Method for fabricating a nanoelement field effect transistor with surrounded gate structure
The invention relates to a method for the production of a nanoelement field effect transistor, a nanoelement field effect transistor and a nanoelement arrangement. According to the method for the production of a nanoelement field effect transistor, a nanoelement is formed, a first and a second source-/drain area is coupled to the nanoelement, a surface area of a substrate is removed, such that a region of the nanoelement is exposed, and a gate-insulating structure and a gate structure are formed in a covered manner fully encompassing the nanoelement.
1. A method for fabricating a nanoelement field effect transistor, the method comprising:
applying a nanoelement to a substrate;
forming a first source/drain region on and/or in the substrate, the first source/drain region being coupled to a first end portion of the nanoelement;
forming a second source/drain region on and/or in the substrate, the second source/drain region being coupled to a second end portion of the nanoelement;
removing a surface region of the substrate in such a manner that a region of the nanoelement arranged between the first and second end portions is uncovered over the entire periphery of the nanoelement;
forming a gate-insulating structure so as to cover the whole of the uncovered periphery of the nanoelement; and
forming a gate structure so as to cover the entire periphery of the gate-insulating structure.
2. The method as claimed in claim 1 , wherein forming the first and second source/drain regions comprises forming an electrically conductive region on the nanoelement and/or on the substrate and patterning the electrically conductive region.
3. The method as claimed in claim 2 , wherein patterning the electrically conductive region comprises using a common mask for the patterning of the electrically conductive region and for the removal of the surface region of the substrate.
4. The method as claimed in claim 1 , further comprising forming an electrically insulating structure over the first and second source/drain regions for the purpose of electrically decoupling the first and second source/drain regions from the gate structure.
5. The method as claimed in claim 4 , wherein the electrically insulating structure is used as a mask for patterning an electrically conductive region and for removing the surface region of the substrate.
6. The method as claimed in claim 5 , wherein the patterning of the electrically conductive region and the removal of the surface region of the substrate are carried out by means of undercut etching of the electrically insulating structure.
7. The method as claimed in claim 1 , wherein the gate-insulating structure is formed as a ring structure surrounding the nanoelement.
8. The method as claimed in claim 1 , wherein the gate structure is formed as a ring structure that surrounds the gate-insulating structure.
9. The method as claimed in claim 1 , wherein the gate structure and/or the gate-insulating structure is/are formed using an atomic layer deposition process.
10. The method as claimed in claim 1 , wherein the removed surface region of the substrate is completely or partially filled with the gate-insulating structure and with the gate structure.
11. The method as claimed in claim 1 , wherein applying a nanoelement to a substrate comprises first completely producing the nanoelement and then applying the completely produced nanoelement to the substrate.
12. The method as claimed in claim 1 , wherein applying a nanoelement comprises growing the nanoelement on the substrate.
13. The method as claimed in claim 1 , wherein the nanoelement is a nanotube, a bundle of nanotubes, or a nanorod.
14. The method as claimed in claim 1 , wherein the gate-insulating structure comprises silicon oxide, silicon nitride, aluminum oxide, tantalum oxide, titanium oxide, zirconium oxide, and/or hafnium oxide.
15. The method as claimed in claim 1 , wherein the gate structure comprises tantalum nitride, tantalum, molybdenum, nickel, cobalt, titanium nitride, carbon, tungsten, and/or polysilicon.
16. The method as claimed in claim 1 , wherein the nanoelement comprises a silicon nanorod or a germanium nanorod.
17. The method as claimed in claim 1 , wherein the nanoelement comprises a nanorod, the nanorod comprising at least one of the III-V semiconductors BN, BP, BAs, AlN, AlP, AlAs, AlSb, GaN, GaP, GaAs, GaSb, InN, InP, InAs, or InSb.
18. The method as claimed in claim 1 , wherein the nanoelement comprises a nanorod, the nanorod comprising at least one of the II-VI semiconductors ZnO, ZnS, ZnSe, ZnTe, CdS, CdSe, CdTe, HgS, HgSe, HgTe, BeS, BeSe, BeTe, MgS, or MgSe.
19. The method as claimed in claim 1 , wherein the nanoelement comprises a nanorod, the nanorod comprising at least one of the compounds GeS, GeSe, GeTe, SnS, SnSe, SnTe, PbO, PbS, PbSe, or PbTe.
20. The method as claimed in claim 1 , wherein the nanoelement comprises a nanorod, the nanorod comprising at least one of the compounds CuF, CuCl, CuBr, CuI, AgF, AgCl, AgBr, or AgI.
21. The method as claimed in claim 1 , wherein the nanoelement is a carbon nanotube, a carbon-boron nanotube, a carbon-nitrogen nanotube, a tungsten sulphide nanostructure, or a chalcogenide nanotube.
22. The method as claimed in claim 1 , wherein the nanoelement is p-doped.