Liquid immersion cooled multichip module
View Patent ↗In one embodiment, a liquid immersion cooled multichip module is provided which includes a substrate having chips mounted thereon and which is adapted to mount with a printed circuit board. A lid is adapted to secure to the printed circuit board so as to mount with the substrate to form a fluid chamber between the lid and the substrate, and to cause the substrate to mate with the printed circuit board. In one embodiment, a cambered bolster plate is located on a side of the printed circuit board opposite the lid and the lid is fastened to the bolster plate to secure the lid to the printed circuit board. A baffle, which may be removable in some embodiments, is located within the lid and directs coolant flow through the fluid chamber.
1. A liquid immersion cooled multichip module comprising:
a) a printed circuit board;
b) a substrate having a plurality of chips mounted thereon and being adapted to mount with the printed circuit board;
c) a lid adapted to be secured to the printed circuit board so as to mount with the substrate to form a fluid chamber between the lid and the substrate, and to cause the substrate to mate with the printed circuit board;
d) a bolster plate on a side of the printed circuit board opposite the lid, the lid being fastened to the bolster plate to secure the lid to the printed circuit board; and
e) a baffle within the lid constructed to direct a flow of coolant through the fluid chamber, the baffle being constructed to direct a flow of coolant through the lid along a generally U-shaped flow path having an inbound segment leading to a transition segment followed by an outbound segment, the outbound segment supplying coolant fluid over the plurality of chips so as to provide a parallel flow over a first set of chips followed by a series flow over a downstream chip, the inbound segment supplying a partial flow of coolant laterally across an adjacent chip of the first set of chips so as to combine with the parallel flow.
2. The multichip module of claim 1 , wherein the bolster plate is a cambered bolster plate.
3. The multichip module of claim 1 , wherein the baffle further comprises a ramp down region positioned adjacent the first set of chips.
4. The multichip module of claim 1 , wherein the baffle further comprises a flow separator adjacent to the first set of chips.
5. The multichip module of claim 1 further comprising an O-ring between the lid and the substrate, and wherein the lid is secured to the bolster plate using a threaded fastener to compress the O-ring between the lid and the substrate to seal the fluid chamber.
6. The multichip module of claim 1 , wherein the lid further comprises a fluid inlet and a fluid outlet, the fluid inlet and fluid outlet being located on a same peripheral edge the lid.
7. A liquid immersion cooled multichip module comprising:
a) a printed circuit board;
b) a substrate having a plurality of chips mounted thereon and being adapted to mount with the printed circuit board;
c) a lid adapted to be secured to the printed circuit board so as to mount with the substrate to form a fluid chamber between the lid and the substrate, and to cause the substrate to mate with the printed circuit board;
d) a cambered bolster plate on a side of the printed circuit board opposite the lid, the lid being fastened to the cambered bolster plate to secure the lid to the printed circuit board; and
e) the lid comprising a baffle therein constructed to direct a flow of coolant through the fluid chamber, the baffle being constructed to direct a flow of coolant through the lid over the plurality of chips so as to provide a parallel flow over a first set of chips followed by a series flow over a downstream chip.
8. The multichip module of claim 7 , wherein the baffle further comprises a ramp down region positioned adjacent the first set of chips.
9. The multichip module of claim 7 , wherein the baffle further comprises a flow separator adjacent to the first set of chips.
10. The multichip module of claim 7 further comprising an o-ring between the lid and the substrate, and wherein the lid is secured to the cambered bolster plate using a threaded fastener to compress the O-ring between the lid and the substrate to seal the fluid chamber.
11. The multichip module of claim 7 , wherein the lid further comprises a fluid inlet and a fluid outlet, the fluid inlet and the fluid outlet being located on a same peripheral edge the lid.
12. The multichip module of claim 7 , wherein the baffle is removable from the lid.
13. A liquid immersion cooled multichip module comprising:
a) a printed circuit board;
b) a substrate having a plurality of chips mounted thereon and being adapted to mount with the printed circuit board;
c) a lid adapted to be secured to the printed circuit board so as to mount with the substrate to form a fluid chamber between the lid and the substrate, and to cause the substrate to mate with the printed circuit board;
d) a bolster plate on a side of the printed circuit board opposite the lid, the lid being fastened to the cambered bolster plate to secure the lid to the printed circuit board;
e) a coolant fluid inlet and outlet located on a same peripheral edge the lid; and
f) a removable baffle within the lid constructed to direct a flow of coolant through the fluid chamber.
14. The multichip module of claim 13 , wherein the bolster plate is a cambered bolster plate.
15. The multichip module of claim 13 , wherein the baffle further comprises a ramp down region positioned adjacent the plurality of chips.
16. The multichip module of claim 13 further comprising an O-ring between the lid and the substrate, the lid being secured to the bolster plate using a threaded fastener to compress the O-ring between the lid and the substrate to seal the fluid chamber.
17. The multichip module of claim 13 , wherein the lid further comprises a fluid inlet and a fluid outlet, the fluid inlet and fluid outlet being located on a same peripheral edge the lid.
18. The multichip module of claim 13 , wherein the baffle is constructed to direct a flow of coolant through the lid over the plurality of chips so as to provide a parallel flow over a first set of chips followed by a series flow over a downstream chip.
19. The multichip module of claim 13 , wherein the baffle is constructed to direct a flow of coolant through the lid along a generally U-shaped flow path having an inbound segment leading to a transition segment followed by an outbound segment, the outbound segment supplying coolant fluid over the plurality of chips so as to provide a parallel flow over a first set of chips followed by a series flow over a downstream chip, the inbound segment supplying a partial flow of coolant laterally across an adjacent chip of the first set of chips to combine with the parallel flow.
20. The multichip module of claim 13 , wherein the baffle is constructed to direct a flow of coolant through the lid over the plurality of chips so as to provide a series flow over the plurality of chips.