IP Library Granted Patent US 7,771,893
Granted Patent B2
US 7,771,893 · App. 11/489,477 · Granted Aug 10, 2010

Photomask blank, photomask and fabrication method thereof

Assignees: Shin-Etsu Chemical Co., Ltd.; Toppan Printing Co., Ltd.
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Quick Facts
Patent No.
US 7,771,893
App. No.
11/489,477
Granted
Aug 10, 2010
Kind
B2
Abstract

A light-shielding film for exposure light is formed on one principal plane of a transparent substrate made of quartz or the like that serves as a photomask substrate. The light-shielding film can serve not only as the so-called “light-shielding film” but also as an anti-reflection film. In addition, the light-shielding film has a total thickness of 100 nm or less, 70% or more of which is accounted for by the thickness of a chromium compound that has an optical density (OD) per unit thickness of 0.025 nm −1 for light having a wavelength of 450 nm. In the case where the photomask blank is used for fabricating a mask designed for ArF exposure, the thickness and composition of the light-shielding film are selected in such a manner that the OD of the light-shielding film is 1.2 to 2.3 for 193 or 248 nm wavelength light.

Claims (31)

1. A photomask blank comprising:

a transparent substrate; and

a light-shielding film for exposure light formed on the transparent substrate,

characterized in that said light-shielding film has a total thickness of 100 nm or less, 70% or more of which is accounted for by the thickness of a chromium compound that has an optical density (OD) per unit thickness of 0.025 nm −1 or less for light having a wavelength of 450 nm.

2. The photomask blank according to claim 1 , characterized in that 70% or more of the total thickness of said light-shielding film is accounted for by the thickness of a chromium compound that has a chromium content of 50 atomic % or less in terms of atomic ratio.

3. The photomask blank according to claim 1 , characterized in that said light-shielding film comprises a chromium-metal film having a chromium content of 50 atomic % or more in terms of atomic ratio and a first and a second chromium-compound film having a chromium content of 50 atomic % or less in terms of atomic ratio, and

said chromium-metal film is disposed between said first chromium-compound film and said second chromium-compound film.

4. The photomask blank according to claim 1 , characterized in that said light-shielding film comprises a first and a second chromium-metal film having a chromium content of 50 atomic % or more in terms of atomic ratio and a first, a second and a third chromium-compound film having a chromium content of 50 atomic % or less in terms of atomic ratio, and

said first chromium-metal film is disposed between said first chromium-compound film and said second chromium-compound film, and said second chromium-metal film is disposed between said second chromium-compound film and said third chromium-compound film.

5. The photomask blank according to claim 1 , characterized in that said light-shielding film has a reflectance of 30% or less for light having a wavelength of 250 nm to 270 nm.

6. The photomask blank according to claim 1 , characterized in that the optical density (OD) of said light-shielding film is 2.5 to 3.5 for light having a wavelength of 193 nm.

7. The photomask blank according to claim 1 , characterized in that the optical density (OD) of said light-shielding film is 2.5 to 3.5 for light having a wavelength of 248 nm.

8. The photomask blank according to claim 1 , characterized in that said light-shielding film is a multilayer film that contains a stack of a plurality of layers having different optical characteristics, and the uppermost layer of the multilayer film has an extinction coefficient (k) of 1.0 to 1.5 for light having a wavelength of 193 nm.

9. The photomask blank according to claim 1 , characterized in that said light-shielding film is a multilayer film that contains a stack of a plurality of layers having different optical characteristics, a primary constituent material of the uppermost layer of the multilayer film is chromium oxide, chromium nitride or chromium oxynitride, and the percentage contents (atomic %) of oxygen, nitrogen and carbon in the film at depths of 0.5 to 1.0 nm from the surface of said uppermost layer are related according to the oxygen content>nitrogen content>carbon content.

10. The photomask blank according to claim 1 , characterized in that said light-shielding film is a multilayer film that contains a stack of a plurality of layers, and the uppermost layer of the multilayer film has a thickness of 10 to 40 nm.

11. A half-tone phase-shift mask blank comprising:

a transparent substrate;

a translucent film having a predetermined phase-shift capability and a predetermined transmittance for exposure light formed on the transparent substrate; and

a light-shielding film formed on the translucent film,

characterized in that said translucent film has a region that contains both silicon (Si) and molybdenum (Mo), and said light-shielding film has a thickness of 60 nm or less, 70% or more of which is accounted for by the thickness of a chromium compound that has an optical density (OD) per unit thickness of 0.025 nm −1 or less for light having a wavelength of 450 nm.

12. The photomask blank according to claim 11 , characterized in that 70% or more of the total thickness of said light-shielding film is accounted for by the thickness of a chromium compound that has a chromium content of 50 atomic % or less in terms of atomic ratio.

13. The photomask blank according to claim 11 , characterized in that said light-shielding film comprises a chromium-metal film having a chromium content of 50 atomic % or more in terms of atomic ratio and a first and a second chromium-compound film having a chromium content of 50 atomic % or less in terms of atomic ratio, and

said chromium-metal film is disposed between said first chromium-compound film and said second chromium-compound film.

14. The photomask blank according to claim 11 , characterized in that said light-shielding film comprises a first and a second chromium-metal film having a chromium content of 50 atomic % or more in terms of atomic ratio and a first, a second and a third chromium-compound film having a chromium content of 50 atomic % or less in terms of atomic ratio, and

said first chromium-metal film is disposed between said first chromium-compound film and said second chromium-compound film, and said second chromium-metal film is disposed between said second chromium-compound film and said third chromium-compound film.

15. The photomask blank according to claim 11 , characterized in that said light-shielding film has a reflectance of 30% or less for light having a wavelength of 250 nm to 270 nm.

16. The photomask blank according to claim 11 , characterized in that the optical density (OD) of said light-shielding film is 2.5 to 3.5 for light having a wavelength of 193 nm.

17. The photomask blank according to claim 11 , characterized in that the optical density (OD) of said light-shielding film is 2.5 to 3.5 for light having a wavelength of 248 nm.

18. The photomask blank according to claim 11 , characterized in that said light-shielding film is a multilayer film that contains a stack of a plurality of layers having different optical characteristics, and the uppermost layer of the multilayer film has an extinction coefficient (k) of 1.0 to 1.5 for light having a wavelength of 193 nm.

19. The photomask blank according to claim 11 , characterized in that said light-shielding film is a multilayer film that contains a stack of a plurality of layers having different optical characteristics, a primary constituent material of the uppermost layer of the multilayer film is chromium oxide, chromium nitride or chromium oxynitride, and the percentage contents (atomic %) of oxygen, nitrogen and carbon in the film at depths of 0.5 to 1.0 nm from the surface of said uppermost layer are related according to the oxygen content>nitrogen content>carbon content.

20. The photomask blank according to claim 11 , characterized in that said light-shielding film is a multilayer film that contains a stack of a plurality of layers, and the uppermost layer of the multilayer film has a thickness of 10 to 30 nm.

Assignments (3)
COMPANY SPLIT Recorded Sep 12, 2022
From: TOPPAN INC.
To: TOPPAN PHOTOMASK CO.,LTD.
Reel/Frame 061388/0555 →
CHANGE OF NAME Recorded Sep 12, 2022
From: TOPPAN PRINTING CO., LTD.
To: TOPPAN INC.
Reel/Frame 061407/0182 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 7, 2006
From: YOSHIKAWA, HIROKI; KUBOTA, HIROSHI; KINASE, YOSHINORI; OKAZAKI, SATOSHI; MARUYAMA, TAMOTSU; HARAGUCHI, TAKASHI; IWAKATA, MASAHIDE; FUKUSHIMA, YUICHI; SAGA, TADASHI
To: SHIN-ETSU CHEMICAL CO., LTD.; TOPPAN PRINTING CO., LTD.
Reel/Frame 018278/0720 →
Priority Claims (2)
JP 2005-211941 · Jul 21, 2005 · national
JP 2005-211942 · Jul 21, 2005 · national
Continuity (1)
Related Publication 20070020534A1 · Jan 25, 2007