Method of forming crack arrest features in embedded device build-up package and package thereof
View Patent ↗A method of forming an embedded device build-up package ( 10 ) includes forming a first plurality of features ( 22 ) over a packaging substrate ( 12,16,18 ), wherein the first plurality of features ( 22 ) comprises a first feature and a second feature, forming at least a first crack arrest feature ( 28 ) in a first crack arrest available region ( 26 ), wherein the first crack arrest available region is between the first feature and the second feature, forming a second plurality of features ( 32 ) over the first plurality of features ( 22 ) wherein the second plurality of features includes a third feature and a fourth feature, and forming at least a second crack arrest feature ( 36 ) in a second crack arrest available region ( 34 ), wherein the second crack arrest feature ( 36 ) is between the third feature and the fourth feature, and the second crack arrest feature ( 36 ) is substantially orthogonal to the first crack arrest feature ( 28 ).
1. A method of forming an embedded device build-up package, the method comprising:
forming a first plurality of features over a packaging substrate, wherein the first plurality of features comprises a first feature and a second feature;
forming at least a first crack arrest feature in a first crack arrest available region, wherein the first crack arrest available region is between the first feature and the second feature;
forming a dielectric layer over the first plurality of features and at least the first crack arrest feature;
forming a second plurality of features over at least the dielectric layer, wherein the second plurality of features includes a third feature and a fourth feature; and
forming at least a second crack arrest feature in a second crack arrest available region, wherein:
the second crack arrest feature is between the third feature and the fourth feature; and
the second crack arrest feature is substantially orthogonal to the first crack arrest feature.
2. The method of claim 1 , wherein:
forming at least the first crack arrest feature further comprises forming at least a first dummy trace; and
forming at least the second crack arrest feature further comprises forming at least a second dummy trace.
3. The method of claim 2 , wherein forming at least the first crack arrest feature further comprises forming the first crack arrest feature, wherein the first crack arrest feature has a thickness of approximately 5 to approximately 10 microns.
4. The method of claim 3 , wherein forming at least the second crack arrest feature further comprises forming the second crack arrest feature, wherein the second crack arrest feature has a thickness of approximately 5 to approximately 10 microns.
5. The method of claim 2 , wherein:
forming at least the first crack arrest feature further comprises forming the first crack arrest feature, wherein the first crack arrest feature has a rounded end; and
forming at least the second crack arrest feature further comprises forming the second crack arrest feature, wherein the second crack arrest feature has a rounded end.
6. The method of claim 1 , further comprising:
forming an opening in the dielectric layer, wherein the opening overlies at least a portion of the first crack arrest feature, and wherein
forming at least the second crack arrest feature, further comprises forming a portion of the second crack arrest feature within the opening.
7. The method of claim 1 , wherein forming the first plurality of features over the packaging substrate, further comprises forming the first plurality of features over the packaging substrate, wherein:
the packaging substrate comprises a semiconductor die and an encapsulant; and
the semiconductor die comprises edges and a plurality of contacts on an active surface of the semiconductor die;
the edges are surrounded by the encapsulant; and
the plurality of contacts comprise a first contact and a second contact.
8. The method of claim 7 , wherein forming the first plurality of features, further comprises forming the first plurality of features, wherein the first feature and the second feature are coupled to a first contact and a second contact, respectively.
9. The method of claim 1 , further comprising forming a solder mask over the packaging substrate after forming at least the second crack arrest feature.
10. The method of claim 9 , wherein forming the solder mask further comprises forming the solder mask, wherein the solder mask has a first fracture toughness and the dielectric layer has a second fracture toughness and the first fracture toughness is greater than the second fracture toughness.
11. The method of claim 1 , wherein:
forming at least a first crack arrest feature further comprises forming at least first crack arrest feature having a first thickness:
forming at least a second crack arrest feature further comprises forming at least second crack arrest feature having a second thickness; and
the first thickness and the second thickness are substantially a same thickness.
12. The method of claim 1 , wherein:
forming the first plurality of features and forming at least the first crack arrest feature are performed concurrently; and
forming the second plurality of features and forming at least the second crack arrest feature are performed concurrently.
13. The method of claim 1 , wherein determining a first crack arrest available region between the first feature and the second feature further comprises:
choosing a predetermined area of the first plurality of features;
determining a predetermined density of the first plurality of features of the predetermined area; and
determining the predetermined area is the first crack arrest available region if a density of the predetermined area is below the predetermined density, wherein the predetermined density is less than approximately 40%.
14. The method of claim 1 , wherein:
forming at least the first crack arrest feature, further comprises forming at least the first crack arrest feature, wherein the first crack arrest feature has a length and a width and the length is no greater than 20 times the width; and
forming at least the second crack arrest feature, further comprises forming at least the second crack arrest feature, wherein the second crack arrest feature has a length and a width and the length is no greater than 20 times the width.
15. A method of forming an embedded device build-up package, the method comprising:
providing a semiconductor die, wherein the semiconductor die edges are surrounded by an encapsulant;
forming a first plurality of features over at least the encapsulant, wherein:
the first plurality of features comprises a first feature, a second feature, and a first space between the first feature and the second feature; and
the first space is of a size such that at least a first crack arrest feature can be formed within the first space;
forming at least the first crack arrest feature between the first feature and the second feature, wherein forming at least the first crack arrest feature is performed while forming the first plurality of features and the first crack arrest feature is a dummy trace; and
forming a second plurality of features over the first plurality of features, wherein:
the second plurality of features comprises a third feature, a fourth feature, and a second space between the third feature and the fourth feature;
the second space is of a size such that at least a second crack arrest feature can be formed within the second space;
forming at least the second crack arrest feature between the third feature and the fourth feature, wherein forming at least the second crack arrest feature is performed while forming the second plurality of features and the second crack arrest feature is a dummy trace.