Method for making a semiconductor device including regions of band-engineered semiconductor superlattice to reduce device-on resistance
View Patent ↗A method for making a semiconductor device which may include providing a substrate having a plurality of spaced apart superlattices therein, and forming source and drain regions in the substrate defining a channel region therebetween and with the plurality of spaced apart superlattices in the channel and/or drain regions. Each superlattice may include a plurality of stacked groups of layers, with each group including a plurality of stacked base semiconductor monolayers defining a base semiconductor portion and at least one non-semiconductor monolayer thereon. Moreover, the at least one non-semiconductor monolayer may be constrained within a crystal lattice of adjacent base semiconductor portions.
1. A method for making a semiconductor device comprising:
providing a substrate having a plurality of spaced apart superlattices therein; and
forming source and drain regions in the substrate defining a channel region therebetween and with the plurality of spaced apart superlattices in the drain region;
each superlattice comprising a plurality of stacked groups of layers with each group comprising a plurality of stacked base semiconductor monolayers defining a base semiconductor portion and at least one non-semiconductor monolayer thereon, and with the at least one non-semiconductor monolayer being constrained within a crystal lattice of adjacent base semiconductor portions;
wherein at least some semiconductor atoms from opposing base semiconductor portions are chemically bound together with the chemical bonds traversing the at least one non-semiconductor monolayer therebetween.
2. The method of claim 1 wherein forming comprises forming the source and drain regions so that the plurality of spaced apart superlattices also extend into the channel region.
3. The method of claim 1 wherein the source and drain regions are laterally spaced apart.
4. The method of claim 1 wherein the source and drain regions are vertically spaced apart.
5. The method of claim 1 wherein forming comprises forming the source and drain regions so that the spaced apart superlattices extend laterally between the source and drain regions.
6. The method of claim 1 wherein forming comprises forming the source and drain regions so that the spaced apart superlattices extend vertically between the source and drain regions.
7. The method of claim 1 wherein the spaced apart superlattices are substantially parallel to one another.
8. The method of claim 1 further comprising forming a gate dielectric layer adjacent the channel region, and forming a gate electrode layer adjacent the gate dielectric layer.
9. The method of claim 1 wherein the base semiconductor portions comprise silicon, and wherein the at least one non-semiconductor monolayer comprises oxygen.
10. The method of claim 1 wherein each non-semiconductor layer is a single monolayer thick.
11. The method of claim 1 wherein each base semiconductor portion is less than eight monolayers thick.
12. The method of claim 1 wherein each superlattice further comprises a base semiconductor cap layer on an uppermost group of layers.
13. The method of claim 1 wherein all of the base semiconductor portions are the same number of monolayers thick.
14. The method of claim 1 wherein at least some of the base semiconductor portions are a different number of monolayers thick.
15. The method of claim 1 wherein all of the base semiconductor portions are a different number of monolayers thick.
16. The method of claim 1 wherein each base semiconductor portion comprises a base semiconductor selected from the group consisting of Group IV semiconductors, Group III-V semiconductors, and Group II-VI semiconductors.
17. The method of claim 1 wherein each non-semiconductor monolayer comprises a non-semiconductor selected from the group consisting of oxygen, nitrogen, fluorine, and carbon-oxygen.
18. A method for making a semiconductor device comprising:
providing a substrate having a plurality of spaced apart superlattices therein; and
forming source and drain regions in the substrate defining a channel region therebetween and with the plurality of spaced apart superlattices in the channel region;
each superlattice comprising a plurality of stacked groups of layers with each group comprising a plurality of stacked base semiconductor monolayers defining a base semiconductor portion and at least one non-semiconductor monolayer thereon, and with the at least one non-semiconductor monolayer being constrained within a crystal lattice of adjacent base semiconductor portions;
wherein at least some semiconductor atoms from opposing base semiconductor portions are chemically bound together with the chemical bonds traversing the at least one non-semiconductor monolayer therebetween.
19. The method of claim 18 wherein the source and drain regions are laterally spaced apart.
20. The method of claim 18 wherein the source and drain regions are vertically spaced apart.
21. The method of claim 18 wherein forming comprises forming the source and drain regions so that the spaced apart superlattices extend laterally between the source and drain regions.
22. The method of claim 18 wherein forming comprises forming the source and drain regions so that the spaced apart superlattices extend vertically between the source and drain regions.
23. The method of claim 18 wherein the spaced apart superlattices are substantially parallel to one another.
24. The method of claim 18 further comprising forming a gate dielectric layer adjacent the channel region, and forming a gate electrode layer adjacent the gate dielectric layer.
25. The method of claim 18 wherein the base semiconductor portions comprise silicon, and wherein the at least one non-semiconductor monolayer comprises oxygen.