Complete power management system implemented in a single surface mount package
View Patent ↗A complete power management system implemented in a single surface mount package. The system may be drawn to a DC to DC converter system and includes, in a leadless surface mount package, a driver/controller, a MOSFET transistor, passive components (e.g., inductor, capacitor, resistor), and optionally a diode. The MOSFET transistor may be replaced with an insulated gate bipolar transistor, IGBT in various embodiments. The system may also be a power management system, a smart power module or a motion control system. The passive components may be connected between the leadframe connections. The active components may be coupled to the leadframe using metal clip bonding techniques. In one embodiment, an exposed metal bottom may act as an effective heat sink.
1. An apparatus comprising:
a controller integrated circuit;
a power MOSFET transistor coupled to said controller integrated circuit;
a plurality of passive components comprising at least one inductor;
wherein said controller integrated circuit, said power MOSFET transistor and said plurality of passive components are functionally coupled to implement a complete power management system;
wherein said controller integrated circuit, said power MOSFET transistor and said plurality of passive components are mounted to a metal leadframe; and
wherein said controller integrated circuit, said power MOSFET transistor and said plurality of passive components are encapsulated in plastic to form a single package.
2. The apparatus of claim 1 wherein a portion of said metal leadframe is exposed on the back side of said package.
3. The apparatus of claim 2 wherein said portion of said metal leadframe is disposed for thermal coupling to a printed circuit board.
4. The apparatus of claim 1 wherein said metal leadframe comprises copper.
5. The apparatus of claim 1 further comprising metal clip bonding.
6. The apparatus of claim 4 further comprising metal clip bonding.
7. The apparatus of claim 1 wherein said plurality of passive components includes a diode.
8. The apparatus of claim 1 wherein terminals of said at least one inductor are directly mounted to and electrically connected to portions of said leadframe.
9. The apparatus of claim 1 wherein said controller integrated circuit, said power MOSFET transistor and said plurality of passive components are functionally coupled via non-substrate couplings.
10. The apparatus of claim 1 wherein a portion of said leadframe provides an electrical path coupling terminals of at least two separate passive components of said plurality of passive components.
11. The apparatus of claim 10 wherein said at least two separate passive components are directly mounted to said portion of said leadframe.
12. A power management device comprising:
a controller integrated circuit;
a power MOSFET transistor coupled to said controller integrated circuit;
a plurality of passive components comprising at least one inductor;
wherein said controller integrated circuit, said power MOSFET transistor and said plurality of passive components are functionally coupled to implement a complete power management system;
wherein further said controller integrated circuit, said power MOSFET transistor and said plurality of passive components are mounted to a metal leadframe; and
wherein further said controller integrated circuit, said power MOSFET transistor and said plurality of passive components are encapsulated in plastic to form a single leadless package.
13. The device of claim 12 wherein a portion of said metal leadframe is exposed on the back side of said package.
14. The device of claim 13 wherein said portion of said metal leadframe is disposed for thermal coupling to a printed circuit board.
15. The device of claim 12 wherein said metal leadframe comprises copper.
16. The device of claim 12 further comprising metal clip bonding.
17. The device of claim 15 further comprising metal clip bonding.
18. The device of claim 12 wherein said plurality of passive components includes a diode.
19. The device of claim 12 wherein terminals of said at least one inductor are directly mounted to and electrically connected to portions of said leadframe.
20. The device of claim 12 wherein said controller integrated circuit, said power MOSFET transistor and said plurality of passive components are functionally coupled via non-substrate couplings.
21. The device of claim 12 wherein a portion of said leadframe provides an electrical path coupling terminals of at least two separate passive components of said plurality of passive components.
22. The device of claim 21 wherein said at least two separate passive components are directly mounted to said portion of said leadframe.