IP Library Granted Patent US 7,553,776
Granted Patent B2
US 7,553,776 · App. 11/499,188 · Granted Jun 30, 2009

Patterned functionalized silicon surfaces

Assignee: Purdue Research Foundation
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Quick Facts
Patent No.
US 7,553,776
App. No.
11/499,188
Granted
Jun 30, 2009
Kind
B2
Abstract

The present invention provides a method for preparing a silicon substrate and a silicon substrate having a silicon surface comprising a pattern of covalently bound monolayers. Each of the monolayers comprises an alkyne, wherein at least a portion of each monolayer is no more than about 5 molecules of the alkyne wide.

Claims (10)

1. A method for forming a covalently bound monolayer of organic substituents on a silicon or germanium substrate having a surface comprising silicon or germanium hydride groups, said method comprising the steps of:

contacting the surface of the substrate with a liquid comprising an optionally substituted C 2 -C 24 alkyne:

positioning a conductor electrode tip in contact with the liquid disposed on the surface of the substrate;

using the conductor electrode tip to apply an electrical potential sufficient to covalently bind at least a portion of the alkyne to the surface; and

moving the tip along the surface to create a pattern of covalently bound alkyne.

2. The method of claim 1 wherein the conductor electrode tip is an atomic force microscope tip.

3. The method of claim 1 wherein the conductor electrode tip is a scanning tunneling microscope tip.

4. The method of claim 1 wherein some portions of the pattern are no more than about 10 molecules thick.

5. The method of claim 1 wherein some portions of the pattern are no more than about 5 molecules thick.

6. The method of claim 1 wherein some portions of the pattern are no more than about 1 moleculethick.

Assignments (1)
CONFIRMATORY LICENSE Recorded May 17, 2010
From: PURDUE UNIVERSITY
To: NATIONAL SCIENCE FOUNDATION
Reel/Frame 024391/0861 →
Continuity (3)
Division 1088779200 · Jul 9, 2004
Provisional Application 6048657100 · Jul 11, 2003
Related Publication 20060270101A1 · Nov 30, 2006