Heat sink assembly and related methods for semiconductor vacuum processing systems
View Patent ↗An assembly for supporting a substrate during vacuum processing operations includes a thermally conductive heat sink tray including at least one wafer pocket recessed therein, and a thermally conductive heat sink carrier in the at least one wafer pocket. The heat sink carrier includes a first surface in contact with a surface within the at least one wafer pocket and a second surface opposite the first surface. A heat sink is affixed to the second surface of the heat sink carrier.
1. An assembly for supporting a substrate during vacuum processing operations, comprising:
a thermally conductive heat sink tray including at least one wafer pocket recessed therein;
a thermally conductive heat sink carrier in the at least one wafer pocket, the heat sink carrier including a first surface in contact with a surface within the at least one wafer pocket and a second surface opposite the first surface; and
a heat sink on the second surface of the heat sink carrier.
2. The assembly of claim 1 , wherein the heat sink comprises a wafer of silicon carbide that has a flatness of about +/−20 μm or less.
3. The assembly of claim 2 , wherein the heat sink comprises a single crystal silicon carbide wafer.
4. The assembly of claim 2 , wherein the heat sink comprises a wafer of macro-crystalline silicon carbide.
5. The assembly of claim 1 , wherein the heat sink carrier comprises a protrusion extending from the first surface thereof, and wherein the at least one wafer pocket includes a recess therein that is shaped to receive the protrusion extending from the heat sink carrier.
6. The assembly of claim 5 , wherein the protrusion comprises a cylindrical protrusion.
7. The assembly of claim 5 , wherein the protrusion comprises an annular ring.
8. The assembly of claim 1 , wherein the at least one wafer pocket comprises a protrusion extending from a bottom surface thereof, and wherein the heat sink carrier includes a recess therein that is shaped to receive the protrusion extending from the bottom surface of the wafer pocket.
9. The assembly of claim 1 , further comprising a cover plate disposed above the heat sink tray and including a plurality of openings therein, a respective one of openings being aligned with the at least one wafer pocket of the heat sink tray.
10. The assembly of claim 1 , wherein the heat sink tray comprises a vent hole extending from a location within the at least one wafer pocket to an external surface of the heat sink tray.
11. The assembly of claim 1 , wherein the heat sink tray comprises a hole extending from the at least one wafer pocket to a bottom surface of the heat sink tray and a fastener extending through the hole and attached to the heat sink carrier.
12. The assembly of claim 1 , further comprising a clamp affixed to the heat sink carrier and configured to urge a substrate into contact with the heat sink.
13. The assembly of claim 1 , further comprising a metallic bonding layer between the heat sink carrier and the heat sink.
14. The assembly of claim 13 , wherein the metallic bonding layer comprises indium.
15. A heat sink assembly for supporting a wafer during vacuum processing, comprising:
a thermally conductive heat sink carrier;
a heat sink affixed to the heat sink carrier, wherein the heat sink has a flatness of about +/−20 μm or less; and
a metallic bonding layer between the heat sink carrier and the heat sink.
16. The heat sink assembly of claim 15 , wherein the heat sink comprises a wafer of silicon carbide.
17. The heat sink assembly of claim 16 , wherein the heat sink comprises a single crystal silicon carbide wafer.
18. The heat sink assembly of claim 16 , wherein the heat sink comprises a wafer of macro-crystalline silicon carbide.
19. The heat sink assembly of claim 15 , wherein the heat sink carrier comprises a protrusion extending from the first surface thereof.
20. The heat sink assembly of claim 19 , wherein the protrusion comprises a cylindrical protrusion.
21. The heat sink assembly of claim 19 , wherein the protrusion comprises an annular ring.
22. The heat sink assembly of claim 15 , wherein the metallic bonding layer comprises indium.
23. The heat sink assembly of claim 15 , further comprising a clamp affixed to the heat sink carrier and configured to urge a substrate into contact with the heat sink.