IP Library Patent Application 11614839
Patent Application
App. No. 11/614,839

MEMORY SYSTEM WITH SELECT GATE ERASE

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Quick Facts
Patent No.
US None
App. No.
11/614,839
Abstract

A memory system includes a substrate, forming a first insulator over the substrate, forming a charge trap layer, having a composition for setting a predetermined electrical charge level, over the first insulator, and forming a second insulator over the charge trap layer.

Claims (38)

1 . A memory system comprising:

providing a substrate;

forming a first insulator over the substrate;

forming a charge trap layer, having a composition for setting a predetermined electrical charge level, over the first insulator; and

forming a second insulator over the charge trap layer.

2 . The system as claimed in claim 1 further comprising forming a gate layer over the second insulator.

3 . The system as claimed in claim 1 further comprising forming a spacer adjacent to the charge trap layer, and the second insulator.

4 . The system as claimed in claim 1 further comprising applying radiation on the charge trap layer.

5 . The system as claimed in claim 1 wherein forming the charge trap layer includes forming a nitride layer.

6 . A memory system comprising:

providing a semiconductor substrate;

forming a first insulator over a semiconductor substrate;

forming a charge trap layer, having a composition for tuning a predetermined electrical trigger level, over the first insulator;

forming a second insulator isolating the charge trap layer on a side opposite the first insulator; and

applying a radiation source over the first insulator, the charge trap layer, and the second insulator.

7 . The system as claimed in claim 6 further comprising forming a polysilicon gate electrode over the second insulator.

8 . The system as claimed in claim 6 further comprising forming a nitride spacer adjacent to the charge trap layer, and the second insulator.

9 . The system as claimed in claim 6 wherein applying the radiation source includes applying an ultraviolet light source.

10 . The system as claimed in claim 6 wherein forming the charge trap layer includes forming a silicon nitride layer.

11 . A memory system comprising:

a substrate;

a first insulator over the substrate;

a charge trap layer, having a composition for setting a predetermined electrical charge level, over the first insulator; and

a second insulator over the charge trap layer.

12 . The system as claimed in claim 11 further comprising a gate layer over the second insulator.

13 . The system as claimed in claim 11 further comprising a spacer adjacent to the charge trap layer, and the second insulator.

14 . The system as claimed in claim 11 further comprising radiation on the charge trap layer.

15 . The system as claimed in claim 11 wherein the charge trap layer is a nitride layer.

16 . The system as claimed in claim 11 wherein:

the substrate is a semiconductor substrate;

the first insulator layer is over a semiconductor substrate;

the charge trap layer has a composition for tuning a predetermined electrical trigger level;

the second insulator isolates the charge-storage layer on a side opposite the first insulator; and further comprising:

a radiation source over the first insulator, the charge trap layer and the second insulator.

17 . The system as claimed in claim 16 further comprising a polysilicon gate electrode over the second insulator.

18 . The system as claimed in claim 16 further comprising a nitride spacer adjacent to the charge trap layer, and the second insulator.

19 . The system as claimed in claim 16 wherein the radiation source includes an ultraviolet light source.

20 . The system as claimed in claim 16 wherein the charge trap layer includes a silicon nitride layer.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 11, 2015
From: SPANSION LLC
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 035890/0678 →
RELEASE OF SECURITY INTEREST Recorded Mar 13, 2015
From: BARCLAYS BANK PLC
To: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY LLC
Reel/Frame 035201/0159 →
SECURITY AGREEMENT Recorded Jun 4, 2010
From: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY INC.; SPANSION TECHNOLOGY LLC
To: BARCLAYS BANK PLC
Reel/Frame 024522/0338 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 26, 2007
From: SUH, YOUSEOK; SHIRAIWA, HIDEHIKO; CHANG, KUO-TUNG; XUE, LEI; DING, MENG; JOSHI, AMOL RAMESH; FANG, SHENQING
To: SPANSION LLC
Reel/Frame 018813/0301 →