Integrated circuit package with a heat dissipation device

1. An integrated circuit assembly, comprising:

a die stack assembly comprising a plurality of integrated circuits placed on each other, wherein the die stack assembly is disposed on a chip carrier; and

a heat dissipation device thermally coupled to a lateral surface of the die stack assembly where the heat dissipation device has a thermal conductivity of at least 3 W/m·K, wherein the heat dissipation device comprises at least one of:

aluminum;

gold;

copper;

silver;

an alloy comprising one or more of aluminum, gold, copper and silver;

carbon; and

a carbon allotrope; and

wherein the heat dissipation device encapsulates the die stack assembly.

2. A package for an integrated circuit assembly, comprising:

a die stack assembly attached to a chip carrier where the die stack assembly comprises a plurality of integrated circuits placed on each other;

a heat dissipation device thermally coupled to a lateral surface of the die stack assembly where the heat dissipation device has a thermal conductivity of at least 3 W/m·K, and;

an encapsulant surrounding a residual surface area of the die stack assembly, the residual surface being exclusive of the lateral surface.

3. The package of claim 2 wherein the heat dissipation device is thermally coupled to a horizontal surface of the die stack assembly.

4. The package of claim 2 wherein at least one intermediate heat conducting layer between integrated circuits is thermally coupled to the heat dissipation device.

5. The package of claim 4 wherein the heat conducting layer comprises at least one of: aluminum, gold, copper, silver, and their alloys, and carbon and carbon allotropes.

6. The package of claim 4 wherein at least one heat conducting layer extends beyond the integrated circuit.

7. The package of claim 6 wherein the heat conducting material is selected from the group consisting of carbon and carbon allotropes, aluminum oxide, aluminum nitride, and boron nitride.

8. The package of claim 6 wherein the die stack defines a plurality of lateral surfaces and wherein only the plurality of lateral surfaces from which the heat conducting layer extends is surrounded by the encapsulant.

9. The package of claim 2 wherein the encapsulant forms at least a part of the heat dissipation device and surrounds the die stack assembly.

10. The package of claim 9 wherein the encapsulant comprises a heat conducting material.

11. The package of claim 9 wherein the encapsulant comprises a resin filled with a heat conducting material.

12. The package of claim 9 wherein the die stack defines a plurality of lateral surfaces and wherein only the plurality of lateral surfaces are surrounded by the encapsulant.

13. The package of claim 2 wherein the integrated circuits are electrically connected to each other.

14. The package of claim 2 wherein the lateral surface is metallized.

15. The package of claim 2 wherein the heat dissipation device has a thermal conductivity of at least 10 W/m·K.