Semiconductor inspection apparatus
View Patent ↗An inspected image can be communicated without putting large load on a network. A remote console enables an operation screen and a moving image to be displayed and processed without color shifts. Information on the operation screen is not communicated as bitmap information, but event information such as a formation of a window and the moving of a mouse is communicated as information at a level of I parts of graphical user interface. Moreover, communication of the event information on the operation screen and communication of a moving image are separated. In addition, a method of compressing information on the operation screen and a method of compressing information on the moving image are separated. A necessary part of information on the moving image is selected and communicated depending on the state of the semiconductor inspection apparatus, an operation of an operator, and a pattern to be inspected.
1. A semiconductor inspection apparatus comprising:
an electronic beam device which comprises an electron source, an electronic beam deflector and an electronic detector, and which detects a sample signal by scanning a sample with electronic beams; and
a control console which comprises a display displaying an operation screen of the electronic beam device and an image of an object to be inspected, an operation panel, and a communication interface for communicating with a remote console, the control console forming the image from the sample signal outputted from the electronic beam device to display the image on the display, and the control console controlling the electronic beam device through an operation of the operation screen using the operation panel,
wherein said control console separates information on the operation screen and information on the image from each other to communicate the separated pieces of information between itself and the remote console, and the control console controls the moving image area to be sent, the delay time, or the compression rate according to information regarding the sample or the apparatus at the time of image acquisition.
2. The semiconductor inspection apparatus according to claim 1 ,
wherein an area of the image to be transmitted is changed depending on a state of the semiconductor inspection apparatus.
3. The semiconductor inspection apparatus according to claim 1 ,
wherein an area of the image to be transmitted is changed depending on an operation by an operator.
4. The semiconductor inspection apparatus according to claim 1 ,
wherein an area of the image to be transmitted is changed depending on the pattern information on an area to be inspected.