Camera module fabrication method including singulating a substrate
View Patent ↗An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window such that the window is exposed through the aperture. A lens is supported in a threaded lens support. The threaded lens support is threaded into the aperture of the lens holder extension portion. The lens is readily adjusted relative to the image sensor by rotating the lens support.
1. A method comprising:
coupling a first image sensor to a first substrate;
coupling a second image sensor to a second substrate, the second substrate being integrally connected to the first substrate;
coupling a first lens mount to the first substrate around the first image sensor;
coupling a second lens mount to the second substrate around the second image sensor; and
singulating the first substrate from the second substrate.
2. The method of claim 1 wherein the singulating forms a first camera module and a second camera module.
3. The method of claim 2 wherein the first camera module comprises the first substrate, the first image sensor and the first lens mount.
4. The method of claim 3 wherein the second camera module comprises the second substrate, the second image sensor and the second lens mount.
5. The method of claim 2 wherein the first image sensor is coupled to a first surface of the first substrate with a first adhesive and the second image sensor is coupled to a first surface of the second substrate with a second adhesive.
6. The method of claim 5 further comprising:
wirebonding bond pads of the first image sensor to traces on the first surface of the first substrate; and
wirebonding bond pads of the second image sensor to traces on the first surface of the second substrate.
7. The method of claim 6 wherein the first substrate further comprises:
traces on a second surface of the first substrate; and
vias electrically coupling the traces on the second surface of the first substrate with the traces on the first surface of the first substrate; and wherein the second substrate further comprises:
traces on a second surface of the second substrate; and
vias electrically coupling the traces on the second surface of the second substrate with the traces on the first surface of the second substrate.
8. The method of claim 7 further comprising:
forming first means for electrically connecting the first camera module to a first larger substrate, the first means for electrically connecting being electrically connected to the traces on the second surface of the first substrate; and
forming second means for electrically connecting the second camera module to a second larger substrate, the second means for electrically connecting being electrically connected to the traces on the second surface of the second substrate.
9. The method of claim 8 wherein the first means for electrically connecting comprises a first land grid array and wherein the second means for electrically connecting comprises a second land grid array.
10. The method of claim 8 wherein the first means for electrically connecting comprises a first ball grid array and wherein the second means for electrically connecting comprises a second grid array.
11. The method of claim 8 further comprising:
electrically connecting the first camera module to the first larger substrate; and
electrically connecting the second camera module to the second larger substrate.
12. The method of claim 1 wherein the first lens mount is coupled to a first surface of the first substrate with a first adhesive and the second lens mount is coupled to a first surface of the second substrate with a second adhesive.
13. A method comprising:
coupling image sensors to substrates, the substrates being integrally connected together;
coupling lens mounts to the substrates around the image sensors; and
singulating the substrates to form a plurality of camera modules.
14. The method of claim 13 wherein each of the camera modules comprises a substrate, an image sensor and a lens mount.
15. The method of claim 13 wherein the image sensors are coupled to first surfaces of the substrates with adhesives.
16. The method of claim 15 further comprising:
wirebonding bond pads of the image sensors to traces on the first surfaces of the substrates.
17. The method of claim 16 wherein the substrates further comprise:
traces on second surfaces of the substrates; and
vias electrically coupling the traces on the second surfaces of the substrates with the traces on the first surfaces of the substrates.
18. The method of claim 17 further comprising:
forming means for electrically connecting the camera modules to larger substrates, the means for electrically connecting being electrically connected to the traces on the second surfaces of the substrates, wherein the means for electrically connecting are selected from the group consisting of land grid arrays and ball grid arrays.
19. The method of claim 18 further comprising:
electrically connecting the camera modules to the larger substrates.
20. A method comprising:
coupling image sensors to first surfaces of substrates with adhesives, the substrates being integrally connected together, wherein the substrates comprise:
traces on the first surfaces of the substrates
traces on second surfaces of the substrates; and
vias electrically coupling the traces on the second surfaces of the substrates with the traces on the first surfaces of the substrates;
electrically connecting bond pads of the image sensors to the traces on the first surfaces of the substrates with bond wires;
coupling lens mounts to the substrates around the image sensors with adhesives;
inserting lens barrels into the lens mounts;
singulating the substrates to form a plurality of camera modules;
rotating the lens barrels to focus the camera modules; and
securing the lens barrels to the lens mounts.