Patent Assignment
Reel/Frame 035890/0678
Assignment of Assignor's Interest
Recorded: 2015-06-11
Pages: 152
Assignor
SPANSION LLC
Executed: 2015-06-01
Assignee
CYPRESS SEMICONDUCTOR CORPORATION
198 CHAMPION COURT, SAN JOSE, CALIFORNIA, 95134
Covered Properties
(18)
Bit Lines for Semiconductor Devices
Application:
11/380,971 →
Stacked-type semiconductor device and method of manufacturing the same
Application:
11/394,986 →
Publication:
US 2006/0220208
Methods for erasing memory devices and multi-level programming memory device
Application:
11/399,158 →
Publication:
US 2007/0247924
Method and Apparatus for Versatile High Voltage Level Detection with Relative Noise Immunity
Application:
11/423,643 →
Publication:
US 2008/0122413
Method and Apparatus for Drain Pump Power Conservation
Application:
11/423,649 →
Publication:
US 2007/0284609
Semiconductor device and method for fabricating the same
Application:
11/441,771 →
Publication:
US 2006/0278918
Method and apparatus for supporting software tuning for multi-core processor, and computer product
Application:
11/501,870 →
Publication:
US 2007/0226718
Semiconductor device and fabrication method therefor
Application:
11/529,805 →
Publication:
US 2007/0077726
Using thin undoped TEOS with BPTEOS ILD or BPTEOS ILD alone to improve charge loss and contact resistance in multi-bit memory devices
Application:
11/546,688 →
Publication:
US 2007/0029604
SRAM devices based on resonant tunneling
Application:
11/595,237 →
Publication:
US 2007/0120174
Memory System with Select Gate Erase
Application:
11/614,839 →
Publication:
US 2008/0150000
Personal Digital Rights Management Agent-Server
Application:
11/616,385 →
Publication:
US 2008/0162353
Barrier region underlying source/drain regions for dual-bit memory devices
Method for Fabricating Memory Cells Having Split Charge Storage Nodes
Stress management in BGA packaging
Application:
11/641,506 →
Publication:
US 2008/0142956
Structure and method for wire bond integrity check on BGA substrates using indirect electrical interconnectivity pathway between wire bonds and ground
Application:
11/650,907 →
Publication:
US 2009/0001573
Shallow bipolar junction transistor
Patent:
9,111,985 →
Application:
11/652,785 →
Semiconductor Device with High Conductivity Region Using Shallow Trench
Application:
11/685,711 →
Publication:
US 2007/0166938
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 1, 2006
From: QIAN, WEIDONG; RAMSBEY, MARK T.; KAMAL, TAZRIEN
To: SPANSION LLC
Reel/Frame 017553/0863 →
Assignment of Assignor's Interest
Jun 12, 2006
From: ANG, BOON-AIK; YANG, NIAN; WU, YONGGANG
To: SPANSION LLC
Reel/Frame 017778/0652 →
Assignment of Assignor's Interest
Jun 12, 2006
From: ANG, BOON-AIK; YANG, NIAN; WU, YONGGANG
To: SPANSION LLC
Reel/Frame 017778/0660 →
Assignment of Assignor's Interest
Jun 12, 2006
From: ONODERA, MASANORI; MEGURO, KOUICHI; KASAI, JUNICHI
To: SPANSION LLC
Reel/Frame 017777/0274 →
Assignment of Assignor's Interest
Aug 10, 2006
From: WATANABE, MANABU
To: FUJITSU LIMITED
Reel/Frame 018166/0480 →
Assignment of Assignor's Interest
Aug 18, 2006
From: INOUE, YOKO
To: SPANSION LLC
Reel/Frame 018147/0553 →
Assignment of Assignor's Interest
Nov 7, 2006
From: ZHENG, WEI; DING, MENG
To: SPANSION LLC
Reel/Frame 018499/0243 →
Assignment of Assignor's Interest
Nov 20, 2006
From: MORIYA, MASAYUKI; ENDA, TAKAYUKI
To: SPANSION LLC.
Reel/Frame 018591/0703 →
Assignment of Assignor's Interest
Dec 6, 2006
From: SINHA, SHANKAR; HE, YI; LIU, ZHIZHENG; KWAN, MING-SANG
To: SPANSION LLC
Reel/Frame 018649/0854 →
Assignment of Assignor's Interest
Dec 15, 2006
From: LEE, CHUNGHO; ZHENG, WEI; CHANG, CHI; KIM, UNSOON
To: SPANSION LLC.
Reel/Frame 018693/0485 →
Assignment of Assignor's Interest
Jan 8, 2007
From: JIRAWONGSAPIWAT, PHONTARA; PHAKDEE, PREEYAPORN
To: SPANSION LLC
Reel/Frame 018778/0688 →
Assignment of Assignor's Interest
Jan 11, 2007
From: ROY, ALOK NANDINI; KATHAWALA, GULZAR; PATEL, ZUBIN; SHIRAIWA, HIDEHIKO
To: SPANSION LLC.
Reel/Frame 018805/0137 →
Assignment of Assignor's Interest
Jan 26, 2007
From: SUH, YOUSEOK; SHIRAIWA, HIDEHIKO; CHANG, KUO-TUNG; XUE, LEI
To: SPANSION LLC
Reel/Frame 018813/0301 →
Assignment of Assignor's Interest
Mar 16, 2007
From: TOM, JOE YUEN; WERNER, JEREMY ISAAC NATHANIEL; BARCK, RUSSELL
To: SPANSION LLC
Reel/Frame 019022/0895 →
Assignment of Assignor's Interest
Mar 23, 2007
From: CAMBOU, BERTRAND F.; GRUPEN-SHEMANSKY, MELISSA; FAI, LAM TIM
To: SPANSION LLC
Reel/Frame 019090/0143 →
Assignment of Assignor's Interest
Dec 10, 2008
From: FUJITSU LIMITED
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 021985/0715 →
Change of Name
Apr 27, 2010
From: FASL LLC
To: SPANSION LLC
Reel/Frame 024294/0032 →
Security Agreement
Jun 4, 2010
From: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY INC.; SPANSION TECHNOLOGY LLC
To: BARCLAYS BANK PLC
Reel/Frame 024522/0338 →
Change of Name
Jul 27, 2010
From: FUJITSU MICROELECTRONICS LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 024794/0500 →
Assignment of Assignor's Interest
Jul 30, 2010
From: ADVANCED MICRO DEVICES, INC.
To: SPANSION INC.
Reel/Frame 024768/0001 →
Security Agreement
Aug 6, 2010
From: SPANSION LLC; SPANSION INC.
To: BARCLAYS BANK PLC
Reel/Frame 024802/0054 →
Patent Purchase Agreement
Mar 28, 2012
From: NANTRONICS SEMICONDUCTOR, INC.
To: SPANSION LLC
Reel/Frame 027946/0448 →
Assignment of Assignor's Interest
Oct 11, 2012
From: SPANSION INC.
To: SPANSION LLC
Reel/Frame 029112/0198 →
Assignment of Assignor's Interest
Sep 11, 2013
From: FUJITSU SEMICONDUCTOR LIMITED
To: SPANSION LLC
Reel/Frame 031205/0461 →
Release of Security Interest
Mar 13, 2015
From: BARCLAYS BANK PLC
To: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY LLC
Reel/Frame 035201/0159 →