IP Library Granted Patent US 7,626,882
Granted Patent B2
US 7,626,882 · App. 11/613,383 · Granted Dec 1, 2009

Flash memory device with external high voltage supply

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Quick Facts
Patent No.
US 7,626,882
App. No.
11/613,383
Filed
Dec 20, 2006
Granted
Dec 1, 2009
Kind
B2
Art Unit
2824
USPC
365/226
Abstract

A semiconductor memory device ( 104 ) selectably connectable to an external high voltage power supply ( 122 ) is provided. The semiconductor memory device ( 104 ) includes a switch ( 314 ), a detector ( 316 ) and a timing device ( 318 ). The switch ( 314 ) is connected to external voltage supply signals and selectably couples the external voltage supply signals to memory cells ( 305 ) of the semiconductor memory device ( 104 ) for memory operations thereof. The external voltage supply signals including a high voltage signal ( 412 ) provided from the external high voltage power supply ( 122 ) and an operational voltage signal Vcc ( 402 ). The detector ( 316 ) is connected to the external voltage supply signals for generating a timer activation signal ( 404 ) in response to detecting an operational voltage power-on period. The timing device ( 318 ) signals the switch ( 314 ) to decouple the high voltage signal ( 412 ) and the operational voltage signal ( 402 ) from the memory cells ( 305 ) in response to the timer activation signal ( 404 ) and to recouple the high voltage signal ( 412 ) and the operational voltage signal ( 402 ) to the memory cells ( 305 ) a time delay interval thereafter. The time delay interval is determined in response to the high voltage signal ( 412 ).

Claims (43)

1. A method for performing a high voltage operation in a semiconductor memory device selectably connectable to an external high voltage power supply providing a high voltage signal thereto, the method comprising the steps of:

detecting a power-on period of an operational voltage signal provided to the semiconductor memory device;

waiting a time delay interval after detection of the power-on period of the operational voltage, the time delay interval determined in response to the high voltage signal; and

connecting the high voltage signal and the operational voltage signal to memory cells of the semiconductor memory device for performing memory operations thereof.

2. The method of claim 1 wherein the step of waiting a time delay interval comprises the step of waiting a predetermined time delay interval determined in response to a value stored in a storage portion of the semiconductor memory device.

3. The method of claim 2 wherein the predetermined time delay interval is between fifty microseconds and four hundred microseconds.

4. The method of claim 3 wherein the predetermined time delay interval is approximately two hundred microseconds.

5. The method of claim 2 further comprising the step of one time programmably storing the value in the storage portion of the semiconductor memory device.

6. The method of claim 1 wherein the semiconductor memory device further includes an internal high voltage power supply, and wherein the step of activating the external high voltage power supply comprises the steps of:

determining whether to supply the high voltage signal for high voltage memory operations in the memory cells from the external high voltage power supply or the internal high voltage power supply; and

connecting the external high voltage power supply to the memory cells to provide the high voltage signal thereto in response to determining to supply the high voltage signal for the high voltage memory operations from the external high voltage power supply.

7. The method of claim 1 wherein the step of waiting a time delay interval comprises the steps of:

monitoring the high voltage signal to detect stabilization of the high voltage signal; and

determining an end of the time delay interval in response to detection of stabilization of the high voltage signal.

8. The method of claim 7 wherein the semiconductor memory device includes a stable high voltage signal detector, and wherein the step of monitoring the high voltage signal comprises the step of the stable high voltage signal detector monitoring the high voltage signal, and wherein the step of determining the end of the time delay interval comprises the step of generating a stable voltage signal in response to detection of stabilization of the high voltage signal, and wherein the step of connecting the high voltage signal to the memory cells comprises the step of connecting the high voltage signal to the memory cells for performing the memory operations thereof in response to the stable voltage signal.

9. A semiconductor memory device selectably connectable to an external high voltage power supply, the semiconductor memory device comprising:

a switch connected to external voltage supply signals for selectably coupling the external voltage supply signals to memory cells of the semiconductor memory device for memory operations thereof, the external voltage supply signals including a high voltage signal provided from the external high voltage power supply and an operational voltage signal;

a detector connected to the external voltage supply signals for generating a timer activation signal in response to detecting an operational voltage power-on period; and

a timing device coupled to the detector and the switch for signaling the switch to decouple the high voltage signal and the operational voltage signal from the memory cells in response to the timer activation signal and to recouple the high voltage signal and the operational voltage signal to the memory cells a time delay interval thereafter, the time delay interval determined in response to the high voltage signal.

10. The semiconductor memory device of claim 9 wherein the time delay interval is a predetermined time delay interval, and wherein the timing device includes a timer for measuring the predetermined time delay interval in response detection of the operational voltage power-on period, the timer signaling the switch to recouple the high voltage signal and the operational voltage signal to the memory cells after the predetermined time delay interval is measured.

11. The semiconductor memory device of claim 10 further comprising a storage portion storing a value representing the predetermined time delay interval, wherein the timer is coupled to the storage portion and retrieves the value from the storage portion and measures the predetermined time delay interval in response to the value retrieved.

12. The semiconductor memory device of claim 11 wherein the predetermined time delay interval is between fifty microseconds and four hundred microseconds.

13. The semiconductor memory device of claim 12 wherein the predetermined time delay interval is approximately two hundred microseconds.

14. The semiconductor memory device of claim 9 further comprising:

a memory controller coupled to the switch and the memory cells and controlling at least a portion of memory operations of the memory cells; and

an internal high voltage power supply coupled to the memory controller, wherein the memory controller determines whether to supply the high voltage signal to the memory cells for the high voltage operations thereof from the external high voltage power supply or the internal high voltage power supply and signals the switch to connect the external high voltage power supply to the memory cells in response to determining to supply the high voltage signal for the high voltage operations from the external high voltage power supply.

15. The semiconductor memory device of claim 9 wherein the timing device monitors the high voltage signal to detect stabilization thereof and determines an end of the time delay interval in response to detection of stabilization of the high voltage signal.

16. The semiconductor memory device of claim 15 wherein the timing device includes a stable high voltage signal detector coupled to the high voltage power supply and generating a stable voltage signal in response to detection of stabilization of the high voltage signal, and wherein the stable high voltage signal detector provides the stable voltage signal to the switch to recouple the high voltage signal and the operational voltage signal to the memory cells for performing the memory operations thereof in response to the stable voltage signal.

17. A semiconductor package comprising:

a semiconductor memory die including memory cells and connected to an operational voltage signal; and

a high voltage power supply semiconductor die connected to the operational voltage signal for generating a high voltage signal, the high voltage power supply semiconductor die coupled to the semiconductor memory die to provide a high voltage signal to the semiconductor memory die for memory operations thereof, wherein the semiconductor memory die includes:

a switch coupled to the high voltage power supply semiconductor die and the operational voltage signal to selectably provide the high voltage signal and the operational voltage signal to the memory cells for the memory operations thereof;

a detector connected to the external voltage supply signals for generating a timer activation signal in response to detecting an operational voltage power-on period; and

a timing device coupled to the detector and the switch for signaling the switch to decouple the high voltage signal and the operational voltage signal from the memory cells in response to the timer activation signal and for recoupling the high voltage signal and the operational voltage signal to the memory cells a time delay interval thereafter, the time delay interval determined in response to the high voltage signal.

18. An electronic device comprising:

a controller for controlling operations of the electronic device;

a memory coupled to the controller for storing information therein for utilization by the controller for controlling the operations of the electronic device; and

a high voltage power supply external to the memory and providing a high voltage signal to the memory for high voltage memory operations thereof, wherein the memory includes:

a switch coupled to the high voltage power supply semiconductor die and the operational voltage signal to selectably provide the high voltage signal and the operational voltage signal to the memory cells for the memory operations thereof; and

a detector connected to the external voltage supply signals for generating a timer activation signal in response to detecting an operational voltage power-on period; and

a timing device coupled to the detector and the switch for signaling the switch to decouple the high voltage signal and the operational voltage signal from the memory cells in response to the timer activation signal and for recoupling the high voltage signal and the operational voltage signal to the memory cells a time delay interval thereafter, the time delay interval determined in response to the high voltage signal.

19. The electronic device of claim 18 wherein the time delay interval is a predetermined time delay interval and wherein the memory further includes a storage portion storing a value representing the predetermined time delay interval, and wherein the timing device includes a timer for measuring the predetermined time delay interval in response detection of the operational voltage power-on period, the timer signaling the switch to recouple the high voltage signal and the operational voltage signal to the memory cells after the predetermined time delay interval is measured.

20. The electronic device of claim 18 wherein the timing device includes a stable high voltage signal detector coupled to the high voltage power supply and generating a stable voltage signal in response to detection of stabilization of the high voltage signal, and wherein the stable high voltage signal detector provides the stable voltage signal to the switch to recouple the high voltage signal and the operational voltage signal to the memory cells for performing the memory operations thereof in response to the stable voltage signal.

Assignments (8)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 15, 2022
From: CYPRESS SEMICONDUCTOR CORPORATION
To: INFINEON TECHNOLOGIES LLC
Reel/Frame 059721/0467 →
RELEASE OF SECURITY INTEREST Recorded Mar 16, 2022
From: MUFG UNION BANK, N.A.
To: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
Reel/Frame 059410/0438 →
CORRECTIVE ASSIGNMENT TO CORRECT THE 8647899 PREVIOUSLY RECORDED ON REEL 035240 FRAME 0429. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTERST. Recorded Nov 3, 2020
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 058002/0470 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN INTELLECTUAL PROPERTY Recorded Oct 28, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MUFG UNION BANK, N.A.
Reel/Frame 050896/0366 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 1, 2015
From: SPANSION, LLC
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 036049/0581 →
SECURITY INTEREST Recorded Mar 21, 2015
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 035240/0429 →
RELEASE OF SECURITY INTEREST Recorded Mar 13, 2015
From: BARCLAYS BANK PLC
To: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY LLC
Reel/Frame 035201/0159 →
SECURITY AGREEMENT Recorded Jun 4, 2010
From: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY INC.; SPANSION TECHNOLOGY LLC
To: BARCLAYS BANK PLC
Reel/Frame 024522/0338 →