Controlled electroless plating
View Patent ↗An electroless metal deposition process to make a semiconductor device uses a plating bath solution having a reducing agent. A sample of the bath solution is taken and the pH of the sample is increased. The hydrogen evolved from the sample is measured. The hydrogen evolved is used to determine the concentration of the reducing agent present in the sample. Based on the determined reducing agent concentration, the plating bath solution is modified.
1. An electroless plating apparatus, comprising:
a wafer processing chamber, the wafer processing chamber containing a bath solution in which a semiconductor device is immersed;
a plating container comprising a plating bath for holding a reducing agent for electroless plating of a metal onto the semiconductor device, the plating container being coupled to the wafer processing chamber;
a first valve having an input coupled to the plating bath, and an output;
an analysis module coupled to the output of the first valve, the analysis module determining a concentration of the reducing agent of a sample of the plating bath by increasing a pH of the sample and measuring a quantity of hydrogen evolved from the sample wherein the analysis module indicates that more reducing agent is needed when the concentration of the reducing agent is below a predetermined level;
a replenishment module having an output for supplying reducing agent to the plating container; and
a second valve having an input coupled to the output of the replenishment module, an output coupled to the plating bath for providing reducing agent to the plating bath, and a control input coupled to the analysis module for being controlled by the analysis module.
2. The electroless plating apparatus of claim 1 wherein the analysis module determines the concentration of the reducing agent by agitation of the sample of the plating bath to measure the quantity of hydrogen evolved from the sample and references a measured value to a predetermined value of reducing agent concentration.
3. The electroless plating apparatus of claim 1 wherein the analysis module indicates to add a hydroxide to the sample of the plating bath to increase the pH of the sample.
4. An electroless plating apparatus, comprising:
a plating container comprising a plating bath for holding a reducing agent for electroless plating of a metal onto a semiconductor device;
a first valve having an input coupled to the plating container, and an output;
an analysis module coupled to the output of the first valve, the analysis module determining a concentration of the reducing agent of a sample of the plating bath by increasing a pH of the sample and measuring a quantity of hydrogen evolved from the sample wherein the analysis module indicates that more reducing agent is needed when the concentration of the reducing agent is below a predetermined level, the analysis module having an output for providing a control signal;
a replenishment module having an output for providing reducing agent; and
a second valve having an input coupled to the output of the replenishment module, an output coupled to the plating container for providing reducing agent to the plating container, and a control input coupled to the analysis module for receiving the control signal.
5. The electroless plating apparatus of claim 4 wherein the reducing agent is morpholine borane.
6. The electroless plating apparatus of claim 4 wherein the analysis module measures a quantity of hydrogen evolved from the sample of the plating bath as an increase in volume of an expandable space that receives the hydrogen.