IP Library Granted Patent US 7,628,072
Granted Patent B2
US 7,628,072 · App. 11/489,789 · Granted Dec 8, 2009

MEMS device and method of reducing stiction in a MEMS device

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,628,072
App. No.
11/489,789
Granted
Dec 8, 2009
Kind
B2
Abstract

A MEMS device includes a substrate; a movable mass suspended in proximity to the substrate; and at least one suspension structure coupled to the movable mass for performing a mechanical spring function. The at least one suspension structure has portions that move in tandem when the MEMS device is subject to at least one stimulus in a sensing direction, and further includes at least one link between the portions that move in tandem.

Claims (31)

1. A MEMS device, comprising:

a substrate;

a movable mass suspended in proximity to the substrate; and

at least one suspension structure coupled to the movable mass for performing a mechanical spring function,

wherein the at least one suspension structure has portions that move in tandem when the MEMS device is subject to a stimulus along at least one sensing direction, and wherein the at least one suspension structure further includes at least one link between the portions that move in tandem, wherein the at least one suspension structure has an axial spring constant (K y ) along a longitudinal axis and a transverse spring constant (K x ) along a transverse axis and in the at least one sensing direction, wherein the at least one link does not significantly increase the transverse spring constant (K x ) of the at least one suspension structure.

2. The MEMS device of claim 1 , wherein the at least one suspension structure has at least two segments that join to form a first elbow, and wherein the at least one link is provided approximately at the first elbow.

3. The MEMS device of claim 2 , wherein the at least one suspension structure has at least two additional segments that join to form a second elbow, and wherein the at least one link is provided approximately between the first and second elbows.

4. The MEMS device of claim 1 , wherein the at least one link is a plurality of links.

5. The MEMS device of claim 1 , wherein the suspension structure includes a plurality of segments that join to form at least six elbows, and wherein the at least one link includes three links, each linking a pair of elbows.

6. The MEMS device of claim 1 , wherein the at least one link is straight.

7. The MEMS device of claim 1 , wherein the at least one link is generally U-shaped.

8. The MEMS device of claim 7 , wherein the generally U-shaped link is formed by three segments joined at 90° angles.

9. The MEMS device of claim 1 , wherein the at least one link is generally C-shaped.

10. The MEMS device of claim 9 , wherein the generally C-shaped link is formed by seven segments joined at 90° angles.

11. The MEMS device of claim 1 , further comprising fixed electrodes supported by the substrate, wherein the movable mass and the fixed electrodes form a plurality of differential capacitor pairs.

12. The MEMS device of claim 1 , wherein the at least one link is positioned on a common layer with the at least one suspension structure.

13. A method of reducing stiction in a MEMS device having a substrate, a movable mass suspended in proximity to the substrate, and at least one suspension structure coupled to the movable mass for performing a mechanical spring function and including portions that move in tandem when the MEMS device is subject to a stimulus along at least one sensing direction, wherein the at least one suspension structure has an axial spring constant (K y ) along a longitudinal axis and a transverse spring constant (K x ) along a transverse axis and in the at least one sensing direction, the method comprising:

providing at least one link between the portions that move in tandem such that the at least one link does not significantly increase the transverse spring constant (K x ) of the at least one suspension structure.

14. The method of claim 13 , wherein the at least one suspension structure has at least two segments that join to form a first elbow, and

wherein the providing step includes providing the at least one link approximately at the first elbow.

15. The method of claim 14 , wherein the at least one suspension structure has at least two additional segments that join to form a second elbow, and wherein the at least one link is provided approximately between the first and second elbows.

16. The method of claim 13 , wherein the at least one link is straight.

17. The method of claim 13 , wherein the at least one link is generally U-shaped.

18. The method of claim 13 , wherein the at least one link is generally C-shaped.

19. The method of claim 13 , wherein the MEMS device further includes fixed electrodes supported by the substrate, and wherein the movable mass and the fixed electrodes form a plurality of differential capacitor pairs.

20. A MEMS device, comprising:

a substrate;

a movable mass suspended in proximity to the substrate; and

at least one suspension structure coupled to the movable mass for performing a mechanical spring function,

wherein the at least one suspension structure has a first segment and a second segment that move in tandem when the MEMS device is subject to a stimulus along at least one sensing direction, the first and second segments exhibiting mirror symmetry relative to one another along a symmetry axis, and

wherein the at least one suspension structure further includes at least one link, at least a portion of the at least one link lying on the symmetry axis between the first and second segments.

Assignments (20)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 053547/0421 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
Reel/Frame 048734/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041703/0536 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 4, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: NORTH STAR INNOVATIONS INC.
Reel/Frame 037694/0264 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037518/0292 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 12, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037486/0517 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037354/0225 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037355/0723 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037356/0143 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037356/0553 →
SECURITY AGREEMENT Recorded Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 031591/0266 →
SECURITY AGREEMENT Recorded Jun 18, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 030633/0424 →
SECURITY AGREEMENT Recorded May 13, 2010
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 024397/0001 →
SECURITY AGREEMENT Recorded Mar 15, 2010
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A.
Reel/Frame 024079/0082 →
SECURITY AGREEMENT Recorded Feb 2, 2007
From: FREESCALE SEMICONDUCTOR, INC.; FREESCALE ACQUISITION CORPORATION; FREESCALE ACQUISITION HOLDINGS CORP.; FREESCALE HOLDINGS (BERMUDA) III, LTD.
To: CITIBANK, N.A. AS COLLATERAL AGENT
Reel/Frame 018855/0129 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 19, 2006
From: KOURY, JR., DANIEL N.; MCNEIL, ANDREW C.
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 018119/0211 →