IP Library Granted Patent US 7,388,797
Granted Patent B2
US 7,388,797 · App. 11/524,211 · Granted Jun 17, 2008

Semiconductor memory device

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Quick Facts
Patent No.
US 7,388,797
App. No.
11/524,211
Granted
Jun 17, 2008
Kind
B2
Abstract

An apparatus for detecting a defect of a data transfer line in a semiconductor memory device, including a data transfer unit for transferring data between a local I/O line and a global I/O line; a data transfer controller for controlling the data transfer unit by generating a read signal, a write signal, and a local I/O line reset signal; a test mode controller for preventing an activation of the read signal, a column select signal and the local I/O line reset signal based on a test mode signal; a first temporary data storage for storing data of the global I/O line; and a second temporary data storage for storing data of the local I/O line.

Claims (52)

1. An apparatus for detecting a defect of a data transfer line in a semiconductor memory device, comprising:

a data transfer unit for transferring data between a local I/O line and a global I/O line;

a data transfer controller for controlling the data transfer unit by generating a read signal, a write signal, and a local I/O line reset signal;

a test mode controller for preventing an activation of the read signal, a column select signal and the local I/O line reset signal based on a test mode signal;

a first temporary data storage for storing data of the global I/O line; and

a second temporary data storage for storing data of the local I/O line.

2. The apparatus of claim 1 , further comprising:

a test mode determiner for generating the test mode signal; and

a column decoder for outputting the column select signal to control a data transfer between a memory cell and the local I/O line.

3. The apparatus of claim 1 , wherein the test mode signal includes a first test mode signal for selecting the first temporary data storage and a second test mode signal for selecting the second temporary data storage.

4. The apparatus of claim 3 , wherein the test mode controller includes:

a first deactivating unit for preventing the activation of the read signal;

a second deactivating unit for preventing the activation of the column select signal; and

a third deactivating unit for preventing the activation of the local I/O line reset signal.

5. The apparatus of claim 4 , wherein the first deactivating unit includes:

a first inverter for inverting the first test mode signal;

a logic gate for performing a NAND operation of the read signal and an output signal of the first inverter; and

a second inverter for inverting an output signal of the logic gate.

6. The apparatus of claim 4 , wherein the second deactivating unit includes:

a logic gate for performing a NOR operation of the second test mode signal and the local I/O line reset signal; and

an inverter for inverting an output signal of the logic gate.

7. The apparatus of claim 1 , wherein the first temporary data storage and the second temporary data storage are optionally provided according to a defect detection area of the data transfer line.

8. The apparatus of claim 1 , wherein the first temporary data storage is implemented with an inverter latch circuit.

9. The apparatus of claim 1 , wherein the second temporary data storage includes the local I/O line.

10. A semiconductor memory device for detecting a defect of a data transfer line, comprising:

a data transfer unit for transferring data between a local I/O line and a global I/O line;

a data transfer controller for controlling the data transfer unit by generating a read signal and a write signal;

a test mode controller for preventing an activation of the read signal based on a test mode signal; and

a temporary data storage for storing data located in the global I/O line.

11. The semiconductor memory device of claim 10 , wherein the test mode controller includes:

a first inverter for inverting the test mode signal;

a logic gate for performing a NAND operation of the read signal and an output signal of the first inverter; and

a second inverter for inverting an output signal of the logic gate.

12. The semiconductor memory device of claim 10 , wherein the temporary data storage is implemented with an inverter latch circuit.

13. A semiconductor memory device for detecting a defect of a data transfer line, comprising:

a data transfer unit for transferring data between a local I/O line and a global I/O line;

a data transfer controller for controlling the data transfer unit by generating a local I/O line reset signal;

a test mode controller for preventing an activation of a column select signal and the local I/O line reset signal in response to a test mode signal;

a first temporary data storage for storing data located in the global I/O line; and

a second temporary data storage for storing data located in the local I/O line.

14. The semiconductor memory device of claim 13 , further comprising:

a test mode determiner for generating the test mode signal; and

a column decoder for outputting the column select signal to control a data transfer between a memory cell and the local I/O line.

15. The semiconductor memory device of claim 13 , wherein the test mode signal includes a first test mode signal for selecting the first temporary data storage and a second test mode signal for selecting the second temporary data storage.

16. The semiconductor memory device of claim 15 , wherein the test mode controller includes:

a first deactivating unit for preventing the activation of the column select signal; and

a second deactivating unit for preventing the activation of the local I/O line reset signal.

17. The semiconductor memory device of claim 16 , wherein the second deactivating unit includes:

a logic gate, inputs of the logic gate coupled to the second test mode signal and the local I/O line reset signal; and

an inverter for inverting an output signal of the logic gate.

18. The semiconductor memory device of claim 15 , wherein the first temporary data storage is implemented with an inverter latch circuit.

19. The semiconductor memory device of claim 15 , wherein the second temporary data storage includes the local I/O line.

Assignments (4)
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE IS HYNIX SEMICONDUCTOR INC. NOT HYNIX-SEMICONDUCTOR INC. THERE IS NO HYPHEN IN THE NAME. PREVIOUSLY RECORDED ON REEL 67328 FRAME 814. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF NAME. Recorded May 14, 2024
From: HYNIX SEMICONDUCTOR INC.
To: SK HYNIX INC.
Reel/Frame 067412/0482 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 9, 2024
From: SK HYNIX INC.
To: MIMIRIP LLC
Reel/Frame 067369/0832 →
CHANGE OF NAME Recorded May 6, 2024
From: HYNIX-SEMICONDUCTOR INC.
To: SK HYNIX INC.
Reel/Frame 067328/0814 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 21, 2006
From: DO, CHANG-HO
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 018332/0318 →