Patent Assignment
Reel/Frame 018778/0688
Assignment of Assignor's Interest
Recorded: 2007-01-08
Pages: 4
Assignee
SPANSION LLC
915 DEGUIGNE DRIVE, SUNNYVALE, CALIFORNIA, 94088
Covered Property
(1)
Structure and method for wire bond integrity check on BGA substrates using indirect electrical interconnectivity pathway between wire bonds and ground
Application:
11/650,907 →
Publication:
US 2009/0001573
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Jun 4, 2010
From: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY INC.; SPANSION TECHNOLOGY LLC
To: BARCLAYS BANK PLC
Reel/Frame 024522/0338 →
Release of Security Interest
Mar 13, 2015
From: BARCLAYS BANK PLC
To: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY LLC
Reel/Frame 035201/0159 →
Assignment of Assignor's Interest
Jun 11, 2015
From: SPANSION LLC
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 035890/0678 →