Granted Patent B2

US 7,378,298 · App. 11/524,457 · Granted May 27, 2008

Abstract

Claims (29)

1. A method of making a stacked die package, comprising:

placing a first flip chip die on a base carrier;

electrically connecting the first flip chip die to the base carrier;

attaching a second flip chip die back-to-back to the first flip chip die; and

electrically connecting the second flip chip die to the base carrier with a plurality of insulated wires, wherein first ends of the insulated wires are bonded to respective bumps on respective die bonding pads of the second flip chip die and second ends of the insulated wires are bonded to the base carrier.

2. The method of making a stacked die package of claim 1 , wherein the die bonding pads of the second flip chip die are laid out in an area array.

3. The method of making a stacked die package of claim 1 , wherein the die bonding pads of the second flip chip die are situated along a periphery of the second flip chip die.

4. The method of making a stacked die package of claim 1 , wherein the first and second flip chip dice have substantially the same length and substantially the same width.

5. The method of making a stacked die package of claim 1 , wherein the second flip chip die is larger than the first flip chip die.

6. The method of making a stacked die package of claim 1 , wherein at least one of the insulated wires crosses over another of the insulated wires.

7. The method of making a stacked die package of claim 1 , further comprising performing a molding operation to encapsulate the first and second flip chip dice, the insulated wires and at least a portion of the base carrier.

8. The method of making a stacked die package of claim 7 , wherein the second flip chip die is attached to the first flip chip die with one of a tape and an epoxy.

9. The method of making a stacked die package of claim 8 , wherein the base carrier is one of a substrate and a lead frame.

10. The method of making a stacked die package of claim 9 , wherein the first flip chip die is electrically connected to the base carrier with a plurality of flip chip interconnections.

11. A method of making a stacked die package, comprising;

placing a first flip chip die on a base carrier;

electrically connecting the first flip chip die to the base carrier;

attaching a second flip chip die back-to-back to the first flip chip die, the second flip chip die having an area array of die bonding pads; and

electrically connecting the second flip chip die to the base carrier with a plurality of insulated wires.

12. The method of making a stacked die package of claim 11 , further comprising performing a molding operation to encapsulate the first and second flip chip dice, the insulated wires and at least a portion of the base carrier.

13. The method of making a stacked die package of claim 11 , wherein the first and second flip chip dice have substantially the same length and substantially the same width.

14. The method of making a stacked die package of claim 11 , wherein the second flip chip die is larger than the first flip chip die.

15. A method of making a plurality of stacked die packages, comprising:

placing a plurality of first flip chip dice on a base carrier;

electrically connecting the first flip chip dice to the base carrier;

attaching a plurality of second flip chip dice back-to-back to respective ones of the first flip chip dice, thereby forming a plurality of die stacks;

electrically connecting the second flip chip dice to the base carrier with a plurality of insulated wires, wherein the second flip chip dice have an area array of die bonding pads; and

performing a molding operation to encapsulate the first and second flip chip dice, the insulated wires and at least a portion of the base carrier.

16. The method of making a plurality of stacked die packages of claim 15 , further comprising performing a singulating operation to separate adjacent ones of the die stacks, thereby forming the plurality of stacked die packages.

Assignments (22)