IP Library Granted Patent US 7,844,934
Granted Patent B2
US 7,844,934 · App. 11/486,107 · Granted Nov 30, 2010

Method for designing a semiconductor integrated circuit layout capable of reducing the processing time for optical proximity effect correction

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Quick Facts
Patent No.
US 7,844,934
App. No.
11/486,107
Granted
Nov 30, 2010
Kind
B2
Abstract

According to the present invention, a method for designing a semiconductor integrated circuit layout comprises the steps of: arranging basic logic cells which are circuit patterns corresponding to logic components of a semiconductor integrated circuit; arranging wiring between the basic logic cells; searching for a blank area in which none of the basic logic cells is arranged; extracting a rectangular region from the blank area; if the rectangular region is larger than a specified size, arranging fill cells in the rectangular region according to a predetermined rule and grouping the fill cells into pseudo-hierarchical cells according to a predetermined rule to form a hierarchy; arranging fill cells in the remaining blank areas; and performing optical proximity effect correction on the semiconductor integrated circuit pattern.

Claims (25)

1. A method for designing a semiconductor integrated circuit layout, comprising the steps of:

arranging basic logic cells which are circuit patterns corresponding to logic components of a semiconductor integrated circuit;

automatically arranging, by a computer device, wiring between said basic logic cells;

searching for a blank area in which none of said basic logic cells is arranged;

forming a rectangular region in said blank area;

arranging fill cells in said rectangular region and grouping said fill cells into pseudo-hierarchical cells to form a hierarchy;

arranging fill cells in the remaining blank areas after each rectangular region is formed; and

performing optical proximity effect correction on the semiconductor integrated circuit pattern,

wherein the size of an X-direction of said rectangular region is more than twice the size of a corresponding X-direction of a smallest fill cell among said fill cells, and the size of a Y-direction of said rectangular region is more than twice the size of a corresponding Y-direction of said smallest fill cell.

2. The method for designing a semiconductor integrated circuit layout according to claim 1 , wherein said fill cells are broken down into smaller fill cells, and said smaller fill cells are grouped into said pseudo-hierarchical cells to form said hierarchy.

3. The method for designing a semiconductor integrated circuit layout according to claim 1 , further comprising the steps of:

setting a repeater in a long wiring line;

setting a cell for said repeater as a blank area; and

reconfiguring said repeater using said fill cells.

4. The method of claim 1 , wherein the X-direction is perpendicular to the Y-direction.

5. The method of claim 1 , wherein said smallest fill cell is one-half of the size of a larger size fill cell among said fill cells.

6. The method of claim 1 , comprising: forming at least two rectangular regions in said blank area, the at least two rectangular regions being of different sizes with respect to each other.

7. The method of claim 1 , wherein the each rectangular region includes all rectangular regions extracted from said blank area.

8. A method for designing a semiconductor integrated circuit layout, comprising the steps of:

arranging basic logic cells which are circuit patterns corresponding to logic components of a semiconductor integrated circuit;

automatically arranging, by a computer device, wiring between said basic logic cells;

arranging a dummy pattern into said arranged wiring;

dividing said dummy pattern and said arranged wiring into smaller patterns and converting said smaller patterns into cells;

grouping said cells into pseudo-hierarchical cells to form a hierarchy; and

performing optical proximity effect correction based on the hierarchical relationship of said pseudo-hierarchical cells on the semiconductor integrated circuit pattern.

Assignments (11)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 30, 2018
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
Reel/Frame 044763/0155 →
CHANGE OF ADDRESS Recorded Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
CHANGE OF ADDRESS Recorded Dec 23, 2016
From: FUJITSU SEMICONDUCTOR LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 041188/0401 →
CHANGE OF NAME Recorded Dec 5, 2011
From: FUJITSU MICROELECTRONICS LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 027327/0143 →
MERGER Recorded Dec 30, 2010
From: RENESAS TECHNOLOGY CORP.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 025559/0974 →
CHANGE OF NAME Recorded Dec 30, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025564/0144 →
MERGER Recorded Oct 21, 2010
From: RENESAS TECHNOLOGY CORP.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 025176/0473 →
CHANGE OF NAME Recorded Oct 21, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025176/0500 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 13, 2009
From: FUJITSU LIMITED
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 022248/0521 →
CHANGE OF NAME Recorded Nov 14, 2008
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 021839/0940 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 5, 2007
From: ONO, YUSAKU; SUGA, OSAMU; SAKATA, KAZUYUKI; TAGUCHI, HIROFUMI; OKUNO, YUSHI; SUGIOKA, TOSHIAKI; KONDO, DAISUKE
To: RENESAS TECHNOLOGY CORP.; MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.; NEC ELECTRONICS CORPORATION; FUJITSU LIMITED; KABUSHIKI KAISHA TOSHIBA
Reel/Frame 018771/0472 →