Heat spreader for semiconductor package
View Patent ↗A heat spreader ( 50 ) for a semiconductor package ( 100 ) includes a heat dissipating portion ( 52 ) having a recessed periphery ( 54 ). A thermosetting resin ( 58 ) is disposed in the recessed periphery ( 54 ). The heat spreader ( 50 ) may include a heat absorbing portion ( 56 ) coupled to the heat dissipating portion ( 52 ).
1. A semiconductor package, comprising:
a substrate;
an IC die attached on a first surface to the substrate and electrically connected to the substrate; and
a heat spreader attached to a second surface of the IC die, the heat spreader comprising:
a heat absorbing portion attached to the second surface of the IC die,
a heat dissipating portion having a bottom surface that faces the substrate and a top surface opposite to the bottom surface, wherein the top surface has a recessed periphery, wherein a central portion of the bottom surface is coupled to the heat absorbing portion, and wherein the heat spreader has a generally T-shaped cross-section with the heat absorbing portion forming a vertical base portion of the T-shape and the heat dissipating portion forming a horizontal portion of the T-shape, and
a first mold compound comprising a thermosetting resin disposed in the recessed periphery for preventing die cracking during a later performed molding operation, and
a second mold compound covering the IC die, a portion of the substrate and a portion of the heat spreader, wherein the top surface of the heat spreader is exposed.
2. The semiconductor package of claim 1 , wherein the thermosetting resin has a cure temperature of between about 100° C. to about 200° C.
3. The semiconductor package of claim 2 , wherein the thermosetting resin has a cure period of between about 0.5 hr to about 2 hrs.
4. The semiconductor package of claim 1 , wherein the recessed periphery has a width of between about 1.0 mm to about 2.5 mm.
5. The semiconductor package of claim 4 , wherein the recessed periphery has a depth of between about 0.1 mm to about 0.2 mm.
6. A semiconductor package, comprising:
a substrate;
an IC die attached on a first surface to the substrate and electrically connected to the substrate;
a heat spreader attached to a second surface of the IC die, the heat spreader comprising:
a heat absorbing portion attached to the second surface of the IC die,
a heat dissipating portion having a bottom surface that faces the substrate and a top surface opposite to the bottom surface, wherein the top surface has a recessed periphery, wherein a central portion of the bottom surface is coupled to the heat absorbing portion, and wherein the heat spreader has a generally T-shaped cross-section with the heat absorbing portion forming a vertical base portion of the T-shape and the heat dissipating portion forming a horizontal portion of the T-shape, and
a first mold compound disposed in the recessed periphery for preventing die cracking during a molding operation; and
a second mold compound, different from the first mold compound, covering the IC die, a portion of the substrate and a portion of the heat spreader, wherein the top surface of the heat spreader is exposed.
7. The semiconductor package of claim 6 , wherein the first mold compound comprises a thermosetting resin.