells, a second line of memory cells, a first power supply terminal, a first capacitance structure, a first power supply line coupled to the first line of memory cells; and a second power supply line coupled to the second line of memory cells. For the case where the second line of memory cells is selected for writing, a switching circuit couples the power supply terminal to the first power supply line, decouples the first power supply line from the second line of memory cells, and couples the second power supply line to the first capacitance structure. The result is a reduction in power supply voltage to the selected line of memory cells by charge sharing with the capacitance structure. This provides more margin in the write operation on a cell in the selected line of memory cells.

Claims (65)

1. A memory circuit, comprising:

a memory array comprising a first line of memory cells and a second line of memory cells;

a first power supply terminal;

a first capacitance structure includes a plurality of dummy cells;

a first power supply line coupled to the first line of memory cells;

a second power supply line coupled to the second line of memory cells; and

a switching circuit that has transistors that, connected between the first power supply terminal, the first power supply line, the second power supply line and the first capacitance structure wherein when the second line of memory cells is selected for writing, couple the first power supply terminal to the first power supply line, decouple the first power supply terminal from the second line of memory cells, and couple the second power supply line to the first capacitance structure.

2. The memory circuit of claim 1 , wherein the first line of memory cells comprises a first column of memory cells and the second line of memory cells comprises a second line of memory cells.

3. The memory circuit of claim 1 , wherein the first capacitance structure comprises:

a dummy line; and

the plurality of dummy cells coupled to the dummy line.

4. The memory circuit of claim 3 , further comprising a first dummy cell adjacent to but not coupled to the dummy line.

5. The memory circuit of claim 1 , wherein the first power supply terminal comprises a positive power supply terminal.

6. The memory circuit of claim 1 , wherein the switching circuit further comprises a switching transistor coupled between the capacitance structure and a voltage reference terminal.

7. The memory circuit of claim 6 , wherein the voltage reference terminal comprises a ground terminal.

8. The memory circuit of claim 1 , wherein the first line of memory cells comprises a first row of memory cells and the second line of memory cells comprises a second row of memory cells.

9. The memory of claim 1 , further comprising:

a second power supply terminal;

a third line of memory cells intersecting the first and second line of memory cells;

a fourth line of memory cells intersecting the first and second line of memory cells;

a second capacitance structure;

a third power supply line coupled to the third line of memory cells; and

a fourth power supply line coupled to the fourth line of memory cells; wherein

the switching circuit further comprising transistors that, when the fourth line of memory cells is selected for writing, couple the second power supply terminal to the third power supply line, decouple the second power supply terminal from the fourth line of memory cells, and couple the fourth power supply line to the second capacitance structure.

10. The memory circuit of claim 9 , wherein:

the first and second lines of memory cells comprise columns;

the third and fourth lines of memory cells comprise rows;

the first power supply terminal comprises a positive power supply terminal;

the second power supply terminal comprises a negative power supply terminal;

the first capacitance structure comprises a first line and a first plurality of dummy cells coupled to the first line; and

the second capacitance structure comprises a second line and a second plurality of dummy cells coupled to the second line.

11. The memory circuit of claim 1 , further comprising a voltage clamp coupled between the first power supply terminal and the first power supply line.

12. A method, comprising:

providing a memory comprising:

a memory array comprising a first line of memory cells and a second line of memory cells;

a first power supply terminal;

a first capacitance structure includes a plurality of dummy cells;

a first power supply line coupled to the first line of memory cells; and

a second power supply line coupled to the second line of memory cells;

a switching circuit that has transistors that connected between the first power supply terminal, the first power supply line, the second power supply line and the first capacitance structure

selecting the second line of memory cells for writing;

coupling the first power supply terminal to the first power supply line;

decoupling the second line of memory cells from the first power supply terminal;

coupling charge from the second power supply line to the first capacitance structure; and

writing a memory cell in the second line of memory cells.

13. The method of claim 12 further comprising precharging the first capacitance structure prior to the step of coupling charge.

14. The method of claim 13 , wherein the step of precharging is further characterized as precharging the first capacitance structure to ground.

15. The method of claim 13 , wherein the step of precharging is further characterized by precharging the first capacitance structure to a voltage present on the first power supply terminal.

16. The memory circuit of claim 12 , further comprising preventing the step of coupling charge from reducing a voltage on the second power supply line to a level below a predetermined voltage.

17. A memory circuit, comprising:

a memory array comprising a first line of memory cells and a second line of memory cells;

a power supply terminal;

a capacitance structure;

a first power supply line coupled to the first line of memory cells;

a second power supply line coupled to the second line of memory cells;

precharging means for precharging the capacitance structure to a predetermined voltage prior to a write operation for the second line of memory cells;

first coupling means for coupling the power supply terminal to the first power supply line during the write operation for the second line of memory cells;

decoupling means for decoupling the first power supply line from the second line of memory cells during the write operation for the second line of memory cells; and

second coupling means for coupling the second supply line to the first capacitance structure during the write operation for the second line of memory cells.

18. The memory circuit of claim 17 wherein the predetermined voltage comprises one of a group consisting of a positive power supply voltage and ground.

19. The memory circuit of claim 18 , wherein the capacitance structure comprises:

a dummy line;

a plurality of dummy cells adjacent to and coupled to the dummy line; and

a first dummy cell adjacent to but not coupled to the dummy line.

20. The memory circuit of claim 17 , wherein the first line of memory cells comprises one of a group consisting of a row and a column.

Assignments (25)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 053547/0421 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
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CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
Reel/Frame 048734/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 048387/0771 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 15, 2019
From: NXP USA, INC.
To: VLSI TECHNOLOGY LLC
Reel/Frame 048349/0290 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE PREVIOUSLY RECORDED AT REEL: 040632 FRAME: 0001. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME. Recorded Sep 21, 2017
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
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CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041703/0536 →
CHANGE OF NAME Recorded Nov 8, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 040632/0001 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
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SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
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To: MORGAN STANLEY SENIOR FUNDING, INC.
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ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
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PATENT RELEASE Recorded Dec 21, 2015
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To: FREESCALE SEMICONDUCTOR, INC.
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SECURITY AGREEMENT Recorded Nov 6, 2013
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To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
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SECURITY AGREEMENT Recorded Jun 18, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
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SECURITY AGREEMENT Recorded May 13, 2010
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
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SECURITY AGREEMENT Recorded Jul 11, 2008
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SECURITY AGREEMENT Recorded Feb 2, 2007
From: FREESCALE SEMICONDUCTOR, INC.; FREESCALE ACQUISITION CORPORATION; FREESCALE ACQUISITION HOLDINGS CORP.; FREESCALE HOLDINGS (BERMUDA) III, LTD.
To: CITIBANK, N.A. AS COLLATERAL AGENT
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ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 31, 2006
From: LU, OLGA R.; CHILDS, LAWRENCE F.; GUNDERSON, CRAIG D.
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