Apparatus for and method of processing substrate subjected to exposure process
View Patent ↗A specified time is determined which is a worst-case (or the longest) time period assumed as a time interval required between the instant at which an interface block receives an exposed substrate from an exposure unit and the instant at which a post-exposure bake process of the substrate starts in a heating part. A waiting time is calculated by subtracting a transport time from the specified time. The transport time is a time interval actually required between the instant at which the interference block receives the substrate from the exposure unit and the instant at which the substrate reaches the heating part. The post-exposure bake process of the substrate starts in the heating part after a lapse of the above-mentioned calculated waiting time since the arrival of the substrate at the heating part.
1. A method of processing a substrate subjected to an exposure process in a substrate processing apparatus, said method comprising the steps of:
applying a chemically amplified resist onto a substrate;
performing an exposure process to said substrate by an exposure apparatus and forming an acid by a photochemical reaction in an exposed portion of a resist film;
determining a specified time, said specified time being a time interval between an instant at which said substrate processing apparatus receives said substrate from said exposure apparatus and an instant at which a heating process of said substrate starts in a heating processing part;
the substrate processing apparatus receiving the substrate from said exposure apparatus to transport the substrate to said heating processing part;
calculating a waiting time, said waiting time being obtained by subtracting a transport time required for said transport comprising the time from the substrate processing apparatus receiving the substrate from the exposure apparatus to arrival of the substrate at the heating processing part, from said specified time; and
starting the heating process of said substrate in said heating processing part after a lapse of said waiting time since the arrival of said substrate at said heating processing part, to cause a reaction of a resist resin to proceed by using a product formed by said photochemical reaction as an acid catalyst.
2. The method according to claim 1 , wherein said specified time varies depending on a connection configuration between said exposure apparatus and said substrate processing apparatus which determines the period of time for the receiving of the substrate by the substrate processing apparatus from the exposure apparatus.
3. The method according to claim 2 , wherein:
a first specified time is selected as said specified time for the substrate subjected to the exposure process when the receipt of the substrate is found at the instant of the transfer of the substrate from said exposure apparatus to said substrate processing apparatus;
a second specified time is selected as said specified time for the substrate subjected to the exposure process when the receipt of the substrate is found at the instant of the receipt of a transfer notice signal from said exposure apparatus; and
a third specified time is selected as said specified time for the substrate subjected to the exposure process when the receipt of the substrate is found at the instant of the receipt of an exposure completion signal from said exposure apparatus,
said second specified time being shorter than said first specified time, said third specified time being shorter than said second specified time.
4. A method of processing a substrate subjected to an exposure process in a substrate processing apparatus, said method comprising the steps of:
applying a chemically amplified resist onto the substrate;
performing an exposure process to said substrate by an exposure apparatus and forming an acid by a photochemical reaction in an exposed portion of a resist film;
determining a specified time, said specified time being a transport time constituting a time interval between an instant at which said substrate processing apparatus receives said substrate from said exposure apparatus and an instant at which a heating process of said substrate starts in a heating processing part;
accepting input of an allowable lag time for said specified time for the time from the substrate processing apparatus, receiving the substrate from said exposure apparatus to transport the substrate to said heating processing part;
calculating a waiting time by subtracting the transport time required for said transport from a critical specified time when said transport time is shorter than said critical specified time, and setting the waiting time at zero when said transport time is longer than said critical specified time, wherein the critical specified time is obtained by subtracting said inputted allowable lag time from said specified time; and
starting the heating process of said substrate in said heating processing part after a lapse of said waiting time since the arrival of said substrate at said heating processing part, to cause a reaction of a resist resin to proceed by using a product formed by said photochemical reaction as an acid catalyst.